Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.

Abstract: A chip washing apparatus comprises an injection tube and a housing, wherein the injection tube includes a water inlet for importing a pressurized washing liquid and a water outlet connected to the housing. A bent bottom edge of the housing is inwardly bent to softly cover the surfaces of the chip and a substrate, which bonds to the chip. After the bent bottom edge of the housing softly covers the surfaces of the chip and the substrate, the pressured washing liquid is allowed to flow through the covered fine slits and gaps between die contacts. Accordingly, the residues between the bonded chip and substrate are removed by the pressured washing liquid.

Abstract: A centrifugal type, enclosed cleaning apparatus including a housing to hold the parts thereof, a washing container fastened in a hole on the housing, a lifting unit on the housing at the top, a stirrer unit having a base coupled to the lifting arm of the lifting unit and a material carrier with a shaft received inside the washing container and coupled to the transmission shaft of a power device and driven to turn within the washing container in causing a centrifugal effect, a cleaning unit consisted of a chemical pre-wash trough, a chemical trough, an inert air supply pipe assembly, an air compressing pipe assembly, a water trough, a water spray pipe assembly, and a separating trough, a drying unit, and a programmable control unit to control the operation of the lifting unit, the stirrer unit, the cleaning unit, and the drying unit in cleaning the products placed in the material carrier.