Patents by Inventor Hsiao-Ken Chuang

Hsiao-Ken Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140312501
    Abstract: Structures and manufacturing processes of an ACF array using a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles onto a substrate or carrier web comprising a predetermined array of microcavities, of selective metallization of the array followed by filling the array with a filler material and a second selective metallization on the filled microcavity array. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film. Cavities in the array, and particles filling the cavities, can have a unimodal, bimodal, or multimodal distribution.
    Type: Application
    Filed: May 20, 2014
    Publication date: October 23, 2014
    Applicant: TRILLION SCIENCE INC.
    Inventors: Rong-Chang Liang, Hsiao-Ken Chuang, Jerry Chung, Chin-Jen Tseng, Shuji Rokutanda, Yuhao Sun
  • Patent number: 8802214
    Abstract: Structures and manufacturing processes of an ACF array using a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles onto a substrate or carrier web comprising a predetermined array of microcavities, or selective metallization of the array followed by filling the array with a filler material and a second selective metallization on the filled microcavity array. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film. Cavities in the array, and particles filling the cavities, can have a unimodal, bimodal, or multimodal distribution.
    Type: Grant
    Filed: October 29, 2009
    Date of Patent: August 12, 2014
    Assignee: Trillion Science, Inc.
    Inventors: Rong-Chang Liang, Jerry Chung, Chinjen Tseng, Shuji Rokutanda, Yuhao Sun, Hsiao-Ken Chuang
  • Patent number: 8551391
    Abstract: A method of making a microneedle array structure (20) comprising a plurality of simultaneously formed microneedles (24), each microneedle (24) having a protrusion (32) and a passageway (34) extending therethrough. The method comprises the steps of pressing an embossable sheet material between a complimentary tools and radiantly heating the sheet material using radiant energy from a radiant energy source. One tool is relatively-radiantly-transparent, and another tool and/or the sheet material is relatively-radiantly-absorptive.
    Type: Grant
    Filed: February 3, 2005
    Date of Patent: October 8, 2013
    Assignee: Avery Dennison Corporation
    Inventors: Eng-Pi Chang, Philip Yi Zhi Chu, Hsiao Ken Chuang, Kejian (Kevin) Huang, Michael Lang, Reza Mehrabi, Ronald F. Sieloff, Karen L. Spilizewski, Mark Wisniewski
  • Publication number: 20110253943
    Abstract: An adhesive composition comprising: (i) a one part curable epoxy adhesive and (ii) a low profile additive (LPA), the low profile additive being a polymer that is compatible with the epoxy adhesive such that it forms a single phase when admixed with the adhesive composition and that separates from the adhesive to form a network of stress-absorbing nodules therein when the adhesive is cured, the low profile additive being present in an amount sufficient to prevent or reduce shrinkage and/or the formation of voids or cracks when the adhesive is cured. In one embodiment the LPA is a block copolymer including at least one flexible block and at least one rigid block that makes the low profile additive compatible with the epoxy adhesive such that a mixture of the uncured epoxy resin and the low profile additive forms a homogenous solution and as the epoxy resin is cured, the low profile additive forms a stress absorbing network of nodules in the cured epoxy resin matrix.
    Type: Application
    Filed: April 19, 2010
    Publication date: October 20, 2011
    Applicant: TRILLION SCIENCE, INC.
    Inventors: Rong-Chang Liang, Yuhao Sun, Hua Song, Chin-Jen Tseng, Hsiao Ken Chuang
  • Publication number: 20100101700
    Abstract: Structures and manufacturing processes of an ACF array using a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles onto a substrate or carrier web comprising a predetermined array of microcavities, or selective metallization of the array followed by filling the array with a filler material and a second selective metallization on the filled microcavity array. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film. Cavities in the array, and particles filling the cavities, can have a unimodal, bimodal, or multimodal distribution.
    Type: Application
    Filed: October 29, 2009
    Publication date: April 29, 2010
    Applicant: Trillion Science Inc.
    Inventors: Rong-Chang Liang, Jerry Chung, Chinjen Tseng, Shuji Rokutanda, Yuhao Sun, Hsiao-Ken Chuang
  • Patent number: 7416692
    Abstract: A method of embossing a sheet material includes: heating at least a portion of the sheet directly or indirectly with radiant energy from a radiant energy source; pressing a tool against the heated portion of the sheet, thereby patterning a surface of the sheet; and separating the sheet and the tool. The radiant energy may travel through a solid material that is relatively transparent to radiation, on its way to being absorbed by a relatively-absorptive material. The relatively-transparent material may be an unheated portion of the sheet, and the relatively-absorptive material may be either the tool or the heated portion of the sheet. Alternatively, the relatively-transparent material may be the tool, and the relatively-absorptive material may be all or part of the sheet. The method may be performed as one or more roll-to-roll operations.
    Type: Grant
    Filed: January 31, 2005
    Date of Patent: August 26, 2008
    Assignee: Avery Dennison Corporation
    Inventors: Rishikash K. Bharadwai, Eng-Pi Chang, Philip Yi Zhi Chu, Hsiao Ken Chuang, David N. Edwards, Robert J. Fermin, Ali R. Mehrabi, Reza Mehrabi, Ronald F. Sieloff, Chunhwa Wang
  • Patent number: 6947202
    Abstract: This invention relates to an electrophoretic display comprising isolated cells of well-defined shape, size and aspect ratio which cells have internal sub relief structures and are filled with charged pigment particles dispersed in a dielectric solvent. The display shows an improved contrast ratio and resistance against shear and compression pressures. The display may have the traditional up/down switching mode, an in-plane switching mode or a dual switching mode.
    Type: Grant
    Filed: May 20, 2004
    Date of Patent: September 20, 2005
    Assignee: SiPix Imaging, Inc.
    Inventors: Rong-Chang Liang, Abbas Hosseini, Hsiao-Ken Chuang
  • Publication number: 20050007651
    Abstract: This invention relates to an electrophoretic display comprising isolated cells of well-defined shape, size and aspect ratio which cells have internal sub relief structures and are filled with charged pigment particles dispersed in a dielectric solvent. The display shows an improved contrast ratio and resistance against shear and compression pressures. The display may have the traditional up/down switching mode, an in-plane switching mode or a dual switching mode.
    Type: Application
    Filed: May 20, 2004
    Publication date: January 13, 2005
    Inventors: Rong-Chang Liang, Abbas Hosseini, Hsiao-Ken Chuang
  • Patent number: 6795229
    Abstract: This invention relates to an electrophoretic display comprising isolated cells of well-defined shape, size and aspect ratio which cells have internal sub relief structures and are filled with charged pigment particles dispersed in a dielectric solvent. The display shows an improved contrast ratio and resistance against shear and compression pressures. The display may have the traditional up/down switching mode, an in-plane switching mode or a dual switching mode.
    Type: Grant
    Filed: August 27, 2002
    Date of Patent: September 21, 2004
    Assignee: SiPix Imaging, Inc.
    Inventors: Rong-Chang Liang, Abbas Hosseini, Hsiao-Ken Chuang
  • Patent number: 6788449
    Abstract: This invention relates to an electrophoretic display comprising cells of well-defined shape, size and aspect ratio which cells are filled with charged pigment particles dispersed in a solvent, and novel processes for its manufacture.
    Type: Grant
    Filed: August 29, 2001
    Date of Patent: September 7, 2004
    Assignee: SiPix Imaging, Inc.
    Inventors: Rong-Chang Liang, Scott C-J Tseng, Zarng-Arh George Wu, HongMei Zang, Hsiao-Ken Chuang
  • Publication number: 20040130057
    Abstract: A method of embossing a sheet material includes: heating at least a portion of the sheet directly or indirectly with radiant energy from a radiant energy source; pressing a tool against the heated portion of the sheet, thereby patterning a surface of the sheet; and separating the sheet and the tool. The radiant energy may travel through a solid material that is relatively transparent to radiation, on its way to being absorbed by a relatively-absorptive material. The relatively-transparent material may be an unheated portion of the sheet, and the relatively-absorptive material may be either the tool or the heated portion of the sheet. Alternatively, the relatively-transparent material may be the tool, and the relatively-absorptive material may be all or part of the sheet. The method may be performed as one or more roll-to-roll operations.
    Type: Application
    Filed: August 4, 2003
    Publication date: July 8, 2004
    Inventors: Reza Mehrabi, David N. Edwards, Robert J. Fermin, Ali R. Mehrabi, Chunhwa Wang, Rishikesh K. Bharadwaj, Ronald F. Sieloff, Hsiao Ken Chuang, Dennis I. Couzin, Karen L. Spilizewski, William J. Buttermore, Donald J. Davis, Christopher P. Frank, Barbara B. Hyde, Michael F. Lang, Keith A. Lutz, Austin E. Short, Mark Wisniewski
  • Publication number: 20030178221
    Abstract: An anisotropically conductive structure for providing electrical interconnection between electronic components, and the process for making such anisotropically conductive structure. The anisotropically conductive structure includes a dielectric matrix having a substantially uniform thickness; and a plurality of conductive elements embedded in the dielectric matrix.
    Type: Application
    Filed: February 20, 2003
    Publication date: September 25, 2003
    Inventors: Cindy Chia-Wen Chiu, Hsiao Ken Chuang
  • Publication number: 20030155656
    Abstract: An anisotropically conductive structure for providing electrical interconnection between electronic components, and the process for making such anisotropically conductive structure. The anisotropically conductive structure includes a dielectric matrix having a substantially uniform thickness; an array of vias extending into or through the matrix; a plurality of conductive elements, wherein individual via contains at least one conductive element; a first adhesive layer adhered to the first major surface of the matrix; and optionally, a second adhesive layer adhered to the second major surface of the matrix.
    Type: Application
    Filed: January 17, 2003
    Publication date: August 21, 2003
    Inventors: Cindy Chia-Wen Chiu, David Hsein-Pin Chen, Philip Yi Zhi Chu, Hsiao Ken Chuang, H. Paul Barker
  • Publication number: 20030134033
    Abstract: The present invention is directed generally to methods and apparatus for the efficient identification of components, formulations and materials produced therefrom. More particularly, the invention relates to automated apparatus and associated methods of utilizing arrays of materials for expeditious screening, testing, identification and optimization of formulations of materials and application parameters that provide novel materials having desired physical characteristics.
    Type: Application
    Filed: October 2, 2002
    Publication date: July 17, 2003
    Applicant: Avery Dennison Corporation
    Inventors: Daniel L. Holguin, Jay Akhave, Hsiao Ken Chuang, Jessie Reaves, Carol A. Koch, Ali Mehrabi, Mark Licon, Dennis Saunders
  • Publication number: 20030043450
    Abstract: This invention relates to an electrophoretic display comprising isolated cells of well-defined shape, size and aspect ratio which cells have internal sub relief structures and are filled with charged pigment particles dispersed in a dielectric solvent. The display shows an improved contrast ratio and resistance against shear and compression pressures. The display may have the traditional up/down switching mode, an in-plane switching mode or a dual switching mode.
    Type: Application
    Filed: August 27, 2002
    Publication date: March 6, 2003
    Inventors: Rong-Chang Liang, Abbas Hosseini, Hsiao-Ken Chuang
  • Patent number: 6423392
    Abstract: PSAs and PSA constructions, such as self-adhesive labels, are provided, and exhibit good slittability and reduced adhesive build-up in printers, including laser printers. In one embodiment, a PSA has a storage modulus at 1000 radians/s and 25° C. of about 5×106 dyne/cm2 or higher and a creep at 90° C. of about 125 or less. In one embodiment, the PSA is the polymerization product of a plurality of acrylic and other monomers.
    Type: Grant
    Filed: December 15, 1999
    Date of Patent: July 23, 2002
    Assignee: Avery Dennison Corporation
    Inventors: Carol A. Koch, Alfred J. Chompff, Hsiao Ken Chuang
  • Publication number: 20020075556
    Abstract: This invention relates to an electrophoretic display comprising cells of well-defined shape, size and aspect ratio which cells are filled with charged pigment particles dispersed in a solvent, and novel processes for its manufacture.
    Type: Application
    Filed: August 29, 2001
    Publication date: June 20, 2002
    Inventors: Rong-Chang Liang, Scott C-J. Tseng, Zarng-Arh George Wu, HongMei Zang, Hsiao-Ken Chuang