Patents by Inventor Hsiao-Ping Lin

Hsiao-Ping Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9213789
    Abstract: A method of generating optimized memory instances using a memory compiler is disclosed. Data pertinent to describing a memory to be designed are provided, and front-end models and back-end models are made to supply a library. Design criteria are received via a user interface. Design of the memory is optimized among speed, power and area according to the provided library and the received design criteria, thereby generating memory instances.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: December 15, 2015
    Assignee: M31 TECHNOLOGY CORPORATION
    Inventors: Nan-Chun Lien, Hsiao-Ping Lin, Wei-Chiang Shih, Yu-Chun Lin, Yu-Wei Yeh
  • Publication number: 20140173241
    Abstract: A method of generating optimized memory instances using a memory compiler is disclosed. Data pertinent to describing a memory to be designed are provided, and front-end models and back-end models are made to supply a library. Design criteria are received via a user interface. Design of the memory is optimized among speed, power and area according to the provided library and the received design criteria, thereby generating memory instances.
    Type: Application
    Filed: December 13, 2012
    Publication date: June 19, 2014
    Applicant: M31 TECHNOLOGY CORPORATION
    Inventors: Nan-Chun Lien, Hsiao-Ping Lin, Wei-Chiang Shih, Yu-Chun Lin, Yu-Wei Yeh
  • Publication number: 20070153149
    Abstract: A thin film transistor substrate includes a transparent substrate, a plurality of thin film transistors, a passivation insulating layer and a plurality of pixel electrodes. The thin film transistors are disposed on the transparent substrate and include a gate insulating film. The passivation insulating layer is disposed on the gate insulating film and covers the thin film transistors, wherein the passivation insulating layer is formed with a concave-convex surface, a plurality of contact holes and a plurality of light-transmissive regions, and the light-transmissive regions are located above the gate insulating film. The pixel electrodes are disposed on the concave-convex surface and the light-transmissive regions, wherein each pixel electrode is electrically connected to the thin film transistor via the contact hole.
    Type: Application
    Filed: August 11, 2006
    Publication date: July 5, 2007
    Applicant: WINTEK
    Inventors: Tai Yuan CHEN, Shu Hui LIN, Hsiao Ping LIN
  • Patent number: 5945696
    Abstract: A silicon chip having a mixed input/output slot structure comprising a core region having a plurality of circuits formed thereon, a wiring region surrounding and linked to the core region, and an input/output area surrounding and linked to the wiring region, where the input/output area has a plurality of input/output slots and four corner cells. The input/output slots can be divided into groups with each group having a different height, and input/output slots on the same side of the input/output area all have the same height. Therefore, a choice of sides for placing the input/output slots can be made, and the layout of input/output slots around the silicon chip is not be restricted by one side. Hence, chip size can be reduced and chip surface can be fully utilized.
    Type: Grant
    Filed: April 23, 1998
    Date of Patent: August 31, 1999
    Assignee: Faraday Technology Corp.
    Inventors: Hsiao-Ping Lin, Tin-Hao Lin
  • Patent number: 5932900
    Abstract: The invention provides an improvement in a cell structure for gate arrays. By using the cell in gate arrays, the design flexibility and the symmetry feature of the gate array can be retained. By providing transistors of different sizes, the design can possess more flexibility and more efficiency. Moreover, a denser chip layout can be completed. Thus, average wire lengths used for interconnections in the chip design may be shorter than previously possible. Also, better utilization of available chip area can be made. Thus, it becomes possible to flexibly and optimally use every area of the chip.
    Type: Grant
    Filed: September 30, 1997
    Date of Patent: August 3, 1999
    Assignee: Faraday Technology Corporation
    Inventors: Hsiao-Ping Lin, Chia-Wei Wang, Chi-Yi Hwang