Abstract: A semiconductor package assembly is provided. The semiconductor package assembly includes first semiconductor die, a second semiconductor die and a memory package. The first semiconductor die and the second semiconductor die are stacked on each other. The first semiconductor die includes a first interface and a third interface. The first interface overlaps and is electrically connected to the second interface arranged on the second semiconductor die. The third interface is arranged on a first edge of the first semiconductor die. The memory package is disposed beside the first semiconductor die, wherein the memory package is electrically connected to the first semiconductor die by the third interface.

Abstract: Various embodiments of a 3DIC die package, including trench capacitors integrated with IC dies, are disclosed. A 3DIC die package includes a first IC die and a second IC die disposed on the first IC die. The first IC die includes a substrate having a first surface and a second surface opposite to the first surface, a first active device disposed on the first surface of the substrate, and a passive device disposed on the second surface of the substrate. The passive device includes a plurality of trenches disposed in the substrate and through the second surface of the substrate, first and second conductive layers disposed in the plurality of trenches and on the second surface of the substrate, and a first dielectric layer disposed between the first and second conductive layers. The second IC die includes a second active device.

Abstract: A semiconductor package structure includes a first redistribution layer, a first semiconductor die, a second through via, a molding material, a second semiconductor die, and a second redistribution layer. The first semiconductor die is disposed over the first redistribution layer and includes a first through via having a first width. The second through via is adjacent to the first semiconductor die and has a second width. The second width is greater than the first width. The molding material surrounds the first semiconductor die and the second through via. The second semiconductor die is disposed over the molding material and is electrically coupled to the first through via and the second through via. The second redistribution layer is disposed over the second semiconductor die.

Abstract: A semiconductor assembly package is provided. The semiconductor package assembly includes a system-on-chip (SOC) package, a memory package and a heat spreader. The SOC package includes a logic die and a first substrate. The logic die has pads on it. The first substrate is electrically connected to the logic die by the pads. The memory package includes a second substrate and a memory die. The second substrate has a top surface and a bottom surface. The memory die is mounted on the top surface of the second substrate and is electrically connected to the second substrate using bonding wires. The heat spreader is disposed between the SOC package and the memory package, wherein the heat spreader is in contact with a back surface of the logic die away from the pads.

Abstract: The disclosure of the preset invention relates to a new method for preventing or treating tumor progression or tumor recurrence comprising administering to a subject in need thereof a therapeutically effective amount of an agent disrupting Musashi-1 (MSI1)/Argonaute 2 (AGO2) interaction. A composition or pharmaceutical composition for preventing or treating tumor progression or tumor recurrence is also provided, which comprises an agent disrupting Musashi-1 (MSI1)/Argonaute 2 (AGO2) interaction.

Abstract: A light bar includes a circuit board, a plurality of light emitting units, a connector and a frame module. The light emitting units are disposed on the circuit board. The connector is disposed on the circuit board. The frame module includes a plurality of frames arranged side by side. Each of the frames includes an accommodating recess. The circuit board is accommodated in the accommodating recess of each frame. The connector is located between a first end and a second end of the frame module, wherein the first end is opposite to the second end.

Abstract: A backlight module includes a light-guiding plate, a plurality of reflection spots, and a light source. The reflection spots are disposed on a back surface of the light-guiding plate. Light emitted by the light source enters the light-guiding plate through a light input side surface of the light-guiding plate, and is reflected by the reflection spots to emit out of the light-guiding plate through a light output surface of the light-guiding plate. The back surface includes a central portion and a fringe portion. The fringe portion extends along an edge of the back surface. The distribution density of the reflection spots on the fringe portion gradually decreases in a direction from the central portion toward the fringe portion.

Abstract: A display device including a back plate, a light emitting module, a light guide plate and a fixing member is provided. The back plate has an inner surface and an outer surface opposite to the inner surface. The light emitting module is disposed on a side of the inner surface of the back plate. The light guide plate is disposed opposite to the inner surface of the back plate. The fixing member includes a portion, which leans on the outer surface of the back plate.

Abstract: A light bar includes a circuit board, a plurality of light emitting units, a connector and a frame module. The light emitting units are disposed on the circuit board. The connector is disposed on the circuit board. The frame module includes a plurality of frames arranged side by side. Each of the frames includes an accommodating recess. The circuit board is accommodated in the accommodating recess of each frame. The connector is located between a first end and a second end of the frame module, wherein the first end is opposite to the second end.

Abstract: A display device including a casing, a frame member, a plate member and a display panel is provided. The frame member includes a frame body and a protruding column disposed on the frame body and protruded in a direction from the frame body towards the casing. The plate member is disposed on the frame body and has an opening, which allows the protruding column to pass through, wherein the protruding column fixes relative position between the frame body and the plate member. The display panel is disposed on the frame body.

Abstract: A backlight module includes a light-guiding plate, a plurality of reflection spots, and a light source. The reflection spots are disposed on a back surface of the light-guiding plate. Light emitted by the light source enters the light-guiding plate through a light input side surface of the light-guiding plate, and is reflected by the reflection spots to emit out of the light-guiding plate through a light output surface of the light-guiding plate. The back surface includes a central portion and a fringe portion. The fringe portion extends along an edge of the back surface. The distribution density of the reflection spots on the fringe portion gradually decreases in a direction from the central portion toward the fringe portion.

Abstract: A display device including a casing, a frame member, a plate member and a display panel is provided. The frame member includes a frame body and a protruding column disposed on the frame body and protruded in a direction from the frame body towards the casing. The plate member is disposed on the frame body and has an opening, which allows the protruding column to pass through, wherein the protruding column fixes relative position between the frame body and the plate member. The display panel is disposed on the frame body.

Abstract: A display device including a back plate, a light emitting module, a light guide plate and a fixing member is provided. The back plate has an inner surface and an outer surface opposite to the inner surface. The light emitting module is disposed on a side of the inner surface of the back plate. The light guide plate is disposed opposite to the inner surface of the back plate. The fixing member includes a portion, which leans on the outer surface of the back plate.

Abstract: The disclosure of the preset invention relates to a new method for preventing or treating tumor progression or tumor recurrence comprising administering to a subject in need thereof a therapeutically effective amount of an agent disrupting Musashi-1 (MSI1)/Argonaute 2 (AGO2) interaction. A composition or pharmaceutical composition for preventing or treating tumor progression or tumor recurrence is also provided, which comprises an agent disrupting Musashi-1 (MSI1)/Argonaute 2 (AGO2) interaction.

Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a method of manufacturing a device includes coupling a first semiconductor device to a second semiconductor device by spacers. The first semiconductor device has first contact pads disposed thereon, and the second semiconductor device has second contact pads disposed thereon. The method includes forming an immersion interconnection between the first contact pads of the first semiconductor device and the second contact pads of the second semiconductor device.

Abstract: A method includes performing a first strike process to strike a metal bump of a first package component against a metal pad of a second package component. A first one of the metal bump and the metal pad includes copper. A second one of the metal bump and the metal pad includes aluminum. The method further includes performing a second strike process to strike the metal bump against the metal pad. An annealing is performed to bond the metal bump on the metal pad.

Abstract: A method of producing a solder bump joint includes heating a solder bump comprising tin above a melting temperature of the solder bump, wherein the solder bumps comprises eutectic Sn—Bi compound, and the eutectic Sn—Bi compound is free of Ag. The method further includes stretching the solder bump to increase a height of the solder bump, wherein stretching the solder bump forms lamellar structures having a contact angle of less than 90°. The method further includes cooling down the solder bump.

Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a method of manufacturing a device includes coupling a first semiconductor device to a second semiconductor device by spacers. The first semiconductor device has first contact pads disposed thereon, and the second semiconductor device has second contact pads disposed thereon. The method includes forming an immersion interconnection between the first contact pads of the first semiconductor device and the second contact pads of the second semiconductor device.

Abstract: A method includes performing a first strike process to strike a metal bump of a first package component against a metal pad of a second package component. A first one of the metal bump and the metal pad includes copper. A second one of the metal bump and the metal pad includes aluminum. The method further includes performing a second strike process to strike the metal bump against the metal pad. An annealing is performed to bond the metal bump on the metal pad.

Abstract: A method includes performing a first strike process to strike a metal bump of a first package component against a metal pad of a second package component. A first one of the metal bump and the metal pad includes copper. A second one of the metal bump and the metal pad includes aluminum. The method further includes performing a second strike process to strike the metal bump against the metal pad. An annealing is performed to bond the metal bump on the metal pad.