Patents by Inventor Hsiao-Min Wu

Hsiao-Min Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12213303
    Abstract: The present disclosure provides a semiconductor device and a fabricating method thereof, and which includes a substrate, bit lines, bit line contacts, a gate structure, a first oxidized interface layer, and a second oxidized interface layer. The bit lines are disposed on the substrate, and the bit line contacts are disposed below the bit lines. The gate structure is disposed on the substrate, wherein each bit line and the gate structure respectively include a semiconductor layer, a conductive layer, and a covering layer stacked from bottom to top. The first oxidized interface layer is disposed between each bit line contact and the semiconductor layer of each bit line. The second oxidized interface layer is disposed within the semiconductor layer of the gate structure, wherein a topmost surface of the first oxidized interface layer is higher than a topmost surface of the second oxidized interface layer.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: January 28, 2025
    Assignee: Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Yukihiro Nagai, Lu-Yung Lin, Chia-Wei Wu, Tsun-Min Cheng, Yu Chun Lin, Zheng Guo Zhang, Sun-Hung Chen, Wu Xiang Li, Hsiao-Han Lin
  • Patent number: 10800949
    Abstract: Conductive carbon adhesive is an active technology researched in the world, and its application is quite wide, such as liquid crystal display (TFTLCD), organic light emitting diode (OLED), radio frequency identification system (RFID), antenna, solar cell, sensing and electronic components for devices. Since the two-dimensional carbon material used for the conductive carbon adhesive is easily stacked and agglomerated in the polymer, the present invention adds nano-fillers to the carbon material to prepare a three-dimensional conductive carbon adhesive to prevent carbon material agglomeration.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: October 13, 2020
    Assignee: National Chung-Shan Institute of Science and Technology
    Inventors: Hsiao-Min Wu, Chien-Liang Chang, Kuei-Ting Hsu, Wei-Jen Liu, Chia-Hsin Zhang
  • Publication number: 20200317965
    Abstract: Conductive carbon adhesive is an active technology researched in the world, and its application is quite wide, such as liquid crystal display (TFTLCD), organic light emitting diode (OLED), radio frequency identification system (RFID), antenna, solar cell, sensing and electronic components for devices. Since the two-dimensional carbon material used for the conductive carbon adhesive is easily stacked and agglomerated in the polymer, the present invention adds nano-fillers to the carbon material to prepare a three-dimensional conductive carbon adhesive to prevent carbon material agglomeration.
    Type: Application
    Filed: April 2, 2019
    Publication date: October 8, 2020
    Inventors: Hsiao-Min Wu, Chien-Liang Chang, Kuei-Ting Hsu, Wei-Jen Liu, Chia-Hsin Zhang