Patents by Inventor Hsien-Cheng Yu

Hsien-Cheng Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240376028
    Abstract: Production of HFO-1132 and, in particular, HFO-1132E, may be produced from 1,1,2-trichloro-1,2,2-trifluoroethane (CFC-113). In a first step, 1,1,2-trifluoroethane (HFC-143) is produced by hydrogenating 1,1,2-trichloro-1,2,2-trifluoroethane (CFC-113) by reaction with hydrogen in the presence of a catalyst to produce 1,1,2-trifluoroethane (HFC-143). The 1,1,2-trifluoroethane (HFC-143) may then be dehydrofluorinated in the presence of a catalyst to produce trans-1,2-difluoroethylene (HFO-1132E) and/or cis-1,2-difluoroethylene (HFO-1132Z). The cis-1,2-difluoroethylene (HFO-1132Z) may then be isomerized to produce trans-1,2-difluoroethylene (HFO-1132E).
    Type: Application
    Filed: May 8, 2024
    Publication date: November 14, 2024
    Inventors: Haiyou Wang, Alexey Kruglov, Yian Zhai, Dimitrios Papanastasiou, Sudharsanam Ramanathan, Christophe Roger, Hsien-cheng YU, Akbar Mahdavi-Shakib
  • Patent number: 9399737
    Abstract: An insulating and cooling cracking device includes a thermal cracking furnace accommodated therein. The insulating and cooling device has at least one cooling opening set on its side wall and at least one adiabatic cover. When the thermal cracking device is in heating, the adiabatic cover is closed. When the pyrolysis process is completed, the adiabatic cover is opened to allow the air to flow into one cooling opening. The air further flows through the surface of the thermal cracking furnace, and flows out from another cooling opening to achieve the advantage of more rapid cooling.
    Type: Grant
    Filed: June 4, 2013
    Date of Patent: July 26, 2016
    Assignee: E-SUNSCIENCE CO., LTD.
    Inventors: Li-Feng Cheng, Hsien-Cheng Yu
  • Patent number: 9334446
    Abstract: A thermal cracker device includes an outer furnace and a thermal cracking furnace accommodated in the outer furnace. The outer surface of the thermal cracking furnace and the inner surface of the outer furnace define a space. The outer surface of the thermal cracking furnace has a fin structure to define an air flow channel in the space.
    Type: Grant
    Filed: June 4, 2013
    Date of Patent: May 10, 2016
    Assignee: E-Sunscience Co., Ltd.
    Inventors: Li-Feng Cheng, Hsien-Cheng Yu, Wen Chun Kuo
  • Publication number: 20130319843
    Abstract: A thermal cracker device includes an outer furnace and a thermal cracking furnace accommodated in the outer furnace. The outer surface of the thermal cracking furnace and the inner surface of the outer furnace define a space. The outer surface of the thermal cracking furnace has a fin structure to define an air flow channel in the space.
    Type: Application
    Filed: June 4, 2013
    Publication date: December 5, 2013
    Inventors: Li-Feng Cheng, Hsien-Cheng Yu, Wen Chun Kuo
  • Publication number: 20130319842
    Abstract: An insulating and cooling cracking device includes a thermal cracking furnace accommodated therein. The insulating and cooling device has at least one cooling opening set on its side wall and at least one adiabatic cover. When the thermal cracking device is in heating, the adiabatic cover is closed. When the pyrolysis process is completed, the adiabatic cover is opened to allow the air to flow into one cooling opening. The air further flows through the surface of the thermal cracking furnace, and flows out from another cooling opening to achieve the advantage of more rapid cooling.
    Type: Application
    Filed: June 4, 2013
    Publication date: December 5, 2013
    Inventors: Li-Feng Cheng, Hsien-Cheng Yu