Patents by Inventor Hsiao-Hua CHI

Hsiao-Hua CHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240030821
    Abstract: A novel power supply apparatus (10) includes a microcontroller (102) and a plurality of voltage converters (104). If the voltage converters (104) are in a boost mode and a plurality of duty cycles of the voltage converters (104) calculated by the microcontroller (102) are less than 0.5, the microcontroller (102) is configured to limit at least one of the duty cycles of the voltage converters (104) to 0.5. If the voltage converters (104) are in a buck mode and the duty cycles of the voltage converters (104) calculated by the microcontroller (102) are greater than 0.5, the microcontroller (102) is configured to limit at least one of the duty cycles of the voltage converters (104) to 0.5.
    Type: Application
    Filed: July 25, 2022
    Publication date: January 25, 2024
    Inventors: Lien-Hsing CHEN, Ta-Wen CHANG, Hsiao-Hua CHI, Ching-Ming LAI, Wei-Hsuan LIN
  • Patent number: 11705909
    Abstract: A frequency-locked circuit for a variable frequency topology is configured to trigger a Pulse Width Modulation (PWM) controller to lock a frequency of a driving signal outputted by the PWM controller. The frequency-locked circuit includes an AC wave generating circuit and a comparator. The AC wave generating circuit receives and converts the driving signal to generate an AC wave signal. The comparator is electrically connected to the AC wave generating circuit and receives the AC wave signal. The comparator compares the AC wave signal with a reference signal to generate a comparison output signal. In response to determining that the AC wave signal is greater than the reference signal, the comparison output signal triggers the PWM controller to convert the driving signal from one voltage level to another voltage level so as to lock the frequency. The one voltage level is different from the another voltage level.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: July 18, 2023
    Assignee: P-DUKE TECHNOLOGY CO., LTD.
    Inventors: Tien-Yu Chen, Liang-Jhou Dai, Wei-Sheng Wang, Hsiao-Hua Chi, Lien-Hsing Chen
  • Publication number: 20220199314
    Abstract: A high-insulation multilayer planar transformer (1) includes a pair of iron cores (20) and a circuit board integration (10a). The circuit board integration (10a) is stacked between the iron cores (20) and has a through hole (100a). The circuit board integration (10a) includes a first to a third insulating layers (11a, 12a, 14a) and a first to a second coil windings (13a, 15a). The first and third insulating layers (11a, 14a) include at least two insulating plates (111a, 141a) stacked with each other respectively. The second insulating layer (12a) includes at least one insulating plate (121a). The coil winding (13a, 15a) is disposed between the adjacent insulating layers and surrounds the through hole (100a) planarly. Therefore, the reinforced insulation requirement of safety regulations may be achieved.
    Type: Application
    Filed: December 23, 2020
    Publication date: June 23, 2022
    Inventors: Lien-Hsing CHEN, Hsiao-Hua CHI, Chun-Ping CHANG, Han-Chiang CHEN, Chia-Ti LAI, Yung-Chi CHANG
  • Patent number: 10559418
    Abstract: A method of assembling an inverter structure (1) includes: winding a coil set (12) around a bobbin (11), the bobbin (11) including a first side (11a) and a second side (11b) opposite to each other; inserting a first core pillar (21) of a first iron core (20) into a through hole (110) of the bobbin (11); sequentially placing a first insulation body (30), a middle iron core (40) and a second insulation body (50) into the through hole (110) from a second side (11b) of the bobbin (11); and inserting a second core pillar (61) of a second iron core (60) into the through hole (110) from the second side (11b) of the bobbin (11) and arranging the second core pillar (61) to be in contact with the second insulation body (50).
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: February 11, 2020
    Assignee: P-DUKE TECHNOLOGY CO., LTD.
    Inventors: Chia-Ti Lai, Yung-Chi Chang, Ta-Wen Chang, Hsiao-Hua Chi, Lien-Hsing Chen
  • Publication number: 20180358173
    Abstract: A method of assembling an inverter structure (1) includes: winding a coil set (12) around a bobbin (11), the bobbin (11) including a first side (11a) and a second side (11b) opposite to each other; inserting a first core pillar (21) of a first iron core (20) into a through hole (110) of the bobbin (11); sequentially placing a first insulation body (30), a middle iron core (40) and a second insulation body (50) into the through hole (110) from a second side (11b) of the bobbin (11); and inserting a second core pillar (61) of a second iron core (60) into the through hole (110) from the second side (11b) of the bobbin (11) and arranging the second core pillar (61) to be in contact with the second insulation body (50).
    Type: Application
    Filed: June 7, 2017
    Publication date: December 13, 2018
    Inventors: Chia-Ti LAI, Yung-Chi CHANG, Ta-Wen CHANG, Hsiao-Hua CHI, Lien-Hsin CHEN