Patents by Inventor Hsien-Hung Wei

Hsien-Hung Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240088093
    Abstract: In an embodiment, a method includes: attaching a package component to a package substrate, the package component includes: a first die being disposed over an interposer; a second die being disposed over the interposer and laterally adjacent to the first die; and an encapsulant being disposed around the first die and the second die; attaching a thermal interface material to the first die and the second die; and attaching a lid structure to the package substrate, the lid structure includes: a lid cap being disposed over the thermal interface material; and a plurality of lid feet connecting the lid cap to the package substrate, in a plan view the plurality of lid feet forming a discontinuous loop around the package component.
    Type: Application
    Filed: January 4, 2023
    Publication date: March 14, 2024
    Inventors: Wensen Hung, Tsung-Yu Chen, Wen-Hsin Wei, Hsien-Pin Hu
  • Publication number: 20090277792
    Abstract: The present invention discloses a method for concentrating charged particles and an apparatus thereof. The method comprises: providing a substrate comprising a reservoir; disposing a conducting granule in the reservoir, the conducting granule being negatively charged or positively charged and comprising nano-pores or nano-channels capable of permitting ion permeation; disposing a buffer solution in the reservoir, the buffer solution comprising counter-ions having an opposite electric property to the conducting granule; adding the charged particles into the buffer solution, the charged particles being co-ions having an identical electric property as the conducting granule; and applying an external electric field on the conducting granule.
    Type: Application
    Filed: March 30, 2009
    Publication date: November 12, 2009
    Applicant: NATIONAL CHUNG CHENG UNIVERSITY
    Inventors: Shau-Chun Wang, Hsueh-Chia Chang, Hsiao-Ping Chen, Hsien-Hung Wei, Chun-Ching Yu, Min-Hsuan Tsai