Patents by Inventor Hsiao-Yi Hsieh

Hsiao-Yi Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090151997
    Abstract: An exemplary embodiment of a circuit board is provided. The circuit board is compatible to a first chip with a first pin number, and a second chip with a second pin number, comprising a plurality of first pads, second pads and third pads. The arrangements of the first and second pads are fit to the pin arrangement of the first chip, and the arrangements of the first and third pads are fit to the pin arrangement of the second chip. The first chip can be placed on the circuit board via the first and second pads, and the second chip can be placed on the circuit board via the first and third pads.
    Type: Application
    Filed: March 11, 2008
    Publication date: June 18, 2009
    Applicant: ALI CORPORATION
    Inventors: Hsiao-Yi Hsieh, Ren-Shuo Liu