Patents by Inventor Hsieh-Kun Lee
Hsieh-Kun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7230828Abstract: A heat dissipation device (30) includes a heat dissipation member (31), a positioning member (33) and a mating member (34). The heat dissipation member includes a fin set (311) and a post (312) in the fin set. The post extends through the positioning member and is mated with the mating member so that the positioning member is positioned between the fin set and the mating member.Type: GrantFiled: September 21, 2004Date of Patent: June 12, 2007Assignees: Fu Zhun Precision Ind. (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Hsieh Kun Lee, Cui Jun Lu, MingXian Sun
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Publication number: 20070097630Abstract: A fan duct (8) buckled to a fan (7) is mounted in a computer enclosure (4) having an upper panel (44) defining a plurality of apertures (440). The fan duct includes a first open portion (80) having a first opening (804) and a second open portion (82) having a second opening (822). The first open portion comprises two opposite lateral flanges (802). Each flange forms a pair of latches (806, 808) buckled to the fan to prevent removal of the fan duct in the horizontal direction. A pair of resilient tabs (824) is formed at two opposite lateral sides of the second opening. The tabs are pressed by the upper panel of the computer enclosure to confine the fan duct to move upwardly. The second opening communicates with the apertures and the first opening communicates with the fan.Type: ApplicationFiled: November 1, 2005Publication date: May 3, 2007Applicant: Foxconn Technology Co., Ltd.Inventors: Hsieh-Kun Lee, Chun-Chi Chen, Shin-Hsun Wung, Yu Huang
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Publication number: 20070097625Abstract: An electronic assembly includes a printed circuit aboard, a CPU, an electronic component and a thermal pad attached to the printed circuit board. The CPU and the electronic component are located on a first face of the printed circuit board. The electronic component is located near the CPU. The thermal pad is attached to a second face opposite to the first face of the printed circuit board and located just below the electronic component.Type: ApplicationFiled: November 1, 2005Publication date: May 3, 2007Applicant: Foxconn Technology Co., Ltd.Inventors: Yong-Dong Chen, Guang Yu, Shin-Hsuu Wung, Chun-Chi Chen, Hsieh-Kun Lee
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Publication number: 20070097632Abstract: A heat dissipating device (8) includes a heat sink (40), a first and a second fixing members (2, 3) mounted on the heat sink, a lever (1) pivotably mounted to the second fixing member, a fan holder (5) and a fan (6) mounted on the fan holder. A pair of mounting holes (26) is defined in the first fixing member. A catch (38) is bent from the second fixing member for clasping the lever. The fan holder includes a pair of tongues engaged in the mounting holes of the first fixing member, and a U-shaped receiving portion (58) receiving and downwardly pressed by the lever.Type: ApplicationFiled: November 1, 2005Publication date: May 3, 2007Applicant: Foxconn Technology Co., Ltd.Inventors: Hsieh-Kun Lee, Chun-Chi Chen, Shin-Hsuu Wung, Guang Yu, Yong-Dong Chen
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Publication number: 20070095509Abstract: A heat dissipation device includes a heat sink (10) and a heat pipe (20). The heat sink includes a base (12), a fins group (16) extending from the base, and a cover (14) contacting with the fins group. The heat pipe surrounds top and bottom and two opposite sides of the fins group and thermally connects with the base and the cover.Type: ApplicationFiled: November 2, 2005Publication date: May 3, 2007Applicant: Foxconn Technology Co., Ltd.Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Bin Tan, Zhi-Yong Zhou, Jiang-Jian Wen
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Patent number: 7209356Abstract: A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (10?) mounted on an opposite side of the card, a pair of heat pipes (40) independent from and intercrossed with each other and connected between the first and second heat sinks for transferring heat from the first heat sink to the second heat sink, a pair of covers (26) attached on the respective first and second heat sinks to form enclosed channels (15) between the covers and the first and second heat sinks respectively, a pair of fans (22) mounted between the covers and the first and second heat sinks for producing airflow through the channels to improve heat dissipation efficiency of the heat dissipation device.Type: GrantFiled: August 18, 2004Date of Patent: April 24, 2007Assignees: Fu Zhun Precision Ind? (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Hsieh Kun Lee, Wan Lin Xia, HeBen Liu
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Patent number: 7203066Abstract: A heat sink assembly includes a heat sink (20) and a pair of clips (10) attached on opposite sides of the heat sink for securing the heat sink to an electronic component (40). The heat sink includes a base (22) and a plurality of fins (24). A pair of protrusions (28) is formed on bottom portions of adjacent two fins. A locking slot (29) is therefore formed between the base, the two adjacent fins, and the protrusions. The clip includes a pressing portion (12) squeenzedly received in the locking slot, a pair of extension portions (14) extending from opposite ends of the pressing portion, and a pair of hooks (16) formed on free ends of the extension portions. When the clips are deformed to cause the hooks to engage with the electronic component, the pressing portions of the clips press the heat sink toward the electronic component.Type: GrantFiled: July 28, 2004Date of Patent: April 10, 2007Assignees: Fu Zhun Precision Ind. (Shenzhen) Co., Ltd., Foxcon Technology Co., Ltd.Inventors: Hsieh Kun Lee, Dongyun Lee, Zhijie Zhang, Hong Bo Shi
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Publication number: 20070077880Abstract: An airflow-guiding device for being mounted into a computer system to periodically change airflow passing therethrough, comprises a motor, a gearing driven by the motor and a plurality of airflow-guiding plates pivoted to a frame and linked to the gearing and driven thereby to turn back and forth periodically. The gearing comprises a cam driven by the motor and a sliding board slideably mounted on a supporting member. The sliding board has a lateral side always in contact with the cam so that when the cam rotates, the sliding plate slides on the supporting member. The airflow-guiding plates each have a linking rod linked to the sliding board. The airflow-guiding plates periodically turn within a given angle following the rotation of the cam so as to change direction of airflow passing through the airflow-guiding plates.Type: ApplicationFiled: October 3, 2005Publication date: April 5, 2007Applicant: Focxonn Technology Co., Ltd.Inventors: Hsieh-Kun Lee, Chun-Chi Chen, Shi-Wen Zhou, Chi Liang
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Patent number: 7190588Abstract: A heat-dissipating fin assembly (1) includes a plurality of individual fin plates (12) arranged side by side. Each fin plate includes a main body (14). First and second flanges (16, 18) extend perpendicularly from opposite edges of the main body of each fin plate. A pair of spaced first bridge-shaped tabs (20) extends perpendicularly from the first flange toward the second flange. A pair of spaced second bridge-shaped tabs (24) extends perpendicularly from the second flange toward the first flange. Projections (28) are stamped from the main body opposing to the first and second bridge-shaped tabs. The tabs of each fin plate are interlocked with the projections of an adjacent fin plate. In this manner, all the fin plates are assembled together. The heat-dissipating fin assembly is thus formed.Type: GrantFiled: May 23, 2005Date of Patent: March 13, 2007Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Hsieh-Kun Lee, Wan-Lin Xia, Bao-Chun Chen, Neng-Bin Li
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Patent number: 7190584Abstract: A retainer (20) for a heat sink includes a supporting member (22), a bracket member (24), a pair of locking members (26) and an operating member (28). The supporting member defines a pair of openings (222) at opposite ends thereof. The bracket member is located above the supporting member and has a pair of abutting portions (246) extending therefrom. The locking members respectively pass through the openings of the supporting member and are pivotably attached to the bracket member. Each locking member has a spring portion (264) depressed on one of said abutting portions to maintain the locking member at a releasing position. The operating member is pivotable relative to the bracket member to cause the bracket member and the associated locking members to move upward and the supporting member to drive the locking members to turn toward each other to a locking position.Type: GrantFiled: December 21, 2004Date of Patent: March 13, 2007Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Hsieh-Kun Lee, Dong-Yun Li, Hong-Bo Shi, Min Li
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Patent number: 7180743Abstract: A fastener for a heat sink of the present invention includes a length-variable operating member (10), a piston member (20), an embracing member (30), a resilient member (40) and a post (58) extending from a printed circuit board (50). The piston member is movable in the operating member when the operating member varies between a shortest length and a longest length. The resilient member covers around the piston member. The embracing member is controllable cooperatively by the piston member and the resilient member to grasp the post or release the post.Type: GrantFiled: November 16, 2004Date of Patent: February 20, 2007Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.Inventors: Chun-Chi Chen, Shi-Wen Zhou, Hsieh-Kun Lee
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Publication number: 20070029072Abstract: A heat dissipation device comprises a heat spreader for contacting an electronic device for absorbing heat therefrom. A plurality of fins is formed on the heat spreader. A first heat sink is separated from the heat spreader and comprises a first base substantially perpendicular to the heat spreader and a plurality of first fins formed on the first base. A second heat sink comprises a second base connecting with the first base and a plurality of second fins formed on the second base. Two heat pipes connect the heat spreader with the first base and the second base via opposite sides of the heat dissipation device. The heat pipes are partly sandwiched between the first base and the second base and transfers heat from the heat spreader to both of the first and the second heat sink.Type: ApplicationFiled: January 30, 2006Publication date: February 8, 2007Applicant: Foxconn Technology Co., Ltd.Inventors: Hsieh-Kun Lee, Wan-Lin Xia, Tao Li, Mix-Qi Xiao
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Patent number: 7167370Abstract: A fastener (10) for mounting a heat-radiator (20) to an electronic device (30) on a circuit board (40) is disclosed. The heat-radiator and the circuit board have aligned holes (22, 44). The fastener includes a head (11) having an upper portion (112) with a large diameter and a lower portion (113) with a smaller diameter, a cylindrical spring (14) captured around the lower portion of the head for exerting a spring force against the heat-radiator, and a metallic wire (15) having a first end portion fixed on said head and a second end portion bent to form an engaging portion (152). The engaging portion of the metallic wire compressively passes through the aligned holes of the heat-radiator and the circuit board and is engaged with an underside of the circuit board.Type: GrantFiled: September 23, 2004Date of Patent: January 23, 2007Assignees: Fu Zhun Precision Ind (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Hsieh Kun Lee, Wan-Lin Xia, Xue-Wen Peng, Jin-Song Feng
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Patent number: 7164583Abstract: A mounting device (10) for mounting a heat sink (20) to a circuit board (40), includes a locking member (16) extending through the heat sink and including a through hole (162) and barbs (172) formed in one end portion thereof for engaging with the circuit board, an operation member (12) including a cylinder (122) and a rod (128) extending from the cylinder into the through hole of the locking member. First and second bumps (178, 179) are formed in the locking member, and a pair of slots (126) is defined in the cylinder for engaging with the first and second bumps at first and second positions respectively. A spring (14) is received in the cylinder, surrounding the rod and compressed between an end of the cylinder and the first bumps. The rod expands the barbs outwardly at the second position and releases the barbs at the first position.Type: GrantFiled: September 21, 2004Date of Patent: January 16, 2007Assignees: Fu Zhun Precision Ind. (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Hsieh Kun Lee, Wan-Lin Xia, He-Ben Liu
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Patent number: 7156160Abstract: A liquid cooling system includes a container (10) defining communicable first and second chambers (125a, 125b) therein, a pump (15) mounted on the container and having an entrance port (152) in flow communication with the second chamber, and an exit port (150) in flow communication with the first chamber so that the pump, the first chamber, and the second chamber together form a loop for circulation of coolant, and a heat dissipation unit (2) located at the loop for cooling the coolant.Type: GrantFiled: September 21, 2004Date of Patent: January 2, 2007Assignees: Fu Zhun Precision Ind. (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Hsieh Kun Lee, Cheng-tien Lai, Shi-Wen Zhou
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Publication number: 20060289150Abstract: A heat dissipation device includes a heat sink (10) and at least a serpent heat pipe (22). The heat sink (10) comprises a base (12) contacting with an electrical component, a heat dissipation fins group (14) secured to the base (12) and a cover (16) attached to a top of the heat dissipation fins group (14). The heat dissipating fins group (14) defines a notch (148) at one side thereof. Two end portions of the heat pipe (22) are respectively connected to the base (12) and the cover (16), and a middle portion of the heat pipe (22) is accommodated in the notch (148).Type: ApplicationFiled: June 24, 2005Publication date: December 28, 2006Applicant: Foxconn Technology Co., Ltd.Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Bin Tan
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Publication number: 20060291169Abstract: A heat dissipation device includes a heat sink, a retention module and a clip having two clipping portions for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat generating electronic device. The base defines two flutes in two opposite sides thereof respectively. Each of the flutes is located at a middle of a corresponding one of the two opposite sides. The retention module is located around the electronic device and includes a bottom wall for supporting the heat sink. Each clipping portion is rotatablely connected to the retention module and includes a pressing portion which is rotatablely received in the flute of the base and presses the base to the bottom wall of the retention module when the clip is rotated to a position locked to the retention module.Type: ApplicationFiled: June 24, 2005Publication date: December 28, 2006Applicant: Foxconn Technology Co., Ltd.Inventors: Hsieh-Kun Lee, Wan-Lin Xia, Bao-Chun Chen
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Publication number: 20060291172Abstract: A heat dissipation device for being installed to and cooling an electronic card device (40) includes first and second heat dissipation units (10, 20) and at least one heat pipe (30). The heat dissipation units each include a base plate (12, 22) and a fin plate (14, 24) engaged with the base plate. The at least one heat pipe includes an evaporating segment (32) received between the base plate and the fin plate of the first heat dissipation unit, and a condensing segment (34) received between the base plate and the fin plate of the second heat dissipation unit, thereby connecting the first and second heat dissipation units together.Type: ApplicationFiled: June 24, 2005Publication date: December 28, 2006Applicant: Foxconn Technology Co., Ltd.Inventors: Hsieh-Kun Lee, Xue-Wen Peng, Bing Chen, Rui-Hua Chen
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Publication number: 20060279933Abstract: An electronic assembly includes a PCB (20), a socket (22) mounted on the PCB, a CPU (24) connected with the socket, a heat sink (10) in thermal contact with the CPU, a foldable back plate (30) attached to an underside of the PCB and a base plane (40) forming four bridges (42). The back plate includes a first piece section (32) and a second piece section (34) pivotally joined together by a pivot (36). The first and the second piece sections each comprise two legs inserted into two corresponding bridges. Screws are used to extend through the heat sink, the PCB, the bridges to threadedly engage with the legs of the back plate, respectively. The pivot is located under a part of the PCB at which the CPU is mounted.Type: ApplicationFiled: November 8, 2005Publication date: December 14, 2006Applicant: Foxconn Technology Co., Ltd.Inventors: Hsieh-Kun Lee, Chun-Chi Chen, Shin-Hsuu Wung, Yu Huang
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Patent number: 7147043Abstract: A liquid cooling system includes a cooling body (1) defining an hollow portion receiving a pump (3) and a number of cooling fins (18) therein, and a contact portion for contacting an electrical component. The cooling body defines a passageway therein filled with liquid coolant, and an inlet (124) and an outlet (125) both in communication with the passageway. The pump defines an exit (31) and an entrance (32) connected to the inlet and the outlet of the cooling body respectively by two tubes (5). Heat is transferred from the electrical component to the contact portion, and then conducted to the coolant, and conducted to other portions of the cooling body as the coolant flows through the passageway. The heat is then conducted to the cooling fins for dissipation.Type: GrantFiled: July 27, 2004Date of Patent: December 12, 2006Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: Hsieh Kun Lee, Cheng-Tien Lai, Shi Wen Zhou