Abstract: A semiconductor package including one or more dam structures and the method of forming are provided. A semiconductor package may include an interposer, a semiconductor die bonded to a first side of the interposer, an encapsulant on the first side of the interposer encircling the semiconductor die, a substrate bonded to the a second side of the interposer, an underfill between the interposer and the substrate, and one or more of dam structures on the substrate. The one or more dam structures may be disposed adjacent respective corners of the interposer and may be in direct contact with the underfill. The coefficient of thermal expansion of the one or more of dam structures may be smaller than the coefficient of thermal expansion of the underfill.

Abstract: An integrated mechanism is disclosed. An electronic device includes a slot, an engaging groove, and a power input portion. The engaging groove communicates with the slot and the power input portion is disposed in the slot. An adaptor is detachably connected to the electronic device and includes a grip, a power line, an extended connection bar, a tenon, and a power output portion. The power line is connected to the grip. The extended connection bar is connected to the grip. The tenon is formed on the extended connection bar. The power output portion is formed on the extended connection bar and is electrically connected to the grip and power line. When the adaptor connects to the electronic device, the extended connection bar is inserted into the slot, the tenon is selectively engaged or rotated in the engaging groove, and the power output portion connects to the power input portion.

Abstract: An integrated mechanism is disclosed. An electronic device includes a slot, an engaging groove, and a power input portion. The engaging groove communicates with the slot and the power input portion is disposed in the slot. An adaptor is detachably connected to the electronic device and includes a grip, a power line, an extended connection bar, a tenon, and a power output portion. The power line is connected to the grip. The extended connection bar is connected to the grip. The tenon is formed on the extended connection bar. The power output portion is formed on the extended connection bar and is electrically connected to the grip and power line. When the adaptor connects to the electronic device, the extended connection bar is inserted into the slot, the tenon is selectively engaged or rotated in the engaging groove, and the power output portion connects to the power input portion.

Abstract: A paper box structure formed of a paper material includes a bottom plate, a front plate, a rear plate, two side plates, a partition plate and a cover plate. The front plate is connected to one side of the bottom plate to form a front wall. The rear plate is connected to one side of the bottom plate opposite to the front plate to form a buffer space as a rear wall. Two side plates are connected to another two opposite sides of the bottom plate to form buffer spaces as side walls. A frame body is formed from the front plate, rear plate and side plates. The partition plate is disposed within the frame body to divide the frame body into upper and lower portions. The cover plate covers the buffer space formed by the bottom plate and the rear plate, and then the top of the frame body.