Patents by Inventor Hsien-chih Wu
Hsien-chih Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10114426Abstract: An expansion card includes a mounting bracket with a full height I/O panel with a top mounting panel attached thereto extending orthogonally away. A low profile printed circuit board assembly (PCBA) is physically attached to at least one of the top mounting panel and the full height I/O panel, and the mounting bracket and low profile PCBA define a full height expansion card. The low profile PCBA has a card edge that is insertably connectable to an I/O connector of an information handling system (IHS) to communicate with other components of the IHS. A full height heat sink is attached to the low profile PCBA and extends across a portion of the top mounting panel, providing increased heat dissipation for functional components of the low profile PCBA during operation of the low profile PCBA. A battery compartment is mounted on the mounting panel and supplies power to the functional components.Type: GrantFiled: March 17, 2016Date of Patent: October 30, 2018Assignee: Dell Products, L.P.Inventors: Chih-Hsiang Lee, Yao-Chien Lien, Hsien-Chih Wu, Chien Hung Chou, Kuo-Chih Lin, Martin Hardis
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Publication number: 20160195908Abstract: An expansion card includes a mounting bracket with a full height I/O panel with a top mounting panel attached thereto extending orthogonally away. A low profile printed circuit board assembly (PCBA) is physically attached to at least one of the top mounting panel and the full height I/O panel, and the mounting bracket and low profile PCBA define a full height expansion card. The low profile PCBA has a card edge that is insertably connectable to an I/O connector of an information handling system (IHS) to communicate with other components of the IHS. A full height heat sink is attached to the low profile PCBA and extends across a portion of the top mounting panel, providing increased heat dissipation for functional components of the low profile PCBA during operation of the low profile PCBA. A battery compartment is mounted on the mounting panel and supplies power to the functional components.Type: ApplicationFiled: March 17, 2016Publication date: July 7, 2016Inventors: Chih-Hsiang Lee, Yao-Chien Lien, Hsien-Chih Wu, Chien Hung Chou, Kuo-Chih Lin, Martin Hardis
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Patent number: 9298227Abstract: An expansion card includes a mounting bracket with a full height I/O panel with a top mounting panel attached thereto extending orthogonally away. A low profile printed circuit board assembly (PCBA) is physically attached to at least one of the top mounting panel and the full height I/O panel, and the mounting bracket and low profile PCBA define a full height expansion card. The low profile PCBA has a card edge that is insertably connectable to an I/O connector of an information handling system (IHS) to communicate with other components of the IHS. A full height heat sink is attached to the low profile PCBA and extends across a portion of the top mounting panel, providing increased heat dissipation for functional components of the low profile PCBA during operation of the low profile PCBA. A battery compartment is mounted on the mounting panel and supplies power to the functional components.Type: GrantFiled: May 14, 2013Date of Patent: March 29, 2016Assignee: Dell Products, L.P.Inventors: Chih-Hsiang Lee, Yao-Chien Lien, Hsien-Chih Wu, Chien Hung Chou, Kuo-Chih Lin, Martin Hardis
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Patent number: 9098253Abstract: Daughter cards couple to an information handling system chassis and are secured in place with insertion of a retainer in a retainer guide that aligns to engage with securing elements of the daughter cards coupled to the chassis. A hinge member couples the retainer to the retainer guide between an inserted position and an idle position to maintain the retainer attached to the chassis but removed out of the way for daughter card manipulation during addition or removal of the daughter card at the chassis.Type: GrantFiled: January 30, 2013Date of Patent: August 4, 2015Assignee: Dell Products L.P.Inventors: Hsien-Chih Wu, Yao-Chien Lien, Chih-Hsiang Lee, Chien-Hung Chou
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Publication number: 20140340834Abstract: An expansion card includes a mounting bracket with a full height I/O panel with a top mounting panel attached thereto extending orthogonally away. A low profile printed circuit board assembly (PCBA) is physically attached to at least one of the top mounting panel and the full height I/O panel, and the mounting bracket and low profile PCBA define a full height expansion card. The low profile PCBA has a card edge that is insertably connectable to an I/O connector of an information handling system (IHS) to communicate with other components of the IHS. A full height heat sink is attached to the low profile PCBA and extends across a portion of the top mounting panel, providing increased heat dissipation for functional components of the low profile PCBA during operation of the low profile PCBA. A battery compartment is mounted on the mounting panel and supplies power to the functional components.Type: ApplicationFiled: May 14, 2013Publication date: November 20, 2014Applicant: Dell Products L.P.Inventors: Chih-Hsiang Lee, Yao-Chien Lien, Hsien-Chih Wu, Chien Hung Chou, Kuo-Chih Lin, Martin Hardis
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Publication number: 20140211402Abstract: Daughter cards couple to an information handling system chassis and are secured in place with insertion of a retainer in a retainer guide that aligns to engage with securing elements of the daughter cards coupled to the chassis. A hinge member couples the retainer to the retainer guide between an inserted position and an idle position to maintain the retainer attached to the chassis but removed out of the way for daughter card manipulation during addition or removal of the daughter card at the chassis.Type: ApplicationFiled: January 30, 2013Publication date: July 31, 2014Applicant: DELL PRODUCTS L.P.Inventors: Hsien-Chih Wu, Yao-Chien Lien, Chih-Hsiang Lee, Chien-Hung Chou
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Patent number: 8699213Abstract: An electronic device with supporting stands includes an input/output module, two stands and a limiter. The two stands are obliquely disposed on the back side of the input/output module. The stands are limited by the limiter to move synchronously. At the same time, the limiter has two slots penetrated by the stands to limit moving range for the stands. Then the stands are controlled to swing with an angle and finally the visual angle of the input/output module is varied in suitable range.Type: GrantFiled: April 22, 2010Date of Patent: April 15, 2014Assignee: ASUSTeK Computer Inc.Inventors: Wean-Fong Loi, Hung-Hsiang Chen, Chia-cheng Shih, Alec Wong, Hsien-Chih Wu, Chiu-Lang Huang
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Patent number: 8531832Abstract: A notebook computer device includes an image capture module, a cover, a first magnetic element, and a second magnetic element. The image capture module is disposed on a body of the computer device, the cover is moveably disposed on the body. The image capture module is exposed when the cover is at a first position, and the image capture module is covered when the cover is at a second position. The first magnet element is disposed on the cover, and a second magnet element is disposed on the body corresponding to the first magnet element. The cover moves between a first position and a second position via the magnetic force of repulsion and attraction.Type: GrantFiled: January 20, 2011Date of Patent: September 10, 2013Assignee: Asustek Computer Inc.Inventors: Hsien-Chih Wu, Hsin-Wen Tsai, Sheng-Ta Lin, Chiu-Lang Huang
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Publication number: 20110182029Abstract: A notebook computer device includes an image capture module, a cover, a first magnetic element, and a second magnetic element. The image capture module is disposed on a body of the computer device, the cover is moveably disposed on the body. The image capture module is exposed when the cover is at a first position, and the image capture module is covered when the cover is at a second position. The first magnet element is disposed on the cover, and a second magnet element is disposed on the body corresponding to the first magnet element. The cover moves between a first position and a second position via the magnetic force of repulsion and attraction.Type: ApplicationFiled: January 20, 2011Publication date: July 28, 2011Applicant: ASUSTEK COMPUTER INC.Inventors: Hsien-Chih Wu, Hsin-Wen Tsai, Sheng-Ta Lin, Chiu-Lang Huang
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Publication number: 20110103032Abstract: An electronic device with supporting stands includes an input/output module, two stands and a limiter. The two stands are obliquely disposed on the back side of the input/output module. The stands are limited by the limiter to move synchronously. At the same time, the limiter has two slots penetrated by the stands to limit moving range for the stands. Then the stands are controlled to swing with an angle and finally the visual angle of the input/output module is varied in suitable range.Type: ApplicationFiled: April 22, 2010Publication date: May 5, 2011Inventors: Wean-Fong Loi, Hung-Hsiang Chen, Chia-cheng Shih, Alec Wong, Hsien-Chih Wu, Chiu-Lang Huang
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Patent number: 7894184Abstract: A portable electronic device includes a screen module, a main body module and an input/output module. The screen module is pivotally connected with the body module. The input/output module is electrically connected with the main body module. An actuating element is disposed at a bottom of the screen module. When the screen module is opened respectively to the body module to be opened, the actuating element is driven to swing to push a front end of the input/output module to be lifted to drive the input/output module to be out of a state that the keyboard abuts against the main body module. Therefore, the portable electronic device is easy to be operated. Moreover, the heat dissipation is improved to keep the internal temperature low and reduce energy consumption.Type: GrantFiled: September 22, 2009Date of Patent: February 22, 2011Assignee: Asustek Computer Inc.Inventors: Xiaonan Huang, Alec Wong, Chia-cheng Shih, Hung-Hsiang Chen, Daniel Alenquer, Tan-Wee Kiat, Luke Goh, Lionel Wong, Wean-Fong Loi, Hsien-Chih Wu, Chiu-Lang Huang
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Patent number: 7841853Abstract: This invention discloses an injection molding machine and a heat-insulating structure of a barrel thereof. The heat-insulating structure covers the barrel of the injection molding machine. The heat-insulating structure includes a plurality of heat-insulating units and a plurality of heat-resistant interlinings. The heat-insulating units are disposed on an outer surface of the barrel in turn along an axial direction of the barrel. The heat-resistant interlinings are located between the heat-insulating units and connect the heat-insulating units, respectively. Each heat-insulating unit includes a heat-resistant layer, a heat-insulating material layer, and an insulating layer in turn. The heat-resistant layer covers the outer surface of the barrel of the injection molding machine.Type: GrantFiled: July 30, 2009Date of Patent: November 30, 2010Assignees: Maintek Computer (Suzhou) Co., Ltd., Pegatron CorporationInventors: Chiu-ting Yu, Hsien-chih Wu, Yu-xiu Wu, Bo-tao Jiang, Shih-chi Hsu
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Publication number: 20100214743Abstract: A portable electronic device includes a screen module, a main body module and an input/output module. The screen module is pivotally connected with the body module. The input/output module is electrically connected with the main body module. An actuating element is disposed at a bottom of the screen module. When the screen module is opened respectively to the body module to be opened, the actuating element is driven to swing to push a front end of the input/output module to be lifted to drive the input/output module to be out of a state that the keyboard abuts against the main body module. Therefore, the portable electronic device is easy to be operated. Moreover, the heat dissipation is improved to keep the internal temperature low and reduce energy consumption.Type: ApplicationFiled: September 22, 2009Publication date: August 26, 2010Inventors: Xiaonan Huang, Alec Wong, Chia-cheng Shih, Hung-Hsiang Chen, Daniel Alenquer, Tan-Wee Kiat, Luke Goh, Lionel Wong, Wean-Fong Loi, Hsien-Chih Wu, Chiu-Lang Huang
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Publication number: 20100028482Abstract: This invention discloses an injection molding machine and a heat-insulating structure of a barrel thereof. The heat-insulating structure covers the barrel of the injection molding machine. The heat-insulating structure includes a plurality of heat-insulating units and a plurality of heat-resistant interlinings. The heat-insulating units are disposed on an outer surface of the barrel in turn along an axial direction of the barrel. The heat-resistant interlinings are located between the heat-insulating units and connect the heat-insulating units, respectively. Each heat-insulating unit includes a heat-resistant layer, a heat-insulating material layer, and an insulating layer in turn. The heat-resistant layer covers the outer surface of the barrel of the injection molding machine.Type: ApplicationFiled: July 30, 2009Publication date: February 4, 2010Applicants: Maintek Computer (Suzhou)Co. Ltd., Pegatron CorporationInventors: Chiu-ting Yu, Hsien-chih Wu, Yu-xiu Wu, Bo-tao Jiang, Shih-chi Hsu