Patents by Inventor Hsieh-Wei Hsu

Hsieh-Wei Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11913047
    Abstract: A method for producing ?-aminobutyric acid includes cultivating, in a culture medium containing glutamic acid or a salt thereof, a probiotic composition including at least one lactic acid bacterial strain selected from the group consisting of Bifidobacterium breve CCFM1025 which is deposited at the Guangdong Microbial Culture Collection Center under an accession number GDMCC 60386, Lactobacillus acidophilus TYCA06, Lactobacillus plantarum LPL28, and Bifidobacterium longum subsp. infantis BLI-02 which are deposited at the China General Microbiological Culture Collection Center respectively under accession numbers CGMCC 15210, CGMCC 17954, and CGMCC 15212, Lactobacillus salivarius subsp. salicinius AP-32 which is deposited at the China Center for Type Culture Collection under an accession number CCTCC M 2011127, and combinations thereof.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: February 27, 2024
    Assignee: GLAC BIOTECH CO., LTD.
    Inventors: Hsieh-Hsun Ho, Ching-Wei Chen, Yu-Fen Huang, Chen-Hung Hsu, Wen-Yang Lin, Yi-Wei Kuo, Shin-Yu Tsai
  • Publication number: 20100321913
    Abstract: A memory card and method for fabricating the same are disclosed, which includes mounting and electrically connecting at least a chip to a circuit board unit having a predefined shape of a memory card; attaching a thin film to the surface of the circuit board unit opposed to the surface with the chip mounted thereon; covering the circuit board unit and the thin film by a mold so as to form a mold cavity having same shape as the circuit board unit but bigger size; filling a packaging material in the mold cavity so as to form an encapsulant encapsulating the chip and outer sides of the circuit board unit, thus integrally forming a memory card having the predefined shape. The present invention eliminates the need to perform a shape cutting process by using water jet or laser as in the prior art, thus reducing the fabricating cost and improving the fabricating yield.
    Type: Application
    Filed: August 26, 2010
    Publication date: December 23, 2010
    Applicant: UTAC (TAIWAN) CORPORATION
    Inventors: Ming-Sung Tsai, Hsieh-Wei Hsu
  • Patent number: 7795077
    Abstract: A memory card and method for fabricating the same are disclosed, which includes mounting and electrically connecting at least a chip to a circuit board unit having a predefined shape of a memory card; attaching a thin film to the surface of the circuit board unit opposed to the surface with the chip mounted thereon; covering the circuit board unit and the thin film by a mold so as to form a mold cavity having same shape as the circuit board unit but bigger size; filling a packaging material in the mold cavity so as to form an encapsulant encapsulating the chip and outer sides of the circuit board unit, thus integrally forming a memory card having the predefined shape. The present invention eliminates the need to perform a shape cutting process by using water jet or laser as in the prior art, thus reducing the fabricating cost and improving the fabricating yield.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: September 14, 2010
    Assignee: UTAC (Taiwan) Corporation
    Inventors: Ming-Sung Tsai, Hsieh-Wei Hsu
  • Publication number: 20080273299
    Abstract: A memory card and method for fabricating the same are disclosed, which includes mounting and electrically connecting at least a chip to a circuit board unit having a predefined shape of a memory card; attaching a thin film to the surface of the circuit board unit opposed to the surface with the chip mounted thereon; covering the circuit board unit and the thin film by a mold so as to form a mold cavity having same shape as the circuit board unit but bigger size; filling a packaging material in the mold cavity so as to form an encapsulant encapsulating the chip and outer sides of the circuit board unit, thus integrally forming a memory card having the predefined shape. The present invention eliminates the need to perform a shape cutting process by using water jet or laser as in the prior art, thus reducing the fabricating cost and improving the fabricating yield.
    Type: Application
    Filed: October 31, 2007
    Publication date: November 6, 2008
    Applicant: United Test Center Inc.
    Inventors: Ming-Sung Tsai, Hsieh-Wei Hsu