Patents by Inventor Hsiao-Min CHEN

Hsiao-Min CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICES
    Publication number: 20240395609
    Abstract: In a method of manufacturing a semiconductor device, a first dielectric layer is formed over a substrate, an adhesion enhancement layer is formed on a surface of the first dielectric layer, and a second dielectric layer is formed on the adhesion enhancement layer.
    Type: Application
    Filed: July 31, 2024
    Publication date: November 28, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsiao-Min CHEN, Jyh-Nan LIN, Kai-Shiung HSU, Ding-I LIU
  • Method of manufacturing semiconductor device and semiconductor devices
    Patent number: 12148656
    Abstract: In a method of manufacturing a semiconductor device, a first dielectric layer is formed over a substrate, an adhesion enhancement layer is formed on a surface of the first dielectric layer, and a second dielectric layer is formed on the adhesion enhancement layer.
    Type: Grant
    Filed: May 2, 2022
    Date of Patent: November 19, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsiao-Min Chen, Jyh-Nan Lin, Kai-Shiung Hsu, Ding-I Liu
  • METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICES
    Publication number: 20220262677
    Abstract: In a method of manufacturing a semiconductor device, a first dielectric layer is formed over a substrate, an adhesion enhancement layer is formed on a surface of the first dielectric layer, and a second dielectric layer is formed on the adhesion enhancement layer.
    Type: Application
    Filed: May 2, 2022
    Publication date: August 18, 2022
    Inventors: Hsiao-Min CHEN, Jyh-Nan LIN, Kai-Shiung HSU, Ding-I LIU
  • Method of manufacturing semiconductor devices including formation of adhesion enhancement layer
    Patent number: 11322397
    Abstract: In a method of manufacturing a semiconductor device, a first dielectric layer is formed over a substrate, an adhesion enhancement layer is formed on a surface of the first dielectric layer, and a second dielectric layer is formed on the adhesion enhancement layer.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: May 3, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsiao-Min Chen, Jyh-Nan Lin, Kai-Shiung Hsu, Ding-I Liu
  • METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICES
    Publication number: 20200135553
    Abstract: In a method of manufacturing a semiconductor device, a first dielectric layer is formed over a substrate, an adhesion enhancement layer is formed on a surface of the first dielectric layer, and a second dielectric layer is formed on the adhesion enhancement layer.
    Type: Application
    Filed: October 25, 2019
    Publication date: April 30, 2020
    Inventors: Hsiao-Min CHEN, Jyh-Nan LIN, Kai-Shiung HSU, Ding-I LIU
  • Methods for managing radio resources between multiple radio modules and communications apparatus utilizing the same
    Patent number: 9532272
    Abstract: Communications apparatus includes first and second radio modules and an antenna array coupled to the first and the second radio modules and includes multiple antennas. When the first and the second radio modules operate at the same time, the first radio module negotiates with a first communications device an amount of antenna(s) to be used by a first message, so that the first radio module operates with the amount of the antenna(s) and second radio module operates with at least one of the remaining antenna(s).
    Type: Grant
    Filed: April 2, 2013
    Date of Patent: December 27, 2016
    Assignee: MEDIATEK INC.
    Inventors: Ching-Hwa Yu, Shao-Wei Chen, Chia-Shun Wan, Tsai-Yuan Hsu, Chia-Hsiang Hsu, Shih-Chang Su, Chih-Shi Yee, Chieh-Chao Liu, Hsiao-Min Chen
  • METHODS FOR MANAGING RADIO RESOURCES BETWEEN MULTIPLE RADIO MODULES AND COMMUNICATIONS APPARATUS UTILIZING THE SAME
    Publication number: 20150181469
    Abstract: Communications apparatus includes first and second radio modules and an antenna array coupled to the first and the second radio modules and includes multiple antennas. When the first and the second radio modules operate at the same time, the first radio module negotiates with a first communications device an amount of antenna(s) to be used by a first message, so that the first radio module operates with the amount of the antenna(s) and second radio module operates with at least one of the remaining antenna(s).
    Type: Application
    Filed: April 2, 2013
    Publication date: June 25, 2015
    Inventors: Ching-Hwa Yu, Shao-Wei Chen, Chia-Shun Wan, Tsai-Yuan Hsu, Chia-Hsiang Hsu, Shih-Chang Su, Chih-Shi Yee, Chieh-Chao Liu, Hsiao-Min Chen
  • DYNAMICALLY SELECTING FILTERING PATHS TO AVOID MULTI-RADIO COEXISTENCE INTERFERENCE IN A COMMUNICATION APPARATUS
    Publication number: 20140194155
    Abstract: A communication apparatus includes a first wireless module and a second wireless module. The first wireless module includes a communication device, an antenna module and a filter module. The filter module is coupled between the communication device and the antenna module and includes a first filter, a second filter, a first switch switching in response to a control signal, and a second switch switching in response to the control signal. The communication device includes a processor issuing the control signal according to a radio frequency utilized by the second wireless module to select the first filter or the second filter to electronically connect to the communication device and the antenna module.
    Type: Application
    Filed: October 31, 2013
    Publication date: July 10, 2014
    Applicant: MediaTek Inc.
    Inventors: Li-Chun KO, Chun-Jen TSAI, Chia-Hsiang HSU, Hao-Hua KANG, Tzu-Wei HAN, Yu-Ching LIU, Hsiao-Min CHEN, Jian-Hsiung LIAO