Patents by Inventor Hsiao-Wen Lee

Hsiao-Wen Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100150200
    Abstract: A micro-optic lens is disclosed. The micro-optic lens includes a substrate; and a lens element on the substrate, wherein the lens element includes a flat surface and an annularly grooved surface including first facets and second facets, and wherein the first facets collimate a light effectively and the second facets are parallel to a light. The micro-optic lens can decrease the draft loss and collimate the emitted light beams to increase the light efficiency. Further, the present invention also provides a method for designing angles of micro-optic lenses.
    Type: Application
    Filed: December 11, 2008
    Publication date: June 17, 2010
    Inventors: Chih-Chiang HO, Hsiao-Wen LEE
  • Patent number: 7703997
    Abstract: An image sensor module comprises an image sensor chip, at least one lens layer, and at least one bonding layer. The image sensor chip has an image capturing zone manufactured with an image capturing element, and a partition zone surrounding the image capturing zone. The at least one lens layer is stacked on the image sensor chip, having a transparent substrate and a lens mounted on the transparent substrate and adapted to focus the projected image onto the image capturing zone of the image sensor chip. The at least one bonding layer is arranged corresponding to the partition zone of the image sensor chip and bonded between the image sensor chip and the at least one lens layer, mixing of a glue agent and a plurality of spacer elements with which the height of each the spacer elements is determined to be the height of the bonding layer.
    Type: Grant
    Filed: January 16, 2007
    Date of Patent: April 27, 2010
    Assignee: Visera Technologies, Co., Ltd.
    Inventors: Hsiao-Wen Lee, Tzu-Han Lin, Pai-Chun Peter Zung, Chien-Pang Lin
  • Publication number: 20090294639
    Abstract: A wafer level image module includes a photo sensor for outputting an electrical signal upon receiving light, a lens set for focusing incident light onto the photo sensor, and an adjustment member disposed between the photo sensor and the lens set for controlling the distance between the photo sensor and the lens set to compensate the focus offset of the photo sensor for enabling the lens set to accurately focus the incident light onto the photo sensor in an in-focus manner so as to provide a high image quality.
    Type: Application
    Filed: August 11, 2009
    Publication date: December 3, 2009
    Inventors: Hsiao-Wen LEE, Pai-Chun Peter ZUNG, Tzu-Han LIN
  • Patent number: 7592680
    Abstract: A wafer level image module includes a photo sensor for outputting an electrical signal upon receiving light, a lens set for focusing incident light onto the photo sensor, and an adjustment member disposed between the photo sensor and the lens set for controlling the distance between the photo sensor and the lens set to compensate the focus offset of the photo sensor for enabling the lens set to accurately focus the incident light onto the photo sensor in an in-focus manner so as to provide a high image quality.
    Type: Grant
    Filed: September 28, 2006
    Date of Patent: September 22, 2009
    Assignee: Visera Technologies Company Ltd.
    Inventors: Hsiao-Wen Lee, Pai-Chun Peter Zung, Tzu-Han Lin
  • Publication number: 20090225431
    Abstract: An alignment device and applications thereof are disclosed. The device comprises a dam structure disposed on a first substrate, and a post disposed on a second substrate at a position corresponding to the dam structure. The dam structure comprises a groove. The post is disposed in the groove of the dam structure when bonding the first and second substrates.
    Type: Application
    Filed: March 7, 2008
    Publication date: September 10, 2009
    Inventor: Hsiao-Wen LEE
  • Publication number: 20090218650
    Abstract: An image sensor device is disclosed. The image sensor device comprises a substrate having a pixel region and at least one integrated circuit in the substrate of the pixel region. A photodiode is disposed on the substrate of the pixel region, comprising a lower electrode, a transparent upper electrode and a photoelectric conversion layer. The lower electrode is disposed on the substrate and is electrically connected to the integrated circuit. The photoelectric conversion layer is disposed on the lower electrode and has a submicron structure therein. The transparent upper electrode is disposed on the photoelectric conversion layer.
    Type: Application
    Filed: February 28, 2008
    Publication date: September 3, 2009
    Inventor: Hsiao-Wen LEE
  • Publication number: 20090174019
    Abstract: An image sensing device for receiving an incident light having an incident angle and photo signals formed thereby is provided. The image sensing device includes a micro prism and a micro lens for adjusting the incident angle and converging the incident light, respectively, a photo sensor for converting the photo signals into electronic signals, and an IC stacking layer for processing the electronic signals.
    Type: Application
    Filed: January 20, 2009
    Publication date: July 9, 2009
    Applicant: VISERA TECHNOLOGIES COMPANY LTD.
    Inventor: Hsiao-Wen Lee
  • Patent number: 7521724
    Abstract: A light emitting diode (LED) package and process of making the same includes a silicon-on-insulator (SOI) substrate that is composed of two silicon based materials and an insulation layer interposed therebetween. The two silicon based materials of silicon-on-insulator substrate are etched to form a reflective cavity and an insulation trench, respectively, for dividing the silicon-on-insulator substrate into contact surfaces of positive and negative electrodes. A plurality of metal lines are then formed to electrically connect the two silicon based materials such that the LED chip can be mounted on the reflective cavity and electrically connected to the corresponding electrodes of the silicon-on-insulator substrate by the metal lines. Thus the properties of heat resistance and heat dispersal can be improved and the process can be simplified.
    Type: Grant
    Filed: June 8, 2005
    Date of Patent: April 21, 2009
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Hung Chen, Shih-Yi Wen, Wu-Cheng Kuo, Bing-Ru Chen, Jui-Ping Weng, Hsiao-Wen Lee
  • Patent number: 7519262
    Abstract: The present invention relates to a fiber having a core of crystal fiber doped with chromium and a glass cladding. The fiber has a gain bandwidth of more than 300 nm including 1.3 mm to 1.6 mm in optical communication, and can be used as light source, optical amplifier and tunable laser when being applied for optical fiber communication. The present invention also relates to a method of making the fiber. First, a chromium doped crystal fiber is grown by laser-heated pedestal growth (LHPG). Then, the crystal fiber is cladded with a glass cladding by codrawing laser-heated pedestal growth (CDLHPG). Because it is a high temperature manufacture process, the cladding manufactured by this method is denser than that by evaporation technique, and can endure relative high damage threshold power for the pumping light.
    Type: Grant
    Filed: April 27, 2007
    Date of Patent: April 14, 2009
    Assignee: National Sun Yat-Sen University
    Inventors: Sheng-Lung Huang, Chia-Yao Lo, Kwang-Yao Huang, Shih-Yu Tu, Hsiao-Wen Lee, Sheng-Pan Huang, Sun-Bin Yin
  • Publication number: 20090078855
    Abstract: The present invention provides an image sensor which comprises improved microlenses to cope with different optical requirements for oblique incident light or different components of light. In one embodiment, the image sensor comprises at least two microlenses having different radii of curvature. In another embodiment, the image sensor comprises at least one asymmetrical microlens.
    Type: Application
    Filed: October 17, 2008
    Publication date: March 26, 2009
    Inventors: Chin-Chen Kuo, Wu-Chieh Liu, Hsiao-Wen Lee, Bii-Cheng Chang
  • Publication number: 20080303109
    Abstract: An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.
    Type: Application
    Filed: August 9, 2008
    Publication date: December 11, 2008
    Inventors: Hsiao-Wen Lee, Peter Zung, Tzu-Han Lin, Tzy-Ying Lin, Chia-Yang Chang, Chien-Pang Lin
  • Patent number: 7433555
    Abstract: An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.
    Type: Grant
    Filed: May 22, 2006
    Date of Patent: October 7, 2008
    Assignee: Visera Technologies Company Ltd
    Inventors: Hsiao-Wen Lee, Peter Zung, Tzu-Han Lin, Tzy-Ying Lin, Chia-Yang Chang, Chien-Pang Lin
  • Publication number: 20080225390
    Abstract: An optical microstructure plate and mold for fabricating the same is disclosed. The optical microstructure plate comprises a substrate. An optical microstructure element is formed on the substrate. A period alignment mark is disposed on the substrate to provide alignment for fabricating the optical microstructure element by a mold. A universal alignment mark is disposed on the substrate to provide alignment for bonding another plate therewith. Specifically, the mold comprises a concave within a mold substrate, a spoiler around the concave, and a buffer zone adjacent to the spoiler.
    Type: Application
    Filed: March 13, 2007
    Publication date: September 18, 2008
    Inventors: Chia-Yang Chang, Teng-Sheng Chen, Hsiao-Wen Lee, Sheng-Shin Guo
  • Publication number: 20080191334
    Abstract: Glass dam structures for imaging device chip scale package. An optoelectronic device chip scale package comprises a substrate configured as a support structure for the chip scale package. A semiconductor die with die circuitry is attached to the substrate. A glass encapsulant is disposed on the substrate encapsulating the semiconductor die, wherein the glass encapsulant has a dam structure around an opening. A seal layer is disposed between the substrate and the dam structure bonding the two together.
    Type: Application
    Filed: February 12, 2007
    Publication date: August 14, 2008
    Inventors: Hsiao-Wen Lee, Jui-Ping Weng
  • Publication number: 20080169480
    Abstract: An optoelectronic device package. The optoelectronic device package includes a substrate, a reflector formed on a first plane of the substrate, a cover bonded to the reflector to form a closed space, a plurality of microlenses formed on a first plane of the cover, a phosphor film formed on a second plane of the cover within the closed space, a thermal-conductive film formed on a second plane of the substrate, an electrode formed on the sidewall and the second plane of the substrate uncovered by the thermal-conductive film, and an optoelectronic device formed on the first plane of the substrate within the closed space. The invention also provides a method of packaging the optoelectronic device.
    Type: Application
    Filed: January 11, 2007
    Publication date: July 17, 2008
    Inventors: Jui-Ping Weng, Hsiao-Wen Lee
  • Patent number: 7352949
    Abstract: The present invention relates to a fiber having a core of crystal fiber doped with chromium and a glass cladding. The fiber has a gain bandwidth of more than 300 nm including 1.3 mm to 1.6 mm in optical communication, and can be used as light source, optical amplifier and tunable laser when being applied for optical fiber communication. The present invention also relates to a method of making the fiber. First, a chromium doped crystal fiber is grown by laser-heated pedestal growth (LHPG). Then, the crystal fiber is cladded with a glass cladding by codrawing laser-heated pedestal growth (CDLHPG). Because it is a high temperature manufacture process, the cladding manufactured by this method is denser than that by evaporation technique, and can endure relative high damage threshold power for the pumping light.
    Type: Grant
    Filed: November 24, 2004
    Date of Patent: April 1, 2008
    Assignee: National Sun Yat-Sen University
    Inventors: Sheng-Lung Huang, Chia-Yao Lo, Kwang-Yao Huang, Shih-Yu Tu, Hsiao-Wen Lee, Sheng-Pan Huang, Sun-Bin Yin
  • Publication number: 20080011936
    Abstract: The present invention provides an image sensor which comprises improved microlenses to cope with different optical requirements for oblique incident light or different components of light. In one embodiment, the image sensor comprises at least two microlenses having different radii of curvature. In another embodiment, the image sensor comprises at least one asymmetrical microlens.
    Type: Application
    Filed: July 14, 2006
    Publication date: January 17, 2008
    Inventors: Chin-Chen Kuo, Wu-Chieh Liu, Hsiao-Wen Lee, Bii-Cheng Chang
  • Publication number: 20070279520
    Abstract: A package module for an image sensing device is provided. The package module includes a substrate having thereon a photoelectric element array, a first optical element array formed on the photoelectric element array, a package lid having thereon a second optical element array opposite to the first optical element array and having an arrangement corresponding to that of the first optical element array; and a spacer disposed on a bonding area between the package lid and the substrate for adjusting a distance between the package lid and the substrate.
    Type: Application
    Filed: February 20, 2007
    Publication date: December 6, 2007
    Applicant: VISERA TECHNOLOGIES COMPANY, LTD.
    Inventors: Hsiao-Wen Lee, Chih-Kung Chang, Pai-Chun Peter Zung, Chien-Pang Lin
  • Patent number: D595451
    Type: Grant
    Filed: July 2, 2008
    Date of Patent: June 30, 2009
    Assignee: Bright LED Electronics Corp.
    Inventor: Hsiao-Wen Lee
  • Patent number: D597249
    Type: Grant
    Filed: October 3, 2008
    Date of Patent: July 28, 2009
    Assignee: Bright LED Electronics Corp.
    Inventor: Hsiao-Wen Lee