Patents by Inventor Hsien-Hua Tseng

Hsien-Hua Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer transport pod with linear door opening mechanism
    Patent number: 6755602
    Abstract: A pod for transporting a cassette of semiconductor wafers that is equipped with a linearly operated door opening/closing mechanism is provided. The pod includes a body member, a cover member and a latch carried on the covet member for latching the cover member onto the body member. The latch is actuatable and operable linearly from a latched condition in which the cover member is latched onto the body member to a released condition allowing removal of the cover member from the body member when engaged linearly by a latch key of a door opener situated in a loadport onto which the cassette pod is positioned.
    Type: Grant
    Filed: February 7, 2002
    Date of Patent: June 29, 2004
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Hsien-Hua Tseng, Chia-Hung Chung
  • Wafer transport pod with linear door opening mechanism
    Publication number: 20030147728
    Abstract: A pod for transporting a cassette of semiconductor wafers that is equipped with a linearly operated door opening/closing mechanism is provided. The pod includes a body member, a cover member and a latch means carried on the cover member for latching the cover member onto the body member. The latch means is acuatable and operable linearly from a latched condition in which the cover member is latched onto the body member to a released condition allowing removal of the cover member from the body member when engaged linearly by a latch key of a door opener situated in a loadport onto which the cassette pod is positioned.
    Type: Application
    Filed: February 7, 2002
    Publication date: August 7, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsien-Hua Tseng, Chia-Hung Chung