Abstract: The present disclosure is at least directed to utilizing air curtain devices to form air curtains to separate and isolate areas in which respective workpieces are stored from a transfer compartment within a workpiece processing apparatus. The transfer compartment of the workpiece processing apparatus includes a robot configured to transfer or transport ones of the workpieces to and from these respective storage areas through the transfer compartment and to and from a tool compartment. A tool is present in the tool compartment for processing and refining the respective workpieces. Clean dry air (CDA) may be circulated through the respective storage areas. The air curtains formed by the air curtain devices and the circulation of CDA through the respective storage areas reduces the likelihood of the generation of defects, damages, and degradation of the workpieces when present within the workpiece processing apparatus.

Abstract: A semiconductor device includes a semiconductor stack, a reflective structure, and a conductive structure. The semiconductor stack includes a first semiconductor structure, a second semiconductor structure and an active region located between the first semiconductor structure and the second semiconductor structure. The reflective structure is located at a side of semiconductor stack closed to the first semiconductor structure, and includes a first metal. The conductive structure locates between the reflective structure and the first semiconductor structure, and includes a first region overlapping with the active structure and a second region which does not overlap with the active structure. The first metal in the second region has a concentration smaller than 5 atomic percent.

Abstract: A method for forming a semiconductor device structure is disclosed. The method includes forming one or more first conductive features in a first dielectric layer, forming a metal layer on each of the one or more first conductive features, forming a first etch stop layer over the metal layer, forming a second etch stop layer on the first etch stop layer, wherein the second etch stop layer is a nitrogen-free layer. The method also includes forming a second dielectric layer on the second etch stop layer, and forming a second conductive feature in the second dielectric layer through the second etch stop layer, the first etch stop layer, and the metal layer.

Abstract: A physical vapor deposition (PVD) system is provided. The PVD system includes a PVD chamber defining a PVD volume within which a target material of a target is deposited onto a wafer. The PVD system includes the target in the PVD chamber. The target is configured to overlie the wafer. An edge of the target extends from a first surface of the target to a second surface of the target, opposite the first surface of the target. A first portion of the edge of the target has a first surface roughness. The first portion of the edge of the target extends at most about 6 millimeters from the first surface of the target to a second portion of the edge of the target. The second portion of the edge of the target has a second surface roughness less than the first surface roughness.

Abstract: A mobile device includes a system circuit board, a metal frame, one or more other antenna elements, a display device, a first feeding element, and an RF (Radio Frequency) module. The system circuit board includes a system ground plane. The metal frame at least includes a first portion and a second portion. The metal frame at least has a first cut point positioned between the first portion and the second portion. The metal frame further has a second cut point for separating the other antenna elements from the first portion. The first cut point is arranged to be close to a middle region of the display device. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion.

Abstract: A mobile device includes a system circuit board, a metal frame, one or more other antenna elements, a display device, a first feeding element, and an RF (Radio Frequency) module. The system circuit board includes a system ground plane. The metal frame at least includes a first portion and a second portion. The metal frame at least has a first cut point positioned between the first portion and the second portion. The metal frame further has a second cut point for separating the other antenna elements from the first portion. The first cut point is arranged to be close to a middle region of the display device. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion.

Abstract: A mobile device includes a system circuit board, a metal frame, a first feeding element, an RF (Radio Frequency) module, and one or more other antenna elements. The system circuit board includes a system ground plane. The metal frame includes a first portion and a second portion. The metal frame has a first cut point positioned between the first portion and the second portion. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion. The second portion is excited by the first antenna structure using a coupling mechanism. The RF module is electrically coupled to the first feeding element. The metal frame further has a second cut point for separating the other antenna elements from the first antenna structure.

Abstract: A wireless communication device is provided. The wireless communication device includes a housing, a circuit board, a radio frequency module and an antenna. The housing has a frame and a back cover to define a receiving space. The circuit board is disposed in the receiving space, and defines a clearance area from the housing in the receiving space. The circuit board includes a ground terminal, a first feeding point, and a second feeding point. The antenna includes at least one metal conductor coupled to the first feeding point and the second feeding point, respectively, to provide a low frequency resonant path, a first middle frequency resonant path, a second middle frequency resonant path and a high frequency resonant path.

Abstract: A mobile device at least includes a first circuit board, a metal frame, an electronic component, a second circuit board, and an RF (Radio Frequency) module. The first circuit board includes a system ground plane. The metal frame at least includes a first portion. The first portion is electrically coupled to the system ground plane and a feeding point. An antenna structure is formed by the first portion and the feeding point. The second circuit board is electrically coupled to the electronic component. The electronic component and the second circuit board are adjacent to the first portion of the metal frame. The RF module is electrically coupled to the feeding point, so as to excite the antenna structure.

Abstract: A mobile device including a ground plane, a grounding branch, wherein a slot is formed between the ground plane and the grounding branch, a connecting element, wherein the grounding branch is electrically coupled through the connecting element to the ground plane and a feeding element, extending across the slot, and electrically coupled between the grounding branch and a signal source, wherein an antenna structure is formed by the grounding branch and the feeding element.

Abstract: A mobile device, at least including a metal housing, being substantially a hollow structure, wherein the metal housing has a back region and at least one side region, a first slit, formed on the metal housing, a dielectric substrate, comprising at least a first protruded portion, a first connection element, positioned between the metal housing and the dielectric substrate, and electrically coupled to the metal housing and a first signal source, positioned inside and electrically coupled to the metal housing, wherein at least one portion of the metal housing is configured to receive and transmit at least one wireless signal.

Abstract: A mobile device includes a system circuit board, a metal frame, a first feeding element, an RF (Radio Frequency) module, and one or more other antenna elements. The system circuit board includes a system ground plane. The metal frame includes a first portion and a second portion. The metal frame has a first cut point positioned between the first portion and the second portion. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion. The second portion is excited by the first antenna structure using a coupling mechanism. The RF module is electrically coupled to the first feeding element. The metal frame further has a second cut point for separating the other antenna elements from the first antenna structure.

Abstract: A mobile device includes a system circuit board, a metal frame, a first feeding element, a second feeding element, and an RF (Radio Frequency) module. The system circuit board includes a system ground plane. The metal frame includes a first portion and a second portion. The metal frame has a first cut point positioned between the first portion and the second portion. The first feeding element is directly or indirectly electrically connected to the first portion. A first antenna structure is formed by the first feeding element and the first portion. The second feeding element is directly or indirectly electrically connected to the second portion. A second antenna structure is formed by the second feeding element and the second portion. The RF module is electrically coupled to the first feeding element and the second feeding element, so as to excite the first antenna structure and second antenna structure.

Abstract: A mobile device includes a dielectric substrate, a metal layer, a metal housing, a first nonconductive partition, a second nonconductive partition, a first connection element, and a second connection element. The dielectric substrate includes a first protruded portion. The metal layer lies on the dielectric substrate, and includes an upper element and a main element, wherein the upper element is separated from the main element by a first region. The metal housing is substantially a hollow structure, and has a first slit and a second slit, wherein a first projection of the first slit with respect to the dielectric substrate at least partially overlaps the first region, and a second projection of the second slit with respect to the dielectric substrate at least partially overlaps the first protruded portion. The mobile device is capable of operating in multiple bands.

Abstract: A mobile device includes a dielectric substrate, a metal layer, a metal housing, a nonconductive partition, at least one connection element, and a feeding element. The metal layer is disposed on the dielectric substrate, and includes an upper element and a main element, wherein a slot is formed between the upper element and the main element. The metal housing is substantially a hollow structure, and has a slit, wherein the slit is substantially aligned with the slot of the metal layer. The connection element couples the upper element of the metal layer to the metal housing. The feeding element is coupled to the upper element of the metal layer or coupled to the metal housing. An antenna structure is formed by the feeding element, the upper element of the metal layer, the connection element, and the metal housing.

Abstract: A mobile device at least includes a first circuit board, a metal frame, an electronic component, a second circuit board, and an RF (Radio Frequency) module. The first circuit board includes a system ground plane. The metal frame at least includes a first portion. The first portion is electrically coupled to the system ground plane and a feeding point. An antenna structure is formed by the first portion and the feeding point. The second circuit board is electrically coupled to the electronic component. The electronic component and the second circuit board are adjacent to the first portion of the metal frame. The RF module is electrically coupled to the feeding point, so as to excite the antenna structure.

Abstract: A wireless communication device is provided. The wireless communication device includes a housing, a circuit board, a radio frequency module and an antenna. The housing has a frame and a back cover to define a receiving space. The circuit board is disposed in the receiving space, and defines a clearance area from the housing in the receiving space. The circuit board includes a ground terminal, a first feeding point, and a second feeding point. The antenna includes at least one metal conductor coupled to the first feeding point and the second feeding point, respectively, to provide a low frequency resonant path, a first middle frequency resonant path, a second middle frequency resonant path and a high frequency resonant path.

Abstract: A mobile device includes a first circuit board, a metal frame, an extension radiation element, an electronic component, a second circuit board, and an RF (Radio Frequency) module. The first circuit board includes a system ground plane. The metal frame includes a first portion coupled to the system ground plane. A clearance region is formed between the first portion and the system ground plane. The first portion and the extension radiation element are both coupled to a feeding point. An antenna structure is formed by the first portion and the extension radiation element. The second circuit board is coupled to the electronic component. The electronic component and the second circuit board are both adjacent to the first portion. The RF module is coupled to the feeding point, so as to excite the antenna structure.

Abstract: An antenna device, including a circuit board, electronic components, a functional component module, an antenna module and a feed line, is provided. The electronic components are disposed on the circuit board and include a microprocessor and a wireless communication chip. The functional component module includes a carrier and a metal member disposed on the carrier. The antenna module includes a feed point, a ground point and a radiator, the feed and ground points are disposed on the carrier and electrically connected to both sides of the metal member respectively, and the ground point is electrically connected to the ground layer of the circuit board. The radiator includes at least a part of the metal member, while the feed line can transmit a wireless signal to the feed point to feed into the radiator. Therefore, the metal member can serve as the radiator to conserve the space of accommodating another radiator.

Abstract: A wireless communication device is provided. The wireless communication device includes a housing, a circuit board, a radio frequency module and an antenna. The housing has a frame and a back cover to define a receiving space. The circuit board is disposed in the receiving space, and defines a clearance area from the housing in the receiving space. The circuit board includes a ground terminal, a first feeding point, and a second feeding point. The antenna includes at least one metal conductor coupled to the first feeding point and the second feeding point, respectively, to provide a low frequency resonant path, a first middle frequency resonant path, a second middle frequency resonant path and a high frequency resonant path.