Patents by Inventor Hsiao-Lin Kuo

Hsiao-Lin Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Insulated structure of a chip array component and fabrication method of the same
    Patent number: 7135415
    Abstract: An insulated structure of a chip array component and fabrication method of the same, the element is fabricated by enclosing its main body with a dense layer of high surface insulation resistance material, and then exposing the portions of the main body where terminal electrodes are to be formed by removing the dense layer of high surface insulation resistance material by employing sand blasting, laser trimming, grinding, or etching process.
    Type: Grant
    Filed: July 23, 2004
    Date of Patent: November 14, 2006
    Assignee: Inpaq Technology Co., Ltd.
    Inventors: Hsiao-Lin Kuo, Ching-Chien Chen, Kwo-Fang Ku, Yu-Chin Hsu
  • Insulated structure of a chip array component and fabrication method of the same
    Publication number: 20060017179
    Abstract: An insulated structure of a chip array component and fabrication method of the same, the element is fabricated by enclosing its main body with a dense layer of high surface insulation resistance material, and then exposing the portions of the main body where terminal electrodes are to be formed by removing the dense layer of high surface insulation resistance material by employing sand blasting, laser trimming, grinding, or etching process.
    Type: Application
    Filed: July 23, 2004
    Publication date: January 26, 2006
    Inventors: Hsiao-Lin Kuo, Ching-Chien Chen, Kwo-Fang Ku, Yu-Chin Hsu