Patents by Inventor Hsie-Kun Chu

Hsie-Kun Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INJECTION MOLDING PROCESS, APPARATUS AND MATERIAL FOR FORMING CURED-IN-PLACE GASKETS
    Publication number: 20110133366
    Abstract: The present disclosure relates to liquid injection molding of gaskets. More particularly, the present disclosure relates to a low pressure and room temperature process for forming a cured-in-place gasket by liquid injection molding and to equipment useful with this process.
    Type: Application
    Filed: August 5, 2010
    Publication date: June 9, 2011
    Applicant: Henkel Corporation
    Inventors: Thomas Fay-Oy Lim, Robert P. Cross, Hsie-Kun Chu, Debora E. Duch, Mathias E. Liistro, JR., Alfred A. DeCato, Anthony R. Horelik, James E. Lionberger, Gregory A. Krueger