Abstract: The present invention provides water atomized copper powder comprising substantially irregular shaped copper particles having at least a median D50 particle size of from about 10 ?m to about 50 ?m. The powders of the present invention are suitable for use in electrically conductive compositions, such as copper-based adhesives. The present invention also provides methods of making these copper powders.

Abstract: The present invention provides water atomized copper powder comprising substantially irregular shaped copper particles having at least a median D50 particle size of from about 10 &mgr;m to about 50 &mgr;m. The powders of the present invention are suitable for use in electrically conductive compositions, such as copper-based adhesives. The present invention also provides methods of making these copper powders.

Abstract: A metallic powder having a core of silver and an outer layer of platinum wherein the silver is from about 90 to about 99.5% by weight of the total composition. A process for producing such a powder comprising forming a first aqueous slurry of silver powder, an appropriate amount of lignosulfonate ammonia and water, forming a second slurry of platinum as a platinum-ammonium complex dispersed in a water soluble alkanol, mixing the first and second slurry, adjusting the pH of the mixture to a range of from about 8 to about 10, adding an appropriate amount of hydrazine to the mixture maintaining the resultant slurry at about 40.degree. C. to 60.degree. C. for an appropriate time to coat the platinum onto the silver, then separating the platinum-coated silver powder from the remainder of the slurry.