Patents by Inventor Hsiao-Ning WANG

Hsiao-Ning WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210208273
    Abstract: A blind spot detection system with speed detection function and device and method thereof are provided. The system is disposed on the rear portion of the vehicle, and includes a signal transceiving module and a central processing unit. The central processing unit includes a speed calculation module and an object detection module. The device includes a main body in which the signal transceiving module is disposed. A first signal is sent toward a detection area behind the vehicle for acquiring a second signal for blind spot detection. By calculation based on the second signal, a third signal is acquired for identifying the static and moving objects, and the relative speed between the vehicle and the static object is determined as the speed of the vehicle. Therefore, the blind spot detection system has a speed detection function.
    Type: Application
    Filed: October 1, 2020
    Publication date: July 8, 2021
    Inventors: SAN-CHUAN YU, HSIAO-NING WANG, YA-LING CHI, CHUN-JIE HSU, TE-YU LU
  • Patent number: 10431895
    Abstract: A dual slot SIW antenna unit includes a first substrate, a conductive layer, plural unit radiation members, a second substrate, a ground conductive layer, and two first conductor pillars. The plural unit radiation members are disposed in parallel on the conductive layer, and each unit radiation member includes at least a pair of slots that are disposed in parallel. The two first conductive pillars are disposed between two neighboring unit radiation members and electrically connect the feed routing layer and the conductive layer. A dual slot SIW antenna array module is also disclosed. By use of the dual slot structure, more radiation members are allowed to be included in a limited square measure for improving the antenna gain.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: October 1, 2019
    Assignee: CUBTEK INC.
    Inventors: Shyh-Jong Chung, Hsiao-Ning Wang
  • Publication number: 20170373402
    Abstract: A series fed microstrip antenna structure includes a substrate, a patterned conductive layer disposed on the upper surface of the substrate, and a grounding layer disposed on the lower surface of the substrate. The patterned conductive layer includes a conductive wire and a plurality of radiator units, wherein each radiator unit is connected with the conductive wire by a feed line. A matched radiator unit disposed on the substrate and electrically connected with the conductive wire. With such configuration, the structure is simple and facilitates the massive production. Also, the antenna bandwidth is increased, and the antenna gain is improved.
    Type: Application
    Filed: June 27, 2017
    Publication date: December 28, 2017
    Inventors: SHYH-JONG CHUNG, HSIAO-NING WANG
  • Publication number: 20170331197
    Abstract: An inset type feed antenna structure is disclosed includes a substrate, a patterned conductive layer disposed on an upper surface of the substrate, and a grounding layer disposed on a lower surface of the substrate. The patterned conductive layer includes a conductive line and a plurality of radiation units, wherein each radiation units includes a conductive patch provided with a notch on one side thereof, and a feeding line electrically connecting the conductive line and the notch, wherein the feeding line is a quarter-wave feeding line. The present invention not only decreases the distance between the radiation units and the conductive line to control the vertical side lobes, but also increases the impedance of each radiation unit, so that more radiation units can be fed in.
    Type: Application
    Filed: May 9, 2017
    Publication date: November 16, 2017
    Inventors: SHYH-JONG CHUNG, HSIAO-NING WANG
  • Publication number: 20170288313
    Abstract: A dual slot SIW antenna unit includes a first substrate, a conductive layer, plural unit radiation members, a second substrate, a ground conductive layer, and two first conductor pillars. The plural unit radiation members are disposed in parallel on the conductive layer, and each unit radiation member includes at least a pair of slots that are disposed in parallel. The two first conductive pillars are disposed between two neighboring unit radiation members and electrically connect the feed routing layer and the conductive layer. A dual slot SIW antenna array module is also disclosed. By use of the dual slot structure, more radiation members are allowed to be included in a limited square measure for improving the antenna gain.
    Type: Application
    Filed: March 30, 2017
    Publication date: October 5, 2017
    Inventors: SHYH-JONG CHUNG, HSIAO-NING WANG
  • Publication number: 20170285141
    Abstract: A radar device for vehicles includes a waveform generator, generating an FMCW; a transmit antenna, transmitting the FMCW; a first receive antenna, receiving a first reflected wave of the FMCW; a first mixer, receiving the FMCW and the first reflected wave to produce a first mixed signal; a second receive antenna, receiving a second reflected wave of the FMCW; a second mixer, receiving the FMCW and the second reflected wave to produce a second mixed signal; and a digital signal processor, receiving and processing the first mixed signal and the second mixed signal to produce a diversity receive signal. By use of a multipath reflection compensation, the instability issue of the signal from a remote target object is resolved.
    Type: Application
    Filed: March 30, 2017
    Publication date: October 5, 2017
    Inventors: SHYH-JONG CHUNG, HSIAO-NING WANG
  • Patent number: 9066198
    Abstract: An integrated contactless signal transfer apparatus makes use of the rule of filter design to transfer signal from a chip to the transmission lines of a PCB. The integrated contactless signal transfer apparatus includes a substrate, a chip disposed on the substrate, a first resonator unit disposed on the chip for receiving a first signal with a first frequency generated from the chip, a PCB positioned at a distance opposite to the substrate, and a second resonator unit disposed on the PCB. The first signal passes through the first resonator unit to generate a contactless coupling between the first and second resonator units, so the second resonator unit generates a second signal. The second signal has a second frequency substantially equal to the first frequency.
    Type: Grant
    Filed: November 29, 2013
    Date of Patent: June 23, 2015
    Assignee: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Shyh-Jong Chung, Hsiao-Ning Wang
  • Publication number: 20150111492
    Abstract: An integrated contactless signal transfer apparatus makes use of the rule of filter design to transfer signal from a chip to the transmission lines of a PCB. The integrated contactless signal transfer apparatus includes a substrate, a chip disposed on the substrate, a first resonator unit disposed on the chip for receiving a first signal with a first frequency generated from the chip, a PCB positioned at a distance opposite to the substrate, and a second resonator unit disposed on the PCB. The first signal passes through the first resonator unit to generate a contactless coupling between the first and second resonator units, so the second resonator unit generates a second signal. The second signal has a second frequency substantially equal to the first frequency.
    Type: Application
    Filed: November 29, 2013
    Publication date: April 23, 2015
    Applicant: National Chiao Tung University
    Inventors: Shyh-Jong CHUNG, Hsiao-Ning WANG