Abstract: The present application provides a testing apparatus. The testing apparatus includes a base; a first printed circuit board, disposed above the base; a stiffener, disposed adjacent to the base, located at a center of the base and passing through the first printed circuit board; a second printed circuit board, disposed at a center of the stiffener; and a probe card, one part thereof disposed adjacent to the stiffener and the other part thereof passing through the base, the first printed circuit board, the stiffener and the second printed circuit board. The base, the stiffener and the second printed circuit board are integrated and the base carries the first circuit board.

Abstract: The present disclosure provides a testing apparatus, a holding assembly and a probe card carrier. In some embodiments of the present disclosure, the testing apparatus includes a basic circuit board having a first surface and a second surface; a holding assembly disposed on the first surface; a signal transfer assembly disposed on the second surface and electrically connected to the basic circuit board; and a probe card carrier configured to carry a probe card. In some embodiments of the present disclosure, when the probe card carrier is assembled to the holding assembly, the probe card is electrically connected to the signal transfer assembly.

Abstract: The present disclosure provides a testing apparatus, a holding assembly and a probe card carrier. In some embodiments of the present disclosure, the testing apparatus includes a basic circuit board having a first surface and a second surface; a holding assembly disposed on the first surface; a signal transfer assembly disposed on the second surface and electrically connected to the basic circuit board; and a probe card carrier configured to carry a probe card. In some embodiments of the present disclosure, when the probe card carrier is assembled to the holding assembly, the probe card is electrically connected to the signal transfer assembly.

Abstract: A test assembly adapted to test a semiconductor device is provided. The test assembly includes a main circuit board, an intermediate dielectric board, an intermediate circuit board, a plurality of intermediate conductive elements and a plurality of test probes. The main circuit board includes a surface and a plurality of pads disposed on the surface. The intermediate dielectric board is detachably disposed on the surface of the main circuit board and includes a plurality of through holes. The intermediate circuit board is disposed on the intermediated dielectric board and includes a plurality of first pads, a plurality of second pads, a first surface and a second surface opposite to the first surface. The intermediate conductive elements are disposed in the through holes, respectively. Each of the intermediate conductive elements electrically connects one of the pads of the main circuit board and one of the first pads of the intermediate circuit board.

Abstract: A testing device comprises a first probe member, a second probe member, and an insulation member. The first probe member comprises a tip portion for contacting a device being tested. The second probe member also comprises a tip portion for contacting the device being tested. The insulation member is located at or can be moved to a location between the tip portions of the first and second probe members.

Abstract: A high precision semiconductor probing system includes a probe head, a circuit board positioned above the probe head, and an optical microscope, wherein the probe head has a plurality of vertical probes and at least one cantilever probe having a vertical body positioned therein. The cantilever probe is disposed close to an edge of the probe head and extends laterally out from the probe head, in order to facilitate the visual alignment viewing from top of the probing apparatus. The optical microscope is positioned on top of the probing apparatus and is configured to have a line of sight directed to the tip of the cantilever probe.

Abstract: A test assembly adapted to test a semiconductor device is provided. The test assembly includes a main circuit board, an intermediate dielectric board, an intermediate circuit board, a plurality of intermediate conductive elements and a plurality of test probes. The main circuit board includes a surface and a plurality of pads disposed on the surface. The intermediate dielectric board is detachably disposed on the surface of the main circuit board and includes a plurality of through holes. The intermediate circuit board is disposed on the intermediated dielectric board and includes a plurality of first pads, a plurality of second pads, a first surface and a second surface opposite to the first surface. The intermediate conductive elements are disposed in the through holes, respectively. Each of the intermediate conductive elements electrically connects one of the pads of the main circuit board and one of the first pads of the intermediate circuit board.

Abstract: A testing device comprises a first probe member, a second probe member, and an insulation member. The first probe member comprises a tip portion for contacting a device being tested. The second probe member also comprises a tip portion for contacting the device being tested. The insulation member is located at or can be moved to a location between the tip portions of the first and second probe members.

Abstract: A high precision semiconductor probing system includes a probe head, a circuit board positioned above the probe head, and an optical microscope, wherein the probe head has a plurality of vertical probes and at least one cantilever probe having a vertical body positioned therein. The cantilever probe is disposed close to an edge of the probe head and extends laterally out from the probe head, in order to facilitate the visual alignment viewing from top of the probing apparatus. The optical microscope is positioned on top of the probing apparatus and is configured to have a line of sight directed to the tip of the cantilever probe.