Abstract: In some embodiments, the present disclosure relates to a semiconductor device comprising a source and drain region arranged within a substrate. A conductive gate is disposed over a doped region of the substrate. A gate dielectric layer is disposed between the source region and the drain region and separates the conductive gate from the doped region. A bottommost surface of the gate dielectric layer is below a topmost surface of the substrate. First and second sidewall spacers are arranged along first and second sides of the conductive gate, respectively. An inner portion of the first sidewall spacer and an inner portion of the second sidewall spacer respectively cover a first and second top surface of the gate dielectric layer. A drain extension region and a source extension region respectively separate the drain region and the source region from the gate dielectric layer.

Abstract: An electronic image stabilization (EIS) method includes: obtaining video frames derived from an output of an image sensor, wherein each of the video frames has a full field of view (FOV) of the image sensor; obtaining motion information of the video frames; dynamically estimating, by a processing circuit, EIS margins according to FOV variation of a plurality of cropped images within the video frames respectively; and applying stabilization correction to the cropped images according to the motion information and the EIS margins, to generate a plurality of stabilized images.

Abstract: A planarization method includes forming a dielectric layer over a polish stop layer. The dielectric layer is polished until reaching the polish stop layer, and the polished dielectric layer has a concave top surface. A compensation layer is formed over the concave top surface. The compensation layer is polished.

Abstract: An electronic image stabilization (EIS) method includes: obtaining video frames derived from an output of an image sensor, wherein each of the video frames has a full field of view (FOV) of the image sensor; obtaining motion information of the video frames; dynamically estimating, by a processing circuit, EIS margins according to FOV variation of a plurality of cropped images within the video frames respectively; and applying stabilization correction to the cropped images according to the motion information and the EIS margins, to generate a plurality of stabilized images.

Abstract: A planarization method includes forming a dielectric layer over a polish stop layer. The dielectric layer is polished until reaching the polish stop layer, and the polished dielectric layer has a concave top surface. A compensation layer is formed over the concave top surface. The compensation layer is polished.

Abstract: An electronic apparatus and a method for incremental pose estimation and photographing are provided. In the method, at least two images of a 3D object are captured at different positions encircling the 3D object. Displacements and angular displacements are detected when capturing the images. Features of the 3D object in the images, the displacements and the angular displacements are used to estimate a central position of the 3D object and a distance between the electronic apparatus and the 3D object. A circumference suitable for capturing the images of the 3D object is estimated based on the distance and is divided into several segments, and a timing interval of a timer is adjusted based on a length of the segments. A camera of the electronic apparatus is triggered at intervals set by the timer to capture the images of the 3D object.

Abstract: An electronic apparatus and a method for incremental pose estimation and photographing are provided. In the method, at least two images of a 3D object are captured at different positions encircling the 3D object. Displacements and angular displacements are detected when capturing the images. Features of the 3D object in the images, the displacements and the angular displacements are used to estimate a central position of the 3D object and a distance between the electronic apparatus and the 3D object. A circumference suitable for capturing the images of the 3D object is estimated based on the distance and is divided into several segments, and a timing interval of a timer is adjusted based on a length of the segments. A camera of the electronic apparatus is triggered at intervals set by the timer to capture the images of the 3D object.

Abstract: A hole filling method for multi-view disparity maps is provided. At least one disparity map is respectively captured as a plurality of known views among a plurality of views for capturing an object. As for a plurality of virtual views among the views excluding the at least one known view, disparity maps of the virtual views are synthesized by sequentially using the disparity maps of the known views according to a distance of a virtual camera position or a transformed angle between each virtual view and each known view. Hole filling information of the disparity maps of other virtual views having the distances or the transformed angles smaller than that of the virtual view is used to fill holes in the synthesized disparity maps of the virtual views.

Abstract: An image processing apparatus includes a determination unit, a search unit, a weight assignment unit and a filling unit. The determination unit determines whether a hole is surrounded by the foreground in a disparity map or a depth map. The search unit searches for multiple relative backgrounds along multiple directions when the hole is surrounded by the foreground. The weight assignment unit respectively assigns weights to the relative backgrounds. The filling unit selects an extremum from the weights, and fills the hole according to the relative background corresponding to the extremum.

Abstract: Systems and methods for obtaining camera parameters from images are provided. First, a sequence of original images associated with a target object under circular motion is obtained. Then, a background image and a foreground image corresponding to the target object within each original image are segmented. Next, shadow detection is performed for the target object within each original image. A first threshold and a second threshold are respectively determined according to the corresponding background and foreground images. Each original image, the corresponding background image, the first and second threshold are used for obtaining silhouette data and feature information associated with the target object within each original image. At least one camera parameter is obtained based on the entire feature information and the geometry of circular motion.

Abstract: The invention provides a process of utilizing CF4 plasma pretreatment to improve high-k dielectric materials. The process is performed by the standard complimentary metal-oxide-semiconductor field enhanced transistor (CMOSFET) in accordance with the high-k dielectric materials, in which CF4 plasma generated by plasma enhanced chemical vapor deposition (PECVD) is used to perform pretreatment on the silicon substrate, and a large amount of fluorine will be incorporated on the surface of silicon substrate. Then, a gate dielectric layer is deposited on the surface of silicon substrate, and a thermal annealing in an oxygen ambience is performed. At this time, the silicon substrate incorporating with fluorine will not respond to the high-k dielectric materials to form silicate; therefore, the property of silicon substrate can be improved. The advantages of high-k dielectric materials formed by the process include low leakage current, high breakdown voltage, and good reliability.