Abstract: A die stack structure including a first die, an encapsulant, a redistribution layer and a second die is provided. The encapsulant laterally encapsulates the first die. The redistribution layer is disposed below the encapsulant, and electrically connected with the first die. The second die is disposed between the redistribution layer and the first die, wherein the first and second dies are electrically connected with each other, the second die comprises a body portion having a first side surface, a second side surface and a curved side surface therebetween, and the curved side surface connects the first side surface and the second side surface.

Abstract: A package includes a carrier substrate, a first die, and a second die. The first die and the second die are stacked on the carrier substrate in sequential order. The first die includes a first bonding layer, a second bonding layer, and an alignment mark embedded in the first bonding layer. The second die includes a third bonding layer. A surface of the first bonding layer form a rear surface of the first die and a surface of the second bonding layer form an active surface of the first die. The rear surface of the first die is in physical contact with the carrier substrate. The active surface of the first die is in physical contact with the third bonding layer of the second die.

Abstract: A system for evaluating a heat sensitive structure of an integrated circuit design including a memory for retrieving and storing integrated circuit design layout data, thermal data, process data, and one or more operational parameters, a processor capable of accessing the memory and identifying a target region having a nominal temperature Tnom, a plurality of heat generating structures and/or heat dissipating structures having corresponding impact areas that encompass a portion of the target region, calculating the temperature increases and/or decreases in the target region as a result of thermal coupling between the target region and the heat generating structures and/or heat dissipating structures, and conducting one or more parametric evaluations of the target region at an adjusted evaluation temperature TE after which a network interface transmits the result(s) of the parametric evaluation(s) for use in a design review.

Abstract: An electromigration (EM) sign-off methodology that utilizes a system for analyzing an integrated circuit design layout to identify heat sensitive structures, self-heating effects, heat generating structures, and heat dissipating structures. The EM sign-off methodology includes a memory and a processor configured for calculating adjustments of an evaluation temperature for a heat sensitive structure by calculating the effects of self-heating within the temperature sensitive structure as well as additional heating and/or cooling as a function of thermal coupling to surrounding heat generating structures and/or heat dissipating elements located within a defined thermal coupling volume or range of the heat sensitive structures.

Abstract: A die stack structure including a first die, an encapsulant, a redistribution layer and a second die is provided. The encapsulant laterally encapsulates the first die. The redistribution layer is disposed below the encapsulant, and electrically connected with the first die. The second die is disposed between the redistribution layer and the first die, wherein the first and second dies are electrically connected with each other, the second die comprises a body portion having a first side surface, a second side surface and a curved side surface therebetween, and the curved side surface connects the first side surface and the second side surface.

Abstract: A package includes a carrier substrate, a first die, and a second die. The first die includes a first bonding layer, a second bonding layer opposite to the first bonding layer, and an alignment mark embedded in the first bonding layer. The first bonding layer is fusion bonded to the carrier substrate. The second die includes a third bonding layer. The third bonding layer is hybrid bonded to the second bonding layer of the first die.

Abstract: An ultrasonic spray coating system includes a piezoelectric transducer, a spray-forming head and a liquid supply applicator. The spray-forming head has an air-entrainment mechanism. The air-entrainment mechanism has an air-stream channel that is formed inside a main body and a bottom body of the spray-forming head for connection with a high-pressure air source, and an air vent formed in a bottom surface of the bottom body and communicates with the air-stream channel. A length of the air vent in a horizontal direction is greater than that of the air-stream channel. The liquid supply applicator has a discharge orifice, and a control component for controlling the size of the discharge orifice.

Abstract: A ball holding mechanism comprises a base with a central axis disposed from bottom to top with an urging block, an elastic element, and a stopping block. The surrounding of the base is pivotally provided with several holding arms, each of which has a transmission end and a holding end. The transmission end urges against the bottom surface of the urging block. By using the lever principle, the urging blocks are controlled by an adjusting mechanism to make a downward displacement along the central axis to push the transmission ends so that the holding ends perform a holding action while the elastic element keeps flexibility after the ball is held. A pivoting base can rotate in the horizontal and longitudinal direction on the holding arm through two horizontal and longitudinal shafts pivotally mounted on the holding end.

Abstract: A transmission component with a functional structure has a linear or crossed shaft body, a transmission structure integrally formed on the shaft body and extending in a radial direction; a sensor matching structure and a shaft matching structure formed on the shaft body so that a sensor and a bearing may be conveniently assembled on the shaft body and the size of the transmission component can be miniaturized, and a reinforcing rod which may be inserted into the shaft body in an axial direction to enhance the structure intensity of the shaft body.

Abstract: A squelch circuit for operating at high speed and at high frequencies includes a squelch input unit, a low swing pre-amplifier and a sampling and decision circuit. The squelch input unit pre-processes the positive and negative signals of an input signal to generate four pre-processed signals that are paired and sent to the low swing pre-amplifier. The outputs of the low-swing pre-amplifier are then over-sampled by the sampling and decision circuit. Multi-phase clocks are used to control the over-sampling in the sampling and decision circuit. A logic circuit then determines if the state of the input signal based on multiple samples.

Abstract: A squelch circuit for operating at high speed and at high frequencies includes a squelch input unit, a low swing pre-amplifier and a sampling and decision circuit. The squelch input unit pre-processes the positive and negative signals of an input signal to generate four pre-processed signals that are paired and sent to the low swing pre-amplifier. The outputs of the low-swing pre-amplifier are then over-sampled by the sampling and decision circuit. Multi-phase clocks are used to control the over-sampling in the sampling and decision circuit. A logic circuit then determines if the state of the input signal based on multiple samples.