Patents by Inventor Hsien-Hsin Lee

Hsien-Hsin Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9613174
    Abstract: One or more techniques or systems for incorporating a common template into a system on chip (SOC) design are provided herein. For example, a common template mask set is generated based on a first set of polygon positions from a first vendor and a second set of polygon positions from a second vendor. A third party creates a third party SOC design using a set of design rules generated based on the common template mask set. The common template is fabricated based on the third party SOC design using the common template mask set. Because the common template is formed using the common template mask set and because the common template mask set is based on polygon positions from both the first vendor and the second vendor, a part can be connected to the SOC regardless of whether the part is sourced from the first vendor or the second vendor.
    Type: Grant
    Filed: April 6, 2015
    Date of Patent: April 4, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: William Wu Shen, Yun-Han Lee, Chin-Chou Liu, Hsien-Hsin Lee, Chung-Sheng Yuan, Chao-Yang Yeh, Wei-Cheng Wu, Ching-Fang Chen
  • Publication number: 20150213182
    Abstract: One or more techniques or systems for incorporating a common template into a system on chip (SOC) design are provided herein. For example, a common template mask set is generated based on a first set of polygon positions from a first vendor and a second set of polygon positions from a second vendor. A third party creates a third party SOC design using a set of design rules generated based on the common template mask set. The common template is fabricated based on the third party SOC design using the common template mask set. Because the common template is formed using the common template mask set and because the common template mask set is based on polygon positions from both the first vendor and the second vendor, a part can be connected to the SOC regardless of whether the part is sourced from the first vendor or the second vendor.
    Type: Application
    Filed: April 6, 2015
    Publication date: July 30, 2015
    Inventors: William Wu Shen, Yun-Han Lee, Chin-Chou Liu, Hsien-Hsin Lee, Chung-Sheng Yuan, Chao-Yang Yeh, Wei-Cheng Wu, Ching-Fang Chen
  • Patent number: 9003338
    Abstract: One or more techniques or systems for incorporating a common template into a system on chip (SOC) design are provided herein. For example, a common template mask set is generated based on a first set of polygon positions from a first vendor and a second set of polygon positions from a second vendor. A third party creates a third party SOC design using a set of design rules generated based on the common template mask set. The common template is fabricated based on the third party SOC design using the common template mask set. Because the common template is formed using the common template mask set and because the common template mask set is based on polygon positions from both the first vendor and the second vendor, a part can be connected to the SOC regardless of whether the part is sourced from the first vendor or the second vendor.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: April 7, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: William Wu Shen, Yun-Han Lee, Chin-Chou Liu, Hsien-Hsin Lee, Chung-Sheng Yuan, Chao-Yang Yeh, Wei-Cheng Wu, Ching-Fang Chen
  • Patent number: 8904314
    Abstract: Among other things, one or more systems and techniques for width bias adjustment for a design layout are provided. During fabrication, characteristics of a component can change, such as size, width, position, etc., from how a design layout represents such components. Accordingly, a width bias table is used to identify a width bias value that can be applied between a first polygon and a second polygon to compensate for a characteristic change associated with at least one of the first polygon and the second polygon during fabrication. The width bias value is used during RC extraction to determine an electrical characteristic adjustment, such as an additional capacitance or resistance associated with the width bias value, for at least one of the first polygon and the second polygon. In this way, RC extraction, during a design phase, can take into account electrical characteristic changes that occur during fabrication.
    Type: Grant
    Filed: September 18, 2013
    Date of Patent: December 2, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chia-Ming Ho, Te-Yu Liu, Ke-Ying Su, Hsien-Hsin Lee
  • Publication number: 20140282305
    Abstract: One or more techniques or systems for incorporating a common template into a system on chip (SOC) design are provided herein. For example, a common template mask set is generated based on a first set of polygon positions from a first vendor and a second set of polygon positions from a second vendor. A third party creates a third party SOC design using a set of design rules generated based on the common template mask set. The common template is fabricated based on the third party SOC design using the common template mask set. Because the common template is formed using the common template mask set and because the common template mask set is based on polygon positions from both the first vendor and the second vendor, a part can be connected to the SOC regardless of whether the part is sourced from the first vendor or the second vendor.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: William Wu Shen, Yun-Han Lee, Chin-Chou Liu, Hsien-Hsin Lee, Chung-Sheng Yuan, Chao-Yang Yeh, Wei-Cheng Wu, Ching-Fang Chen
  • Patent number: 6643745
    Abstract: A computer system is disclosed. The computer system includes a higher level cache, a lower level cache, a decoder to decode instructions, and a circuit coupled to the decoder. In one embodiment, the circuit, in response to a single decoded instruction, retrieves data from external memory and bypasses the lower level cache upon a higher level cache miss. In another embodiment, the circuit, in response to a first decoded instruction, issues a request to retrieve data at an address from external memory to place said data only in the lower level cache, detects a second cacheable decoded instruction to said address, and places said data in the higher level cache.
    Type: Grant
    Filed: March 31, 1998
    Date of Patent: November 4, 2003
    Assignee: Intel Corporation
    Inventors: Salvador Palanca, Niranjan L. Cooray, Angad Narang, Vladimir Pentkovski, Steve Tsai, Subramaniam Maiyuran, Jagannath Keshava, Hsien-Hsin Lee, Steve Spangler, Suresh Kuttuva, Praveen Mosur
  • Patent number: 6369813
    Abstract: The present invention is directed to a method and apparatus for processing normalized meshes. The normalized meshes are formed by N polygons which have M vertices. M vertex coordinates are stored in a vertex array corresponding to the M vertices of the N polygons. N polygon indices are stored in an index array. Each of the N polygon indices references a predetermined number of the M vertex coordinates. A first subset of the index array having N1 polygon indices is determined. A second subset of the vertex array is selected such that the second subset contains M1 vertex coordinates corresponding entirely to the N1 polygon indices in the first subset. The second subset defines a window having a small size relative to the vertex array. The M1 vertex coordinates in the second subset are processed to generate processed data. The processed data are then concurrently sent to a graphics processor in an on-line manner.
    Type: Grant
    Filed: June 30, 1998
    Date of Patent: April 9, 2002
    Assignee: Intel Corporation
    Inventors: Vladimir Pentkovski, Deep Buch, Michael K. Dwyer, Hsien-Hsin Lee, Hsien-Cheng E. Hsieh
  • Patent number: 6356270
    Abstract: The present invention discloses a method and apparatus method for efficient utilization of write-combining buffers for a sequence of non-temporal stores to scattered locations. The method comprises: converting the sequence of non-temporal stores to stores to intermediate buffers; and grouping the stores to intermediate buffers into consecutive non-temporal stores. The consecutive non-temporal stores correspond to adjacent memory locations in the write-combining buffers.
    Type: Grant
    Filed: March 31, 1998
    Date of Patent: March 12, 2002
    Assignee: Intel Corporation
    Inventors: Vladimir Pentkovski, Hsien-Cheng E. Hsieh, Hsien-Hsin Lee, Subramaniam Maiyuran
  • Publication number: 20020008698
    Abstract: The present invention is directed to a method and apparatus for processing normalized meshes. The normalized meshes are formed by N polygons which have M vertices. M vertex coordinates are stored in a vertex array corresponding to the M vertices of the N polygons. N polygon indices are stored in an index array. Each of the N polygon indices references a predetermined number of the M vertex coordinates. A first subset of the index array having N1 polygon indices is determined. A second subset of the vertex array is selected such that the second subset contains M1 vertex coordinates corresponding entirely to the N1 polygon indices in the first subset. The second subset defines a window having a small size relative to the vertex array. The M1 vertex coordinates in the second subset are processed to generate processed data. The processed data are then concurrently sent to a graphics processor in an on-line manner.
    Type: Application
    Filed: June 30, 1998
    Publication date: January 24, 2002
    Inventors: VLADIMIR PENTKOVSKI, DEEP BUCH, MICHAEL K. DWYER, HSIEN-HSIN LEE, HSIEN-CHENG E. HSIEH
  • Publication number: 20010013870
    Abstract: The present invention discloses a method and apparatus method for efficient utilization of write-combining buffers for a sequence of non-temporal stores to scattered locations. The method comprises: converting the sequence of non-temporal stores to stores to intermediate buffers; and grouping the stores to intermediate buffers into consecutive non-temporal stores. The consecutive non-temporal stores correspond to adjacent memory locations in the write-combining buffers.
    Type: Application
    Filed: March 31, 1998
    Publication date: August 16, 2001
    Inventors: VLADIMIR PENTKOVSKI, HSIEN-CHENG E. HSIEH, HSIEN-HSIN LEE, SUBRAMANIAM MAIYURAN
  • Patent number: 6223276
    Abstract: The present invention discloses a method and apparatus for processing strips of data, each strip referencing a plurality of parameter sets stored in a memory. The method comprises: prefetching a plurality of parameter sets referenced in a first strip; performing an operation on each of the prefetched parameter sets; and concatenating a first strip and a second strip to eliminate a memory access latency in the second strip.
    Type: Grant
    Filed: March 31, 1998
    Date of Patent: April 24, 2001
    Assignee: Intel Corporation
    Inventors: Hsien-Hsin Lee, Vladimir Pentkovski, Hsien-Cheng E. Hsieh