Abstract: A device includes a transistor switch coupled between a bit line voltage node and a ground node and a boost signal circuit coupled to a gate node of the transistor switch, where the boost signal circuit providing a boost signal responsive to a write enable signal. The device also includes a first delay element and a first capacitor in series with the first delay element. The first capacitor has a first end coupled to the bit line voltage node and a second end coupled to the gate node through the first delay element.

Abstract: A semiconductor memory comprises a plurality of sub banks each including one or more rows of memory bit cells connected to a set of local bit lines, wherein the sub banks share a same set of global bit lines for reading/writing data from/to the memory bit cells of the sub banks. The semiconductor memory chip further comprises a plurality of switch elements for each of the sub banks, wherein each of the switch elements connects the local bit line and the global bit line of a corresponding one of the memory bit cells in the sub bank for data transmission between the local bit line and the global bit line. The semiconductor memory chip further comprises a plurality of bank selection signal lines each connected to the switch elements in a corresponding one of the sub banks, wherein the bank selection signal lines carry a plurality of bank selection signals to select one of the sub banks for data transmission between the local bit lines and the global bit lines.

Abstract: A device includes a transistor switch coupled between a bit line voltage node and a ground node and a boost signal circuit coupled to a gate node of the transistor switch, where the boost signal circuit providing a boost signal responsive to a write enable signal. The device also includes a first delay element and a first capacitor in series with the first delay element. The first capacitor has a first end coupled to the bit line voltage node and a second end coupled to the gate node through the first delay element.

Abstract: A device includes a transistor switch coupled between a bit line voltage node and a ground node and a boost signal circuit coupled to a gate node of the transistor switch, where the boost signal circuit providing a boost signal responsive to a write enable signal. The device also includes a first delay element and a first capacitor in series with the first delay element. The first capacitor has a first end coupled to the bit line voltage node and a second end coupled to the gate node through the first delay element.

Abstract: A device includes a transistor switch coupled between a bit line voltage node and a ground node and a boost signal circuit coupled to a gate node of the transistor switch, where the boost signal circuit providing a boost signal responsive to a write enable signal. The device also includes a first delay element and a first capacitor in series with the first delay element. The first capacitor has a first end coupled to the bit line voltage node and a second end coupled to the gate node through the first delay element.

Abstract: The propagation delay of a signal through multiple load devices coupled sequentially along a conductor is improved by separating a subset of the load devices that is more distant from the signal source, and coupling the more distant subset to the signal through a fly-over conductor that bypasses the subset that is nearer to the signal source. The technique is applicable to subsets of bit cells in a random access memory (SRAM) coupled to a given word line, or to word line decoder gates coupled sequentially to a strobe signal, as well as other circuits wherein load devices selectable as a group can be divided into subsets by proximity to the signal source. In an SRAM layout with multiple levels, different metal deposition layers carry the conductor legs between the load devices versus the fly-over conductor bypassing the nearer subset.

Abstract: A semiconductor memory comprises a plurality of sub banks each including one or more rows of memory bit cells connected to a set of local bit lines, wherein the sub banks share a same set of global bit lines for reading/writing data from/to the memory bit cells of the sub banks. The semiconductor memory chip further comprises a plurality of switch elements for each of the sub banks, wherein each of the switch elements connects the local bit line and the global bit line of a corresponding one of the memory bit cells in the sub bank for data transmission between the local bit line and the global bit line. The semiconductor memory chip further comprises a plurality of bank selection signal lines each connected to the switch elements in a corresponding one of the sub banks, wherein the bank selection signal lines carry a plurality of bank selection signals to select one of the sub banks for data transmission between the local bit lines and the global bit lines.

Abstract: An internal clock gating apparatus comprises a static logic block and a domino logic block. The static logic block is configured to receive a clock signal and a clock enable signal. The domino logic block is configured to receive the clock signal and a control signal from an output of the static logic block. The static logic block and the domino logic block are further configured such that an output of the domino logic block generates a signal similar to the clock signal in phase when the clock enable signal has a logic high state. On the other hand, the output of the domino logic block generates a logic low signal when the clock enable signal has a logic low state. Furthermore, the static logic block and the domino logic block can reduce the setup time and delay time of the internal clock gating apparatus respectively.

Abstract: The propagation delay of a signal through multiple load devices coupled sequentially along a conductor is improved by separating a subset of the load devices that is more distant from the signal source, and coupling the more distant subset to the signal through a fly-over conductor that bypasses the subset that is nearer to the signal source. The technique is applicable to subsets of bit cells in a random access memory (SRAM) coupled to a given word line, or to word line decoder gates coupled sequentially to a strobe signal, as well as other circuits wherein load devices selectable as a group can be divided into subsets by proximity to the signal source. In an SRAM layout with multiple levels, different metal deposition layers carry the conductor legs between the load devices versus the fly-over conductor bypassing the nearer subset.

Abstract: An internal clock gating apparatus comprises a static logic block and a domino logic block. The static logic block is configured to receive a clock signal and a clock enable signal. The domino logic block is configured to receive the clock signal and a control signal from an output of the static logic block. The static logic block and the domino logic block are further configured such that an output of the domino logic block generates a signal similar to the clock signal in phase when the clock enable signal has a logic high state. On the other hand, the output of the domino logic block generates a logic low signal when the clock enable signal has a logic low state. Furthermore, the static logic block and the domino logic block can reduce the setup time and delay time of the internal clock gating apparatus respectively.