Patents by Inventor Hsiao-Hua Peng

Hsiao-Hua Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210327730
    Abstract: A heating platform for heating a wafer is provided. The heating platform includes a support carrier, a detection module and a first heating module. The wafer is supported by the support carrier. The detection module is configured to monitor a surface condition of the wafer supported by the support carrier. The first heating module is disposed at a side of the support carrier. The first heating module includes a plurality of heating units electrically connected to the detection module, and the heating units is arranged in an array. A thermal treatment and a manufacturing method are further provided.
    Type: Application
    Filed: June 30, 2021
    Publication date: October 21, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsiao-Hua Peng, Hann-Ru Chen
  • Publication number: 20210296100
    Abstract: An apparatus for controlling wafer uniformity is disclosed. In one example, the apparatus includes: a plurality of temperature control elements and a processor. Each of the temperature control elements corresponds to a different portion of a wafer respectively such that the temperature control elements correspond to different portions of the wafer. Each of the temperature control elements is configured to individually control temperature of a corresponding portion of the wafer. The processor determines at least one portion of the wafer for temperature uniformity control, and instruct at least one of the temperature control elements, corresponding to the at least one portion, to adjust temperature of the at least one portion for controlling temperature uniformity of the wafer.
    Type: Application
    Filed: June 4, 2021
    Publication date: September 23, 2021
    Inventors: Hsiao-Hua PENG, Hann-Ru CHEN
  • Patent number: 11107708
    Abstract: A heating platform for heating a wafer is provided. The heating platform includes a support carrier, a detection module and a first heating module. The wafer is supported by the support carrier. The detection module is configured to monitor a surface condition of the wafer supported by the support carrier. The first heating module is disposed at a side of the support carrier. The first heating module includes a plurality of heating units electrically connected to the detection module, and the heating units is arranged in an array. A thermal treatment and a manufacturing method are further provided.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: August 31, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsiao-Hua Peng, Hann-Ru Chen
  • Patent number: 11062886
    Abstract: An apparatus for controlling wafer uniformity is disclosed. In one example, the apparatus includes: a plurality of temperature control elements and a processor. Each of the temperature control elements corresponds to a different portion of a wafer respectively such that the temperature control elements correspond to different portions of the wafer. Each of the temperature control elements is configured to individually control temperature of a corresponding portion of the wafer. The processor determines at least one portion of the wafer for temperature uniformity control, and instruct at least one of the temperature control elements, corresponding to the at least one portion, to adjust temperature of the at least one portion for controlling temperature uniformity of the wafer.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: July 13, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsiao-Hua Peng, Hann-Ru Chen
  • Publication number: 20190164852
    Abstract: Disclosed is an in-line processing control method and system. In one embodiment, the n method comprising: conducting a critical dimension (CD) inspection on a first wafer; generating a first CD map of the first wafer; determining a first temperature profile map and a first plasma processing configuration based on the first CD map of the first wafer, wherein the first plasma processing configuration comprises a first temperature profile map, a first etch time and a first plasma processing condition; and configuring a plasma etching process with the first plasma processing configuration for processing the first wafer.
    Type: Application
    Filed: February 23, 2018
    Publication date: May 30, 2019
    Inventors: Hsiao-Hua PENG, Hann-Ru Cheng
  • Publication number: 20190164730
    Abstract: An apparatus for controlling wafer uniformity is disclosed. In one example, the apparatus includes: a plurality of temperature control elements and a processor. Each of the temperature control elements corresponds to a different portion of a wafer respectively such that the temperature control elements correspond to different portions of the wafer. Each of the temperature control elements is configured to individually control temperature of a corresponding portion of the wafer. The processor determines at least one portion of the wafer for temperature uniformity control, and instruct at least one of the temperature control elements, corresponding to the at least one portion, to adjust temperature of the at least one portion for controlling temperature uniformity of the wafer.
    Type: Application
    Filed: February 23, 2018
    Publication date: May 30, 2019
    Inventors: Hsiao-Hua Peng, Hann-Ru Chen
  • Publication number: 20190148185
    Abstract: A heating platform for heating a wafer is provided. The heating platform includes a support carrier, a detection module and a first heating module. The wafer is supported by the support carrier. The detection module is configured to monitor a surface condition of the wafer supported by the support carrier. The first heating module is disposed at a side of the support carrier. The first heating module includes a plurality of heating units electrically connected to the detection module, and the heating units is arranged in an array. A thermal treatment and a manufacturing method are further provided.
    Type: Application
    Filed: January 10, 2018
    Publication date: May 16, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsiao-Hua Peng, Hann-Ru Chen