Abstract: A touch panel includes a cover glass, a flexible substrate, and a touch-sensing electrode structure. The flexible substrate is connected to the cover glass via a bonding layer, and the touch-sensing electrode structure is formed on the flexible substrate. The cover glass, the bonding layer, the flexible substrate and the touch-sensing electrode structure are arranged in order, with the flexible substrate being located between the touch-sensing electrode structure and the bonding layer.

Abstract: A touch panel includes a cover glass, a flexible substrate, and a touch-sensing electrode structure. The flexible substrate is connected to the cover glass via a bonding layer, and the touch-sensing electrode structure is formed on the flexible substrate. The cover glass, the bonding layer, the flexible substrate and the touch-sensing electrode structure are arranged in order, with the flexible substrate being located between the touch-sensing electrode structure and the bonding layer.

Abstract: A touch panel structure and the manufacturing method thereof are disclosed, in which the manufacturing method includes the steps of: providing a bonding layer; and forming a conductive pattern layer on the bonding layer; wherein the conductive pattern layer is composed of at least one first and at least one second major conductors with an insulation layer interposed between the first and the second major conductors. Comparing with the prior art for manufacturing touch panels, the disclosure is advantageous in material cost, production cost, and production yield; moreover, the panel lamination process can be simplified and the touch panel structure can be joined to a planar or curvy panel and facilitate the design of a thinner product.

Abstract: A touch panel having a transparent region and a peripheral region surrounding the transparent region is provided. The touch panel includes a transparent cover, a touch device, a light-shielding layer, a layer of conductive lines, and a touch chip. The transparent cover has a touch surface and a device mounting surface opposite thereto. The touch device is disposed on the device mounting surface and at least located at the transparent region. The light-shielding layer is disposed on the transparent cover and located inside the peripheral region. The layer of conductive lines is disposed on the device mounting surface, located inside the peripheral region, and electrically connected to the touch device. The touch chip is disposed on the layer of conductive lines through a chip-on-glass process.

Abstract: A touch panel having a transparent region and a peripheral region surrounding the transparent region is provided. The touch panel includes a transparent cover, a touch device, a light-shielding layer, a layer of conductive lines, and a touch chip. The transparent cover has a touch surface and a device mounting surface opposite thereto. The touch device is disposed on the device mounting surface and at least located at the transparent region. The light-shielding layer is disposed on the transparent cover and located inside the peripheral region. The layer of conductive lines is disposed on the device mounting surface, located inside the peripheral region, and electrically connected to the touch device. The touch chip is disposed on the layer of conductive lines through a chip-on-glass process.

Abstract: A touch panel having a transparent region and a peripheral region surrounding the transparent region is provided. The touch panel includes a transparent cover, a touch device, a light-shielding layer, a layer of conductive lines, and a touch chip. The transparent cover has a touch surface and a device mounting surface opposite thereto. The touch device is disposed on the device mounting surface and at least located at the transparent region. The light-shielding layer is disposed on the transparent cover and located inside the peripheral region. The layer of conductive lines is disposed on the device mounting surface, located inside the peripheral region, and electrically connected to the touch device. The touch chip is disposed on the layer of conductive lines through a chip-on-glass process.

Abstract: A touch panel structure and the manufacturing method thereof are disclosed, in which the manufacturing method includes the steps of: providing a bonding layer; and forming a conductive pattern layer on the bonding layer; wherein the conductive pattern layer is composed of at least one first and at least one second major conductors with an insulation layer interposed between the first and the second major conductors. Comparing with the prior art for manufacturing touch panels, the disclosure is advantageous in material cost, production cost, and production yield; moreover, the panel lamination process can be simplified and the touch panel structure can be joined to a planar or curvy panel and facilitate the design of a thinner product.

Abstract: A touch panel structure and the manufacturing method thereof are disclosed, in which the manufacturing method includes the steps of: providing a bonding layer; and forming a conductive pattern layer on the bonding layer; wherein the conductive pattern layer is composed of at least one first and at least one second major conductors with an insulation layer interposed between the first and the second major conductors. Comparing with the prior art for manufacturing touch panels, the disclosure is advantageous in material cost, production cost, and production yield; moreover, the panel lamination process can be simplified and the touch panel structure can be joined to a planar or curvy panel and facilitate the design of a thinner product.

Abstract: A touch panel having a transparent region and a peripheral region surrounding the transparent region is provided. The touch panel includes a transparent cover, a touch device, a light-shielding layer, a layer of conductive lines, and a touch chip. The transparent cover has a touch surface and a device mounting surface opposite thereto. The touch device is disposed on the device mounting surface and at least located at the transparent region. The light-shielding layer is disposed on the transparent cover and located inside the peripheral region. The layer of conductive lines is disposed on the device mounting surface, located inside the peripheral region, and electrically connected to the touch device. The touch chip is disposed on the layer of conductive lines through a chip-on-glass process.