Abstract: A bonded assembly includes an interposer; a semiconductor die that is attached to the interposer and including a planar horizontal bottom surface and a contoured sidewall; a high bandwidth memory (HBM) die that is attached to the interposer; and a dielectric material portion contacting the semiconductor die and the interposer. The contoured sidewall includes a vertical sidewall segment and a non-horizontal, non-vertical surface segment that is adjoined to a bottom edge of the vertical sidewall segment and is adjoined to an edge of the planar horizontal bottom surface of the semiconductor die. The vertical sidewall segment and the non-horizontal, non-vertical surface segment are in contact with the dielectric material portion. The contoured sidewall may provide a variable lateral spacing from the HBM die to reduce local stress in a portion of the HBM die that is proximal to the interposer.

Abstract: A cooling tower control method, used for controlling a cooling tower having at least one sensor, includes: receiving and processing a received sensor data; based on the received sensor data, timing training a water outlet temperature prediction model; receiving a target water outlet temperature; traverse searching a plurality of control parameter combinations meeting the target water outlet temperature; selecting an energy-saving target control parameter combination from the plurality of control parameter combinations meeting the target water outlet temperature; and controlling the cooling tower based on the target control parameter combination.

Abstract: An optical waveguide ribbon includes a base layer integrated with a plurality of parallel optical cores. The optical waveguide ribbon includes a first surface and a second surface opposite to the first surface. The optical cores extend along a length direction and arrange along a width direction. A first positioning portion is exposed on the first surface with a given shape and a second positioning portion is exposed on the second surface and has a positioning dimension in width according to the given shape of the first positioning portion.

Abstract: A method for producing an optical waveguide includes following steps: firstly, providing a substrate and coating resins on the substrate to form a clad; secondly, providing a container filled with waveguide material and inject the waveguide material through a nozzle of the container to form a shape needed on the clad; thirdly, shining UV lights on the waveguide material to harden the waveguide material to form the waveguide. This new method uses less waveguide material and simplifies the steps.