Abstract: A bonding structure that may be used to form 3D-IC devices is formed using first oblong bonding pads on a first substrate and second oblong bonding pads one a second substrate. The first and second oblong bonding pads are laid crosswise, and the bond is formed. Viewed in a first cross-section, the first bonding pad is wider than the second bonding pad. Viewed in a second cross-section at a right angle to the first, the second bonding pad is wider than the first bonding pad. Making the bonding pads oblong and angling them relative to one another reduces variations in bonding area due to shifts in alignment between the first substrate and the second substrate. The oblong shape in a suitable orientation may also be used to reduce capacitive coupling between one of the bonding pads and nearby wires.

Abstract: A method for liquid phase oxidation of a cycloalkane compound is provided by which the cycloalkane compound intended to be oxidized mixes with water to form an azeotropic mixture, and then an oxygen enriched gas is introduced to perform an oxidation reaction. This method is particularly suitable for liquid phase oxidation of cyclohexane by using an oxygen enriched gas or pure oxygen, which not only enhances conversion rate and selectivity of the cyclohexane oxidation process but also improves process safety in the use of an oxygen enriched gas or pure oxygen for cyclohexane oxidation.

Abstract: A method for liquid phase oxidation of a cycloalkane compound is provided by which the cycloalkane compound intended to be oxidized mixes with water to form an azeotropic mixture, and then an oxygen enriched gas is introduced to perform an oxidation reaction. This method is particularly suitable for liquid phase oxidation of cyclohexane by using an oxygen enriched gas or pure oxygen, which not only enhances conversion rate and selectivity of the cyclohexane oxidation process but also improves process safety in the use of an oxygen enriched gas or pure oxygen for cyclohexane oxidation.