Abstract: An immersion cooling equipment is configured to cool an electronic device. The immersion cooling equipment includes a tank and a hollow fluid blocking member. The tank is filled with coolant. The electronic device is disposed in the tank and immersed in the coolant. The hollow fluid blocking member is replaceably placed in the tank to be immersed in the coolant. During a process of placing the hollow fluid blocking member into the tank, a portion of the coolant in the tank flows into the hollow fluid blocking member, and during a process of detaching the hollow fluid blocking member from the tank, the coolant in the hollow fluid blocking member flows out of the hollow fluid blocking member and flows back to the tank.

Abstract: An immersion cooling system includes a cooling tank, a busbar and a feedthrough module. The cooling tank includes a side wall and an opening formed on the side wall. The busbar is disposed in the cooling tank. The feedthrough module seals the opening. The feedthrough module includes a base, a conductive member, an insulating member and an electrical connector. The base is disposed on the side wall. The base has a through hole corresponding to the opening. The insulating member is disposed between the conductive member and the base to insulate the conductive member from the base. The electrical connector is connected to the conductive member. The electrical connector passes through the through hole and the opening to be connected to the busbar.

Abstract: An immersion cooling system includes a cooling tank, a busbar and two busbar protection modules. The busbar is disposed in the cooling tank. The two busbar protection modules are disposed at opposite sides of the busbar. Each of the two busbar protection modules includes a base, a driving member and a cover. The driving member is pivotally connected to the base. The cover is pivotally connected to the driving member. Two covers of the two busbar protection modules extend toward each other to cover the busbar. When two driving members of the two busbar protection modules are pushed, the two driving members rotate to drive the two covers to move away from each other, such that the busbar is exposed between the two covers.

Abstract: An electronic apparatus includes at least one heat generating component and an immersion cooling system. The immersion cooling system includes a main tank and a liquid amount adjusting module. The main tank is adapted to contain a heat dissipation medium, and the heat generating component is disposed in the main tank to be immersed in the heat dissipation medium. The liquid adjusting module includes an auxiliary tank and a pump. The auxiliary tank is adjacent to the main tank, and the heat dissipation medium in the main tank is adapted to be overflowed into the auxiliary tank. The pump is disposed in the auxiliary tank and adapted to drive the heat dissipation medium in the auxiliary tank to flow into the main tank.

Abstract: An electronic apparatus includes at least one heat generating component and an immersion cooling system. The immersion cooling system includes a main tank and a liquid amount adjusting module. The main tank is adapted to contain a heat dissipation medium, and the heat generating component is disposed in the main tank to be immersed in the heat dissipation medium. The liquid adjusting module includes an auxiliary tank and a pump. The auxiliary tank is adjacent to the main tank, and the heat dissipation medium in the main tank is adapted to be overflowed into the auxiliary tank. The pump is disposed in the auxiliary tank and adapted to drive the heat dissipation medium in the auxiliary tank to flow into the main tank.

Abstract: An electronic apparatus includes at least one heat generating component and an immersion cooling system. The immersion cooling system includes a main tank and a liquid amount adjusting module. The main tank is adapted to contain a heat dissipation medium, and the heat generating component is disposed in the main tank to be immersed in the heat dissipation medium. The liquid adjusting module includes an auxiliary tank and a pump. The auxiliary tank is adjacent to the main tank, and the heat dissipation medium in the main tank is adapted to be overflowed into the auxiliary tank. The pump is disposed in the auxiliary tank and adapted to drive the heat dissipation medium in the auxiliary tank to flow into the main tank.

Abstract: An immersion cooling system includes a work tank, a pump, a first pipeline, a condensation dehumidification device, a second pipeline, and a control system. The work tank includes a vapor section and a humidity sensor for sensing a humidity of the vapor section. The first pipeline includes a first valve. The vapor section and the pump are selectively in communication with each other or not when the first valve is actuated. The condensation dehumidification device has a first end and a second end, where the first end is in communication with the pump. The second pipeline includes a second valve. The condensation dehumidification device and the tank are selectively in communication with each other or not when the second valve is actuated. When the humidity is greater than a preset humidity, the control system controls the first valve to communicate the vapor section and the pump and activates the pump.

Abstract: A delivery device includes a first base, two first check valves, a carrier, a first deformable container and a driving mechanism. The first base has a first inlet and a first outlet. The two first check valves are disposed at the first inlet and the first outlet. The first deformable container is connected to the first base and the carrier. The first deformable container communicates with the first inlet and the first outlet. The driving mechanism is connected to the carrier. The driving mechanism drives the carrier to reciprocate, such that the carrier drives the first deformable container to expand or contract.

Abstract: A sealing mechanism is used to seal a sink of a case via a cover of a two-phase water-cooling heat dissipation device. The sealing mechanism includes a driving module and a guiding module. The driving module is disposed on the cover. The guiding module is linked with the driving module and includes a first connection component, a second connection component and a third connection component. The first connection component is driven by the driving module and includes a first constraining structure used to engage with and disengage from a restraining component for constraint of the cover. The second connection component is crossed by the first connection component. The third connection component is rotatably disposed on the cover. An end of the third connection component is connected to the second connection component, and the other end of the third connection component is connected to the first connection component.

Abstract: An airtight device includes a tank, a sink and a feedthrough module. The sink is disposed inside the tank, and an opening is formed on the sink. The feedthrough module is disposed on the opening. The feedthrough module includes a base, a sealing component, a covering component, a transmission component and a plurality of fixing components. A groove is formed on the base. A part of the sealing component is disposed inside the groove. The covering component is assembled with the base and adapted to press the sealing component. A plurality of fixing holes is formed on the covering component. The transmission component is assembled with the covering component. The plurality of fixing components is adapted to insert into the plurality of fixing holes and engage with the base for pressing the sealing component by shortening a distance between the base and the covering component.

Abstract: An electronic apparatus includes at least one heat generating component and an immersion cooling system. The immersion cooling system includes a main tank and a liquid amount adjusting module. The main tank is adapted to contain a heat dissipation medium, and the heat generating component is disposed in the main tank to be immersed in the heat dissipation medium. The liquid adjusting module includes an auxiliary tank and a pump. The auxiliary tank is adjacent to the main tank, and the heat dissipation medium in the main tank is adapted to be overflowed into the auxiliary tank. The pump is disposed in the auxiliary tank and adapted to drive the heat dissipation medium in the auxiliary tank to flow into the main tank.