Abstract: A semiconductor die package includes an inductor-capacitor (LC) semiconductor die that is directly bonded with a logic semiconductor die. The LC semiconductor die includes inductors and capacitors that are integrated into a single die. The inductors and capacitors of the LC semiconductor die may be electrically connected with transistors and other logic components on the logic semiconductor die to form a voltage regulator circuit of the semiconductor die package. The integration of passive components (e.g., the inductors and capacitors) of the voltage regulator circuit into a single semiconductor die reduces signal propagation distances in the voltage regulator circuit, which may increase the operating efficiency of the voltage regulator circuit, may reduce the formfactor for the semiconductor die package, may reduce parasitic capacitance and/or may reduce parasitic inductance in the voltage regulator circuit (thereby improving the performance of the voltage regulator circuit), among other examples.

Abstract: A semiconductor die package includes a high dielectric constant (high-k) dielectric layer over a device region of a first semiconductor die that is bonded with a second semiconductor die in a wafer on wafer (WoW) configuration. A through silicon via (TSV) structure may be formed through the device region. The high-k dielectric layer has an intrinsic negative charge polarity that provides a coupling voltage to modify the electric potential in the device region. In particular, the electron carriers in high-k dielectric layer attracts hole charge carriers in device region, which suppresses trap-assist tunnels that result from surface defects formed during etching of the recess for the TSV structure. Accordingly, the high-k dielectric layer described herein reduces the likelihood of (and/or the magnitude of) current leakage in semiconductor devices that are included in the device region of the first semiconductor die.

Abstract: In an embodiment, a method includes: attaching a package component to a package substrate, the package component includes: a first die being disposed over an interposer; a second die being disposed over the interposer and laterally adjacent to the first die; and an encapsulant being disposed around the first die and the second die; attaching a thermal interface material to the first die and the second die; and attaching a lid structure to the package substrate, the lid structure includes: a lid cap being disposed over the thermal interface material; and a plurality of lid feet connecting the lid cap to the package substrate, in a plan view the plurality of lid feet forming a discontinuous loop around the package component.

Abstract: A display apparatus and a manufacturing method of the display apparatus are provided. The display apparatus includes a substrate and a first sub-pixel located on the substrate. The first sub-pixel includes a first bottom electrode, a first light-emitting layer, and a first top electrode. The first light-emitting layer is located on the first bottom electrode. The first light-emitting layer includes a first groove structure or a first protrusion structure. The first top electrode is located on the first light-emitting layer.

Abstract: A display apparatus and a manufacturing method of the display apparatus are provided. The display apparatus includes a substrate and a first sub-pixel located on the substrate. The first sub-pixel includes a first bottom electrode, a first light-emitting layer, and a first top electrode. The first light-emitting layer is located on the first bottom electrode. The first light-emitting layer includes a first groove structure or a first protrusion structure. The first top electrode is located on the first light-emitting layer.

Abstract: A display panel and a sealing process are provided. The display panel has a display area and a non-display area; the sealing process includes following steps. A first substrate having a pixel array in the display area is provided. An absorption material layer is formed in the non-display area of the first substrate. A second substrate having a sealing material layer in the non-display area is provided. The second substrate and the first substrate are assembled, and a display medium is formed therebetween. The absorption material layer and the sealing material layer at least partially overlap. A laser processing process is performed on the sealing material layer, so that the first substrate is adhered to the second substrate by the sealing material layer. The absorption material layer is adopted for absorbing a portion of a laser beam passing through the sealing material layer in the laser processing process.

Abstract: A display panel and a sealing process are provided. The display panel has a display area and a non-display area; the sealing process includes following steps. A first substrate having a pixel array in the display area is provided. An absorption material layer is formed in the non-display area of the first substrate. A second substrate having a sealing material layer in the non-display area is provided. The second substrate and the first substrate are assembled, and a display medium is formed therebetween. The absorption material layer and the sealing material layer at least partially overlap. A laser processing process is performed on the sealing material layer, so that the first substrate is adhered to the second substrate by the sealing material layer. The absorption material layer is adopted for absorbing a portion of a laser beam passing through the sealing material layer in the laser processing process.

Abstract: A transparent display device includes at least a first transparent display panel and a second transparent display panel, each of which has transparent regions and display regions. The arrangements of the transparent regions and display regions of the first transparent display panel and the second transparent display panel are opposite to each other. The transparent display device can apply a high transparency display mode or a lower transparency display mode by arranging the relative position of the first and second transparent display panels. In the lower transparency display mode, the first and second transparent display panels are at least partial overlapped with each other so as to display clear image with high definition.

Abstract: A battery monitoring system includes a detector and a supervisor connected to the detector. Wherein, pluralities of sensors of the detector respectively disposed on battery cells of the battery for at least correspondingly detecting voltage and temperature signals of the battery cells. Subsequently, the aforementioned signals are transmitted to a central processor for a separate conversion into accessible and distinguishable data applied to compare with a predetermined threshold. Finally, the compared results would be shown on the supervisor for users to realize the physical state of each battery. The central processor friendly reacts to the compared result under the irregular state and emits a warning signal to the supervisor, for which to promptly carry out a warning action.

Abstract: The present invention discloses a device for spin cleaning and etching wet processor. The support is kept in a fixed level, and the drain tank can be lifting and lowering to collect and drain out the liquid from the support. This device consists of a suport, a set of drain tank and a lifting and lowering device to move the drain tank so that one of the drain tank is in the same level with the suport. The suport is used to support a wafer to process etching and cleaning, can spin with different speed and supply etching solution and DI water. The number of drain tanks are selected by the number of etching solutions and DI water. A stationary axaust appratus kept in a fixed level as the support is used to axaust the acidic gas from the drain tanks.

Abstract: A battery module includes a battery case, at least a battery, and at least a thermal pad. The battery case includes a top cover and a bottom cover. The battery is received in the bottom cover of the battery case. The thermal pad is placed in a chamber of the batteries and pressed by the top cover of the battery case after the top cover and the bottom cover covering together. Therefore, the thermal energy created by the battery module can be easily transmitted to the outside of the battery module case along the thermal pad.

Abstract: A battery charging apparatus connects secondary batteries of the battery pack, plurality of charge terminals and two discharge terminals to form plurality charge paths and a discharge path, which has a main switch provided on the discharge path, a main controller connecting the battery pack and the main switch, plurality of sub switches provided on the charge paths, plurality of sub controllers connecting secondary batteries of the battery pack and corresponding sub switches, a thermal controller connecting the main controller and a temperature switch. The temperature switch connects the sub switches. The main controller and sub controllers monitor charge state and discharge state of the battery pack to set the main switch and sub switches cut off the discharge path and the charge paths. The thermal controller monitors temperature of the battery pack and main switch to set the main switch and the sub switches cut off the discharge path and the charge paths.

Abstract: A battery charging apparatus connects secondary batteries of the battery pack, plurality of charge terminals and two discharge terminals to form plurality charge paths and a discharge path, which has a main switch provided on the discharge path, a main controller connecting the battery pack and the main switch, plurality of sub switches provided on the charge paths, plurality of sub controllers connecting secondary batteries of the battery pack and corresponding sub switches, a thermal controller connecting the main controller and a temperature switch. The temperature switch connects the sub switches. The main controller and sub controllers monitor charge state and discharge state of the battery pack to set the main switch and sub switches cut off the discharge path and the charge paths. The thermal controller monitors temperature of the battery pack and main switch to set the main switch and the sub switches cut off the discharge path and the charge paths.

Abstract: A battery module includes a battery case, at least a battery, and at least a thermal pad. The battery case includes a top cover and a bottom cover. The battery is received in the bottom cover of the battery case. The thermal pad is placed in a chamber of the batteries and pressed by the top cover of the battery case after the top cover and the bottom cover covering together. Therefore, the thermal energy created by the battery module can be easily transmitted to the outside of the battery module case along the thermal pad.