Abstract: The present invention provides phthalate free impact resistant polypropylene copolymer and methods of preparation, which are produced directly from the polymerization reactor system without further compounding of components which significantly alters the physical properties of the resulting polymer. The copolymer according to the present invention possesses both low temperature ductility and high flexural modulus, wherein said polymer is produced in the presence of a phthalate free ZN catalyst comprising urea component.

Abstract: In an embodiment, a method includes: forming a fin extending from a substrate, the fin having a first width and a first height after the forming; forming a dummy gate stack over a channel region of the fin; growing an epitaxial source/drain in the fin adjacent the channel region; and after growing the epitaxial source/drain, replacing the dummy gate stack with a metal gate stack, the channel region of the fin having the first width and the first height before the replacing, the channel region of the fin having a second width and a second height after the replacing, the second width being less than the first width, the second height being less than the first height.

Abstract: A button mechanism includes a button, a module, and a thin sheet spring. The thin sheet spring is in physical communication with the button and with the module. The thin sheet spring exerts a tension force on the button and the module to bias the button toward a normal position. In response to a force greater than the tension force being exerted on the button, a portion of the thin sheet stretches to enable the button to be placed in a contact position. In response to the force being removed from the button, the tension force causes the thin sheet to snap back to an original position and biases the button toward the normal position.

Abstract: A display device includes a light guide plate, at least one illuminating element, a side frame, and a display panel. The light guide plate includes a main body and at least one light-incident protrusion part. The main body has a light-emitting surface. The light-incident protrusion part is connected to the main body and has a light-incident surface. The illuminating element is arranged along the light-incident surface and is capable of emitting a light beam. The light beam enters the light guide plate from the light-incident surface and leaves the light guide plate from the light-emitting surface. The side frame is located on the light guide plate. The display panel is located between the light guide plate and the side frame. The side frame and the display panel expose the light-incident protrusion part. The side frame of the display device described herein has the small width.

Abstract: A touch panel includes a transparent substrate and a touch module disposed thereon. The touch module includes a first stack structure that includes the following elements. A transparent carrying layer has an active area, an extending area, and a plurality of bending segments respectively connecting the active area and the extending area. A patterned conductive layer has an electrode pattern area and a plurality of bonding pads that extend from the electrode pattern area disposed on the active area. A plurality of extending wires connect the bonding pads, and extend to the extending area. A transparent adhesive layer covers the electrode pattern area. A wire protection layer covers a portion of each extending wire on the corresponding extending area. The transparent adhesive layer covers a portion of the bonding pads.

Abstract: A touch panel including a transparent substrate, a touch module and a flexible circuit board is provided. The touch module is disposed on the transparent substrate. The flexible circuit board has a bonding segment, a bending segment and extending segment. The bonding segment is bonded to the touch module. The bending segment is located between the bonding segment and the extending segment. The bending segment has a bending line, and the bending segment is bended along the bending line.

Abstract: The present invention discloses systems and methods for storing pictures on a cloud platform and printing the pictures from different locations. The system may include a first network device to upload a plurality of image files to a private space on a cloud platform, the cloud platform selectively assigning a unique access code to a set of image files or a single image file within the plurality of image files, and a second network device, which is different from the first network device. The second network device may include a transmitter to communicate with the cloud platform electronically so as to access related image files utilizing the unique access code, wherein the set of image files or the single image file within the plurality of image files may have a respective privacy setting.

Abstract: A display device includes a light guide plate, at least one illuminating element, a side frame, and a display panel. The light guide plate includes a main body and at least one light-incident protrusion part. The main body has a light-emitting surface. The light-incident protrusion part is connected to the main body and has a light-incident surface. The illuminating element is arranged along the light-incident surface and is capable of emitting a light beam. The light beam enters the light guide plate from the light-incident surface and leaves the light guide plate from the light-emitting surface. The side frame is located on the light guide plate. The display panel is located between the light guide plate and the side frame. The side frame and the display panel expose the light-incident protrusion part. The side frame of the display device described herein has the small width.

Abstract: A touch panel includes a transparent substrate and a touch module disposed thereon. The touch module includes a first stack structure that includes the following elements. A transparent carrying layer has an active area, an extending area, and a plurality of bending segments respectively connecting the active area and the extending area. A patterned conductive layer has an electrode pattern area and a plurality of bonding pads that extend from the electrode pattern area disposed on the active area. A plurality of extending wires connect the bonding pads, and extend to the extending area. A transparent adhesive layer covers the electrode pattern area. A wire protection layer covers a portion of each extending wire on the corresponding extending area. The transparent adhesive layer covers a portion of the bonding pads.

Abstract: A touch panel including a transparent substrate, a touch module and a flexible circuit board is provided. The touch module is disposed on the transparent substrate. The flexible circuit board has a bonding segment, a bending segment and extending segment. The bonding segment is bonded to the touch module. The bending segment is located between the bonding segment and the extending segment. The bending segment has a bending line, and the bending segment is bended along the bending line.

Abstract: A heat conducting apparatus includes an air guide hood and a heat conducting device. The air guide hood is connected to a hot air supply source for delivering hot air, and includes an air outlet for exit of the hot air. The heat conducting device is disposed at the air outlet of the air guide hood, and includes a contact wall spaced apart from and disposed below the air outlet for contacting a soldered component, and a surrounding wall extending upwardly from the contact wall and connected to the air guide hood. The contact wall and the surrounding wall cooperatively define a space for guiding the hot air. The contact wall conducts the heat to the soldered component so as to melt tin solders between the soldered component and a circuit board, thereby reducing any adverse effect on other electronic components or good chips on the circuit board.

Abstract: The present invention provides a process for the removal and recovery of indium from waste waters and process streams. The process of the present invention utilizes a combination of a supported liquid membrane (SLM) and a strip dispersion to improve extraction of indium while increasing membrane stability and decreasing processing costs. This novel process selectively removes indium from the feed stream, provides the increased flexibility of aqueous strip/organic volume ratio, and produces a concentrated strip solution of indium.

Abstract: A method for text-to-pronunciation conversion includes a process for searching grapheme-phoneme segments and a three-stage process of text-to-pronunciation conversion. This method looks for a sequence of grapheme-phoneme pairs, which is referred to as a chunk, via a trained pronouncing dictionary, performs grapheme segmentation, chunk marking and a decision process on an input text, and determines a pronouncing sequence for the text. With the chunk marking, the method greatly reduces the search space on the associated phoneme graph, and thereby efficiently enhances the search speed for the candidate chunk sequences. The method keeps a high word-accuracy as well as saves computing time.

Abstract: Disclosed is a method for text-to-pronunciation conversion, which comprises a process for searching grapheme-phoneme segments and a three-stage process of text-to-pronunciation conversion. This method looks for a sequence of grapheme-phoneme pairs (a sequence of grapheme-phoneme pairs is referred to a chunk) via a trained pronouncing dictionary, proceeds grapheme segmentation, chunk marking and a decision process on an input text, and determines a pronouncing sequence for the text. With the chunk marking, the invention, greatly reduces the search space on the associated phoneme graph, thereby efficiently enhances the search speed for the candidate chunk sequences. The invention keeps a high word-accuracy as well as saves lots of computing time. It is applicable to the audio-related products for mobile information appliances.

Abstract: A heat sink clip (1) includes a main body (10), a post (40), a spring (50) and a cammed handle (30). The main body includes a horizontal portion (12) and two locking arms (16). A locking hole (17) is defined in an end of each locking arm for engaging with catches (82) of a socket (80). The post has a pressing block (44) at a bottom portion and a cutout (42) at a top portion. The spring is placed around the post and rests on the pressing block The post extends through a through aperture (13) of the horizontal portion, and the cutout pivotally receives a cam (32) at one end of the handle. When the handle is pressed, the horizontal portion of the main body is raised by the decompressed spring, so that the locking arms tightly engage with the catches of the socket.

Abstract: A heat dissipation device includes a first heat sink (10) mounted on one side of a video graphics adapter (VGA) card (70) on which a heat generating componnent is mounted to dissipate heat generated by the heat generating componnent, a second heat sink (10?) mounted on an opposite side of the card, a pair of heat pipes (40) independent from and intercrossed with each other and connected between the first and second heat sinks for transferring heat from the first heat sink to the second heat sink, a pair of covers (26) attached on the respective first and second heat sinks to form enclosed channels (15) between the covers and the first and second heat sinks respectively, a pair of fans (22) mounted between the covers and the first and second heat sinks for producing airflow through the channels to improve heat dissipation efficiency of the heat dissipation device.

Abstract: A heat dissipating device incorporating heat pipes includes a heat sink (10), a first heat pipe (50) and a second heat pipe (70). The heat sink has a first base (11), a second base (21) and a plurality of fins sandwiched between the first and second bases. Each of the heat pipes has a heat-absorption end (51, 71) and a heat-dissipation end (52, 72). The heat-absorption ends of the first and second heat pipes contact the first base of the heat sink. The heat-dissipation end of the first heat pipe is inserted in the substantial middle portion of the fins, and the heat-dissipation end of the second heat pipe is inserted between the second base and the fins.

Abstract: A fastener (10) for mounting a heat-radiator (20) to an electronic device (30) on a circuit board (40) is disclosed. The heat-radiator and the circuit board have aligned holes (22, 44). The fastener includes a head (11) having an upper portion (112) with a large diameter and a lower portion (113) with a smaller diameter, a cylindrical spring (14) captured around the lower portion of the head for exerting a spring force against the heat-radiator, and a metallic wire (15) having a first end portion fixed on said head and a second end portion bent to form an engaging portion (152). The engaging portion of the metallic wire compressively passes through the aligned holes of the heat-radiator and the circuit board and is engaged with an underside of the circuit board.

Abstract: A heat dissipation assembly includes a heat sink (20), a backplate (50), a pair of posts (60) and a fastener (10). The heat sink is attached on a CPU (30) which is mounted on a PCB (40). The backplate is disposed below the PCB. The fastener includes a main body (14) spanning on the heat sink, a resilient member (16) and an operating member (12). The posts extends through the backplate and engaged with the main body. Before the fastener is activated, the resilient member and the operating member squeezes the main body therebetween. When the fastener is activated, the operating member is above the main body. The resilient member resiliently presses the heat sink toward the CPU and the main body with opposite directional forces. The posts are consequently forced by the main body to urge the backplate against the PCB.

Abstract: A heat dissipation assembly of the present invention includes a printed circuit board (50), an electronic component (60) mounted on the printed circuit board, a heat dissipation device (70) mounted on the electronic component, four securing members (10) secured to the heat dissipation device and four positioning members (20) extend through the printed circuit board. The positioning members are covered over by four resilient members (30) disposed in the securing members. The positioning members pull the securing members toward the printed circuit board.