Patents by Inventor Hsiao-Wei Wu

Hsiao-Wei Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250110307
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Application
    Filed: December 12, 2024
    Publication date: April 3, 2025
    Inventors: Chao-Chang HU, Chih-Wei WENG, Chia-Che WU, Chien-Yu KAO, Hsiao-Hsin HU, He-Ling CHANG, Chao-Hsi WANG, Chen-Hsien FAN, Che-Wei CHANG, Mao-Gen JIAN, Sung-Mao TSAI, Wei-Jhe SHEN, Yung-Ping YANG, Sin-Hong LIN, Tzu-Yu CHANG, Sin-Jhong SONG, Shang-Yu HSU, Meng-Ting LIN, Shih-Wei HUNG, Yu-Huai LIAO, Mao-Kuo HSU, Hsueh-Ju LU, Ching-Chieh HUANG, Chih-Wen CHIANG, Yu-Chiao LO, Ying-Jen WANG, Shu-Shan CHEN, Che-Hsiang CHIU
  • Publication number: 20250112088
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a first low dielectric constant (low-k) layer, a first metal layer, a metal cap layer, a dielectric on dielectric (DoD) layer, an etch stop layer (ESL), a second low-k layer, a metal via and a second metal layer. The dielectric constant of the first low-k layer is less than 4. The first metal layer is embodied in the first low-k layer. The first low-k layer exposes the first metal layer. The metal cap layer is disposed on the first metal layer. The DoD layer is disposed on the first low-k layer. The etch stop layer is disposed on the metal cap layer and the DoD layer. The second low-k layer is disposed above the etch stop layer. The metal via is embodied in the second low-k layer and connected to the first metal layer.
    Type: Application
    Filed: September 28, 2023
    Publication date: April 3, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Chin LEE, Yen Ju WU, Shao-Kuan LEE, Kuang-Wei YANG, Hsin-Yen HUANG, Jing Ting SU, Kai-Fang CHENG, Hsiao-Kang CHANG, Wei-Chen CHU, Shu-Yun KU, Chia-Tien WU, Ming-Han LEE, Hsin-Ping CHEN
  • Publication number: 20250109870
    Abstract: The present disclosure is at least directed to utilizing air curtain devices to form air curtains to separate and isolate areas in which respective workpieces are stored from a transfer compartment within a workpiece processing apparatus. The transfer compartment of the workpiece processing apparatus includes a robot configured to transfer or transport ones of the workpieces to and from these respective storage areas through the transfer compartment and to and from a tool compartment. A tool is present in the tool compartment for processing and refining the respective workpieces. Clean dry air (CDA) may be circulated through the respective storage areas. The air curtains formed by the air curtain devices and the circulation of CDA through the respective storage areas reduces the likelihood of the generation of defects, damages, and degradation of the workpieces when present within the workpiece processing apparatus.
    Type: Application
    Filed: December 12, 2024
    Publication date: April 3, 2025
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chia-Wei WU, Hao YANG, Hsiao-Chieh CHOU, Chun-Hung CHAO, Jao Sheng HUANG, Neng-Jye YANG, Kuo-Bin HUANG
  • Publication number: 20250095552
    Abstract: Disclosed is a passive display apparatus. The passive display apparatus includes multiple light-emitting elements, a scanning circuit, multiple scanning switches, and a current control circuit. The light emitting elements are arranged in an array. The scanning circuit is coupled to the light-emitting elements and has multiple scan shift registers to generate multiple scan signals enabled sequentially. The scanning switches receive the scan signals and a first operating voltage to provide the first operating voltage to the light-emitting elements row by row. The current control circuit is coupled to the light-emitting elements, and receives multiple pixel voltages to provide multiple light-emitting currents to the light-emitting elements. The light-emitting elements emit light based on the received light-emitting currents.
    Type: Application
    Filed: June 11, 2024
    Publication date: March 20, 2025
    Applicant: AUO Corporation
    Inventors: Hsien-Chun Wang, Hsin-Chun Huang, Hsiao-Wei Cheng, Yang-En Wu
  • Patent number: 12252777
    Abstract: A physical vapor deposition (PVD) system is provided. The PVD system includes a PVD chamber defining a PVD volume within which a target material of a target is deposited onto a wafer. The PVD system includes the target in the PVD chamber. The target is configured to overlie the wafer. An edge of the target extends from a first surface of the target to a second surface of the target, opposite the first surface of the target. A first portion of the edge of the target has a first surface roughness. The first portion of the edge of the target extends at most about 6 millimeters from the first surface of the target to a second portion of the edge of the target. The second portion of the edge of the target has a second surface roughness less than the first surface roughness.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: March 18, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Sheng-Ying Wu, Ming-Hsien Lin, Po-Wei Wang, Hsiao-Feng Lu
  • Patent number: 12253489
    Abstract: A gas sensor includes a first electrode, a gas detecting layer disposed on the first electrode, and an electric-conduction enhanced electrode unit being electrically connected to the first electrode and the gas detecting layer. The electric-conduction enhanced electrode unit includes an electric-conduction enhancing layer and a second electrode electrically connected to the electric-conduction enhancing layer. The electric-conduction enhancing layer is electrically connected to the gas detecting layer and is made of an electrically conductive organic material.
    Type: Grant
    Filed: October 28, 2022
    Date of Patent: March 18, 2025
    Assignee: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Hsiao-Wen Zan, Hsin-Fei Meng, Yu-Chi Lin, Shang-Yu Yu, Ting-Wei Tung, Yi-Chu Wu, Yu-Nung Mao
  • Patent number: 12213303
    Abstract: The present disclosure provides a semiconductor device and a fabricating method thereof, and which includes a substrate, bit lines, bit line contacts, a gate structure, a first oxidized interface layer, and a second oxidized interface layer. The bit lines are disposed on the substrate, and the bit line contacts are disposed below the bit lines. The gate structure is disposed on the substrate, wherein each bit line and the gate structure respectively include a semiconductor layer, a conductive layer, and a covering layer stacked from bottom to top. The first oxidized interface layer is disposed between each bit line contact and the semiconductor layer of each bit line. The second oxidized interface layer is disposed within the semiconductor layer of the gate structure, wherein a topmost surface of the first oxidized interface layer is higher than a topmost surface of the second oxidized interface layer.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: January 28, 2025
    Assignee: Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Yukihiro Nagai, Lu-Yung Lin, Chia-Wei Wu, Tsun-Min Cheng, Yu Chun Lin, Zheng Guo Zhang, Sun-Hung Chen, Wu Xiang Li, Hsiao-Han Lin
  • Patent number: 12204163
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: February 5, 2024
    Date of Patent: January 21, 2025
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Patent number: 11929547
    Abstract: A mobile device includes a system circuit board, a metal frame, one or more other antenna elements, a display device, a first feeding element, and an RF (Radio Frequency) module. The system circuit board includes a system ground plane. The metal frame at least includes a first portion and a second portion. The metal frame at least has a first cut point positioned between the first portion and the second portion. The metal frame further has a second cut point for separating the other antenna elements from the first portion. The first cut point is arranged to be close to a middle region of the display device. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion.
    Type: Grant
    Filed: April 7, 2023
    Date of Patent: March 12, 2024
    Assignee: HTC Corporation
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Li-Yuan Fang, Shen-Fu Tzeng, Yi-Hsiang Kung
  • Publication number: 20230246328
    Abstract: A mobile device includes a system circuit board, a metal frame, one or more other antenna elements, a display device, a first feeding element, and an RF (Radio Frequency) module. The system circuit board includes a system ground plane. The metal frame at least includes a first portion and a second portion. The metal frame at least has a first cut point positioned between the first portion and the second portion. The metal frame further has a second cut point for separating the other antenna elements from the first portion. The first cut point is arranged to be close to a middle region of the display device. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion.
    Type: Application
    Filed: April 7, 2023
    Publication date: August 3, 2023
    Applicant: HTC Corporation
    Inventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Li-Yuan FANG, Shen-Fu TZENG, Yi-Hsiang KUNG
  • Patent number: 11664583
    Abstract: A mobile device includes a system circuit board, a metal frame, a first feeding element, an RF (Radio Frequency) module, and one or more other antenna elements. The system circuit board includes a system ground plane. The metal frame includes a first portion and a second portion. The metal frame has a first cut point positioned between the first portion and the second portion. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion. The second portion is excited by the first antenna structure using a coupling mechanism. The RF module is electrically coupled to the first feeding element. The metal frame further has a second cut point for separating the other antenna elements from the first antenna structure.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: May 30, 2023
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Li-Yuan Fang, Shen-Fu Tzeng, Yi-Hsiang Kung
  • Patent number: 11362687
    Abstract: A wireless communication device is provided. The wireless communication device includes a housing, a circuit board, a radio frequency module and an antenna. The housing has a frame and a back cover to define a receiving space. The circuit board is disposed in the receiving space, and defines a clearance area from the housing in the receiving space. The circuit board includes a ground terminal, a first feeding point, and a second feeding point. The antenna includes at least one metal conductor coupled to the first feeding point and the second feeding point, respectively, to provide a low frequency resonant path, a first middle frequency resonant path, a second middle frequency resonant path and a high frequency resonant path.
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: June 14, 2022
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Yi-Hsiang Kung, Shen-Fu Tzeng, Li-Yuan Fang
  • Patent number: 11145958
    Abstract: A mobile device at least includes a first circuit board, a metal frame, an electronic component, a second circuit board, and an RF (Radio Frequency) module. The first circuit board includes a system ground plane. The metal frame at least includes a first portion. The first portion is electrically coupled to the system ground plane and a feeding point. An antenna structure is formed by the first portion and the feeding point. The second circuit board is electrically coupled to the electronic component. The electronic component and the second circuit board are adjacent to the first portion of the metal frame. The RF module is electrically coupled to the feeding point, so as to excite the antenna structure.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: October 12, 2021
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Shen-Fu Tzeng, Yi-Hsiang Kung, Li-Yuan Fang
  • Patent number: 11063343
    Abstract: A mobile device including a ground plane, a grounding branch, wherein a slot is formed between the ground plane and the grounding branch, a connecting element, wherein the grounding branch is electrically coupled through the connecting element to the ground plane and a feeding element, extending across the slot, and electrically coupled between the grounding branch and a signal source, wherein an antenna structure is formed by the grounding branch and the feeding element.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: July 13, 2021
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Ying-Chih Wang
  • Patent number: 11038258
    Abstract: A mobile device, at least including a metal housing, being substantially a hollow structure, wherein the metal housing has a back region and at least one side region, a first slit, formed on the metal housing, a dielectric substrate, comprising at least a first protruded portion, a first connection element, positioned between the metal housing and the dielectric substrate, and electrically coupled to the metal housing and a first signal source, positioned inside and electrically coupled to the metal housing, wherein at least one portion of the metal housing is configured to receive and transmit at least one wireless signal.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: June 15, 2021
    Assignee: HTC Corporation
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Chao-Chiang Kuo
  • Publication number: 20210013590
    Abstract: A mobile device includes a system circuit board, a metal frame, a first feeding element, an RF (Radio Frequency) module, and one or more other antenna elements. The system circuit board includes a system ground plane. The metal frame includes a first portion and a second portion. The metal frame has a first cut point positioned between the first portion and the second portion. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion. The second portion is excited by the first antenna structure using a coupling mechanism. The RF module is electrically coupled to the first feeding element. The metal frame further has a second cut point for separating the other antenna elements from the first antenna structure.
    Type: Application
    Filed: September 30, 2020
    Publication date: January 14, 2021
    Applicant: HTC Corporation
    Inventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Li-Yuan FANG, Shen-Fu TZENG, Yi-Hsiang KUNG
  • Patent number: 10879591
    Abstract: A mobile device includes a dielectric substrate, a metal layer, a metal housing, a first nonconductive partition, a second nonconductive partition, a first connection element, and a second connection element. The dielectric substrate includes a first protruded portion. The metal layer lies on the dielectric substrate, and includes an upper element and a main element, wherein the upper element is separated from the main element by a first region. The metal housing is substantially a hollow structure, and has a first slit and a second slit, wherein a first projection of the first slit with respect to the dielectric substrate at least partially overlaps the first region, and a second projection of the second slit with respect to the dielectric substrate at least partially overlaps the first protruded portion. The mobile device is capable of operating in multiple bands.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: December 29, 2020
    Assignee: HTC Corporation
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Chao-Chiang Kuo
  • Patent number: 10879588
    Abstract: A mobile device includes a system circuit board, a metal frame, a first feeding element, a second feeding element, and an RF (Radio Frequency) module. The system circuit board includes a system ground plane. The metal frame includes a first portion and a second portion. The metal frame has a first cut point positioned between the first portion and the second portion. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion. The second feeding element is directly or indirectly electrically connected to the second portion. A second antenna structure is formed by the second feeding element and the second portion. The RF module is electrically coupled to the first feeding element and the second feeding element, so as to excite the first antenna structure and second antenna structure.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: December 29, 2020
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Li-Yuan Fang, Shen-Fu Tzeng, Yi-Hsiang Kung
  • Patent number: 10833398
    Abstract: A mobile device includes a dielectric substrate, a metal layer, a metal housing, a nonconductive partition, at least one connection element, and a feeding element. The metal layer is disposed on the dielectric substrate, and includes an upper element and a main element, wherein a slot is formed between the upper element and the main element. The metal housing is substantially a hollow structure, and has a slit, wherein the slit is substantially aligned with the slot of the metal layer. The connection element couples the upper element of the metal layer to the metal housing. The feeding element is coupled to the upper element of the metal layer or coupled to the metal housing. An antenna structure is formed by the feeding element, the upper element of the metal layer, the connection element, and the metal housing.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: November 10, 2020
    Assignee: HTC CORPORATION
    Inventors: Tiao-Hsing Tsai, Chien-Pin Chiu, Hsiao-Wei Wu, Chao-Chiang Kuo
  • Publication number: 20200303810
    Abstract: A mobile device at least includes a first circuit board, a metal frame, an electronic component, a second circuit board, and an RF (Radio Frequency) module. The first circuit board includes a system ground plane. The metal frame at least includes a first portion. The first portion is electrically coupled to the system ground plane and a feeding point. An antenna structure is formed by the first portion and the feeding point. The second circuit board is electrically coupled to the electronic component. The electronic component and the second circuit board are adjacent to the first portion of the metal frame. The RF module is electrically coupled to the feeding point, so as to excite the antenna structure.
    Type: Application
    Filed: June 8, 2020
    Publication date: September 24, 2020
    Applicant: HTC Corporation
    Inventors: Tiao-Hsing TSAI, Chien-Pin CHIU, Hsiao-Wei WU, Shen-Fu TZENG, Yi-Hsiang KUNG, Li-Yuan FANG