Patents by Inventor Hsieh-Kun Lee Lee

Hsieh-Kun Lee Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7363966
    Abstract: A heat dissipating device (1) includes a heat spreader (10), a radiator (2), at least one U-shaped heat pipe (12), a fan (3) mounted on the radiator and a pair of clips (4). The radiator includes a first heat sink (20) and a second heat sink (22). The first heat sink (20) includes a first base (200) and a plurality of fins (202) extending from a side of the first base. The second heat sink (22) includes a second base (220) and a plurality of fins (222) extending from a side of the second base. The heat pipe (12) includes an evaporating portion (120) attached to the heat spreader and a pair of condensing portions (122) extending upwardly from opposite ends of the evaporating portion. The two condensing portions are sandwiched between the first base and the second base. The heat pipe transfers heat from the heat spreader to both of the first base and second base.
    Type: Grant
    Filed: May 23, 2005
    Date of Patent: April 29, 2008
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Guang Yu, Hsieh-Kun Lee Lee, Cui-Jun Lu