Patents by Inventor Hsiao Lu
Hsiao Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240105849Abstract: A method for forming a semiconductor structure is provided. The method for forming the semiconductor structure includes forming a fin structure over a substrate in a first direction, forming a first gate stack, a second gate stack and a third gate stack across the fin structure, removing the first gate stack to form a trench, depositing a cutting structure in the trench, and forming a first contact plug between the cutting structure and the second gate stack and a second contact plug between the second gate stack and the third gate stack. The fin structure is cut into two segments by the trench. A first dimension of the first contact plug in the first direction is greater than a second dimension of the second contact plug in the first direction.Type: ApplicationFiled: February 10, 2023Publication date: March 28, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Da-Zhi ZHANG, Chun-An LU, Chung-Yu CHIANG, Po-Nien CHEN, Hsiao-Han LIU, Jhon-Jhy LIAW, Chih-Yung LIN
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Publication number: 20240076307Abstract: Provided are compounds of Formula Ir(LA)x(LC)y wherein: ligand LA has Formula I? ?and ligand LC has Formula II?Type: ApplicationFiled: October 10, 2023Publication date: March 7, 2024Applicant: Universal Display CorporationInventors: Wei-Chun SHIH, Zhiqiang JI, Pierre-Luc T. BOUDREAULT, Hsiao-Fan CHEN, Tongxiang LU
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Publication number: 20240072033Abstract: A bonding and transferring method for die package structures is provided, including providing a die package structure which has a positioning adhesive disposed thereon, and providing a vibration base having at least one cavity corresponding to the positioning adhesive. By alignment of the positioning adhesive and the cavity, the die package structure can be positioned into the vibration base. A target substrate is further provided and bonded with the vibration base having the die package structure disposed thereon through a metal material. And a laser process is then performed to melt the metal material. At last, the vibration base and the positioning adhesive are removed so the die package structure is successfully bonded and transferred onto the target substrate. By employing the proposed process method of the present invention, rapid mass transfer result is accomplished, and the packaging yield of vertical light emitting diode die package structures is optimized.Type: ApplicationFiled: February 7, 2023Publication date: February 29, 2024Applicant: Ingentec CorporationInventors: Hsiao Lu Chen, AI SEN LIU, HSIANG AN FENG, YA LI CHEN
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Publication number: 20240072013Abstract: A vertical light emitting diode die packaging method is provided, including a plurality of following steps. At first, a plurality of drill hole is formed in a substrate and a first metal material is used to fill the drill holes. Next, disposing and fixing a plurality of vertical light emitting diode die on the substrate through a second metal material, and a transparent glue is used to cover thereon. A laser process is then employed to dissolve the transparent glue for forming ditches. And, a conductive liquid is applied to fill the ditches and an insulating glue is provided to embrace and encapsulate the vertical light emitting diode dies. By employing the packaging method of the present invention, the current external wire bonding process can be effectively replaced, thereby die size miniaturization as well as packaging yield of the vertical light emitting diode dies are believed to be optimized.Type: ApplicationFiled: February 7, 2023Publication date: February 29, 2024Applicant: Ingentec CorporationInventors: HSIAO LU CHEN, AI SEN LIU, HSIANG AN FENG
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Publication number: 20240071872Abstract: A via-filling method of a TGV substrate includes steps: filling a plurality of metal balls into a plurality of vias of the TGV substrate; using a heating process to melt the plurality of metal balls to form a liquid-state metal; and cooling down the liquid-state metal to form a solid-state metal inside the plurality of vias. Because the method needn't use solvents or fluxes, the solid-state metal inside the plurality of vias have better electric conductivity.Type: ApplicationFiled: February 7, 2023Publication date: February 29, 2024Applicant: Ingentec CorporationInventors: Hsiao Lu Chen, AI SEN LIU, HSIANG AN FENG, YA LI CHEN
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Publication number: 20240006557Abstract: An LED circuit board structure includes first color LEDs, second color LEDs, third color LEDs, integrated circuit chips, a carrier board, first P-type pads, first color pads, first testing wires and first connecting wires. One of the first P-type pads is disposed at a pixel-front-side-pattern region for mounting a first P-type electrode. One of the first color pads is disposed at the pixel-front-side-pattern region for mounting a first pin of the integrated circuit chip. The first color pad electrically connects to the first P-type pad. A first testing wire is disposed at the pixel-front-side-pattern region and extends from the first P-type pad or the first color pad. The first connecting wire electrically connects two first testing wires in adjacent two pixel-front-side-pattern regions in parallel.Type: ApplicationFiled: November 21, 2022Publication date: January 4, 2024Inventors: Yi-Chuan HUANG, Hsiao-Lu CHEN, Ai-Sen LIU
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Publication number: 20240008170Abstract: An LED circuit board structure includes first color LEDs, second color LEDs, third color LEDs, a carrier board, first testing wires, first connecting wires, second testing wires and second connecting wires. Each of the first testing wire is located at the carrier board and electrically connects two first color LEDs in a pixel-front-side-pattern region in parallel. The first connecting wire electrically connects two first testing wires in adjacent two pixel-front-side-pattern regions. Each of the second testing wire is located at the carrier board and electrically connects two second color LEDs in a pixel-front-side-pattern region in parallel. The second connecting wire electrically connects two second testing wires in adjacent two pixel-front-side-pattern regions.Type: ApplicationFiled: September 16, 2022Publication date: January 4, 2024Inventors: Yi-Chuan HUANG, Hsiao-Lu CHEN, Ai-Sen LIU
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Publication number: 20230369296Abstract: A magnetic LED die transferring device includes a substrate, a plurality of magnetic members and a vibrating mechanism. The substrate includes a plurality of die locating areas arranged in intervals, and each of the die locating areas includes a locating surface. Each of the magnetic members corresponds to each of the die locating areas and includes an alignment N-pole and an alignment S-pole. The vibrating mechanism is coupled to the substrate. The N-pole and the S-pole of each of the magnetic LED dice are used to be attracted by each of the alignment N-poles and each of the alignment S-poles, respectively, to allow each of the magnetic LED dice to be transferred and aligned to each of the die locating areas.Type: ApplicationFiled: March 26, 2023Publication date: November 16, 2023Inventors: Ai-Sen LIU, Hsiao-Lu CHEN, Yi-Chuan HUANG, Hsiang-An FENG
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Publication number: 20230170434Abstract: A method for fabricating a vertical light-emitting diode includes: providing a growth substrate, wherein an epitaxial layer is formed on the growth substrate; forming a metal combined substrate on the epitaxial layer, wherein the metal combined substrate comprises two first metal layers and a second metal layer therebetween, one of the first metal layers is close to the epitaxial layer, and another of the first metal layers is far away from the epitaxial layer; removing the growth substrate; forming a contact metal layer on the epitaxial layer; and removing the second metal layer and the first metal layer far away from the epitaxial layer and leaving the first metal layer close to the epitaxial layer. The vertical light-emitting diode, fabricated by the method, has a thinner thickness, a stronger mechanical strength, a higher light intensity, and a better heat-dissipating effect.Type: ApplicationFiled: June 28, 2022Publication date: June 1, 2023Inventors: AI SEN LIU, HSIANG AN FENG, HSIAO LU CHEN, YI CHUAN HUANG
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Patent number: 11363729Abstract: A protective enclosure for an electronic device includes a first case portion that may be adapted to surround at least a portion of a top device portion and a second case portion that may be adapted to surround at least a portion of a bottom device portion. The protective enclosure may also include a first hinge member coupled to a portion of the first case portion and a portion of the second case portion, and the first hinge member may pivot about a first hinge axis that is coaxially aligned with or parallel to a device hinge axis.Type: GrantFiled: March 19, 2021Date of Patent: June 14, 2022Assignee: Otter Products, LLCInventors: Ryan J. Cavenagh, Jeremy L. Dennis, Cameron D. Magness, Lucas B. Weller, Hsiao Lu Sun
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Patent number: 11147174Abstract: A protective enclosure for an electronic device includes a first case portion that may be adapted to surround at least a portion of a top device portion and a second case portion that may be adapted to surround at least a portion of a bottom device portion. The protective enclosure may also include a first hinge member coupled to a portion of the first case portion and a portion of the second case portion, and the first hinge member may pivot about a first hinge axis that is coaxially aligned with or parallel to a device hinge axis.Type: GrantFiled: October 6, 2020Date of Patent: October 12, 2021Assignee: Otter Products, LLCInventors: Ryan J. Cavenagh, Jeremy L. Dennis, Cameron D. Magness, Lucas B. Weller, Hsiao Lu Sun
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Publication number: 20210244144Abstract: A protective enclosure for an electronic device includes a first case portion that may be adapted to surround at least a portion of a top device portion and a second case portion that may be adapted to surround at least a portion of a bottom device portion. The protective enclosure may also include a first hinge member coupled to a portion of the first case portion and a portion of the second case portion, and the first hinge member may pivot about a first hinge axis that is coaxially aligned with or parallel to a device hinge axis.Type: ApplicationFiled: March 19, 2021Publication date: August 12, 2021Inventors: Ryan J. Cavenagh, Jeremy L. Dennis, Cameron D. Magness, Lucas B. Weller, Hsiao Lu Sun
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Publication number: 20210022260Abstract: A protective enclosure for an electronic device includes a first case portion that may be adapted to surround at least a portion of a top device portion and a second case portion that may be adapted to surround at least a portion of a bottom device portion. The protective enclosure may also include a first hinge member coupled to a portion of the first case portion and a portion of the second case portion, and the first hinge member may pivot about a first hinge axis that is coaxially aligned with or parallel to a device hinge axis.Type: ApplicationFiled: October 6, 2020Publication date: January 21, 2021Inventors: Ryan J. Cavenagh, Jeremy L. Dennis, Cameron D. Magness, Lucas B. Weller, Hsiao Lu Sun
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Patent number: 10849241Abstract: A protective enclosure for an electronic device includes a first case portion that may be adapted to surround at least a portion of a top device portion and a second case portion that may be adapted to surround at least a portion of a bottom device portion. The protective enclosure may also include a first hinge member coupled to a portion of the first case portion and a portion of the second case portion, and the first hinge member may pivot about a first hinge axis that is coaxially aligned with or parallel to a device hinge axis.Type: GrantFiled: October 18, 2019Date of Patent: November 24, 2020Inventors: Ryan J. Cavenagh, Jeremy L. Dennis, Cameron D. Magness, Lucas B. Weller, Hsiao Lu Sun
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Publication number: 20200053892Abstract: A protective enclosure for an electronic device includes a first case portion that may be adapted to surround at least a portion of a top device portion and a second case portion that may be adapted to surround at least a portion of a bottom device portion. The protective enclosure may also include a first hinge member coupled to a portion of the first case portion and a portion of the second case portion, and the first hinge member may pivot about a first hinge axis that is coaxially aligned with or parallel to a device hinge axis.Type: ApplicationFiled: October 18, 2019Publication date: February 13, 2020Inventors: Ryan J. Cavenagh, Jeremy L. Dennis, Cameron D. Magness, Lucas B. Weller, Hsiao Lu Sun
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Patent number: 10492318Abstract: A protective enclosure for an electronic device includes a first case portion that may be adapted to surround at least a portion of a top device portion and a second case portion that may be adapted to surround at least a portion of a bottom device portion. The protective enclosure may also include a first hinge member coupled to a portion of the first case portion and a portion of the second case portion, and the first hinge member may pivot about a first hinge axis that is coaxially aligned with or parallel to a device hinge axis.Type: GrantFiled: April 3, 2019Date of Patent: November 26, 2019Assignee: Otter Products, LLCInventors: Ryan J. Cavenagh, Jeremy L. Dennis, Cameron D. Magness, Lucas B. Weller, Hsiao Lu Sun
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Publication number: 20190230805Abstract: A protective enclosure for an electronic device includes a first case portion that may be adapted to surround at least a portion of a top device portion and a second case portion that may be adapted to surround at least a portion of a bottom device portion. The protective enclosure may also include a first hinge member coupled to a portion of the first case portion and a portion of the second case portion, and the first hinge member may pivot about a first hinge axis that is coaxially aligned with or parallel to a device hinge axis.Type: ApplicationFiled: April 3, 2019Publication date: July 25, 2019Inventors: Ryan J. Cavenagh, Jeremy L. Dennis, Cameron D. Magness, Lucas B. Weller, Hsiao Lu Sun
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Patent number: 10314185Abstract: A protective enclosure for an electronic device includes a first case portion that may be adapted to surround at least a portion of a top device portion and a second case portion that may be adapted to surround at least a portion of a bottom device portion. The protective enclosure may also include a first hinge member coupled to a portion of the first case portion and a portion of the second case portion, and the first hinge member may pivot about a first hinge axis that is coaxially aligned with or parallel to a device hinge axis.Type: GrantFiled: June 8, 2018Date of Patent: June 4, 2019Assignee: Otter Products, LLCInventors: Ryan J. Cavenagh, Jeremy L. Dennis, Cameron D. Magness, Lucas B. Weller, Hsiao Lu Sun
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Patent number: 10292285Abstract: A protective enclosure for an electronic device includes a first case portion that may be adapted to surround at least a portion of a top device portion and a second case portion that may be adapted to surround at least a portion of a bottom device portion. The protective enclosure may also include a first hinge member coupled to a portion of the first case portion and a portion of the second case portion, and the first hinge member may pivot about a first hinge axis that is coaxially aligned with or parallel to a device hinge axis.Type: GrantFiled: August 21, 2018Date of Patent: May 14, 2019Assignee: Otter Products, LLCInventors: Ryan J. Cavenagh, Jeremy L. Dennis, Cameron D. Magness, Lucas B. Weller, Hsiao Lu Sun
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Patent number: D845943Type: GrantFiled: March 17, 2017Date of Patent: April 16, 2019Assignee: Otter Products, LLCInventors: Patrick G. Skovsted, Hsiao Lu Sun, Jeremy L. Dennis