Abstract: A sound producing package structure includes a shell and a chip. The shell includes a top structure, a bottom structure and a sidewall structure. The chip is disposed inside the shell and configured to produce an acoustic wave, wherein the chip includes a thin film structure and an actuator configured to actuate the thin film structure, and the thin film structure is substantially parallel to the top structure and the bottom structure. A first opening is formed on the sidewall structure, and the acoustic wave propagates outwards through the first opening.

Abstract: A sound producing package structure includes a first sub-package structure and a second sub-package structure. The first sub-package structure includes a first substrate having a first opening and a first chip including a first membrane, wherein a first cavity is formed between the first membrane and the first substrate. The first sub-package structure and the second sub-package structure are stacked, and the second sub-package structure includes a second substrate and a second chip. The second substrate is connected to the first substrate and has a second opening. The second chip includes a second membrane, wherein a second cavity is formed between the second membrane and the second substrate. A gap, connected to the first opening and the second opening, is formed between the first substrate and the second substrate, such that an ambient of the sound producing package structure, the first cavity and the second cavity are connected.

Abstract: A sound producing package structure includes a first sub-package structure and a second sub-package structure. The first sub-package structure includes a first substrate having a first opening and a first chip including a first membrane, wherein a first cavity is formed between the first membrane and the first substrate. The first sub-package structure and the second sub-package structure are stacked, and the second sub-package structure includes a second substrate and a second chip. The second substrate is connected to the first substrate and has a second opening. The second chip includes a second membrane, wherein a second cavity is formed between the second membrane and the second substrate. A gap, connected to the first opening and the second opening, is formed between the first substrate and the second substrate, such that an ambient of the sound producing package structure, the first cavity and the second cavity are connected.

Abstract: A package structure includes a housing and a sound producing chip. The sound producing chip is disposed within the housing. The sound producing chip includes a membrane and an actuator. The membrane includes a coupling plate and a spring structure connected to the coupling plate. The actuator is configured to receive a driving signal to actuate the membrane. The spring structure is situated between the coupling plate and the actuator. The coupling plate is actuated to move by the actuator via the spring structure.

Abstract: A sound producing package structure includes a shell and a chip. The shell includes a top structure, a bottom structure and a sidewall structure. The chip is disposed inside the shell and configured to produce an acoustic wave, wherein the chip includes a thin film structure and an actuator configured to actuate the thin film structure, and the thin film structure is substantially parallel to the top structure and the bottom structure. A first opening is formed on the sidewall structure, and the acoustic wave propagates outwards through the first opening.

Abstract: A package structure includes a housing and a sound producing chip. The sound producing chip is disposed within the housing. The sound producing chip includes a membrane and an actuator. The membrane includes a coupling plate and a spring structure connected to the coupling plate. The actuator is configured to receive a driving signal to actuate the membrane. The spring structure is situated between the coupling plate and the actuator. The coupling plate is actuated to move by the actuator via the spring structure.

Abstract: A MEMS microphone package includes a substrate including a sound hole, a first conduction part and a second conduction part, a sidewall connected with one end thereof to the substrate and having a conducting line electrically connected to the second conduction part, a cover plate connected to an opposite end of the sidewall and defining a chamber therein and having a solder pad and a fifth contact in conduction with the solder pad and electrically connected to the conducting line, a processor chip mounted on the substrate inside the chamber and electrically connected to the first conduction part and the second conduction part, and a acoustic wave sensor mounted on the substrate inside the chamber to face toward the sound hole and electrically connected to the first conduction part using flip-chip technology.

Abstract: A MEMS microphone package includes a substrate including a base layer, a sound hole cut through the base layer, a conduction part arranged on the base layer, a sidewall connected with one end thereof to the top surface of the base layer and having a conducting line electrically connected to the conduction part, a cover plate connected to an opposite end of the sidewall and having a solder pad and a third contact disposed in conduction with the solder pad and electrically connected to the conducting line, an acoustic wave sensor mounted on the top surface of the base layer to face toward the sound hole, a processor chip mounted on the top surface of the base layer and electrically connected to the acoustic wave sensor and the conduction part, and one or multiple electronic components electrically bonded to the cover plate.

Abstract: A MEMS microphone package includes a substrate including a base layer, a sound hole cut through opposing top and bottom surfaces of the base layer, a conduction part arranged on the base layer and a notch located on the top surface of the base layer, a sidewall connected with one end thereof to the top surface of the base layer and having a conducting line electrically connected to the conduction part, a cover plate connected to an opposite end of the sidewall and having a solder pad and a third contact disposed in conduction with the solder pad and electrically connected to the conducting line, a processor chip mounted in the notch and electrically connected to the conduction part, and an acoustic wave sensor mounted on the base layer to face toward the sound hole and electrically connected to the processor chip.

Abstract: A MEMS microphone package includes a substrate including a base layer, a sound hole cut through the base layer, a conduction part arranged on the base layer, a sidewall connected with one end thereof to the top surface of the base layer and having a conducting line electrically connected to the conduction part, a cover plate connected to an opposite end of the sidewall and having a solder pad and a third contact disposed in conduction with the solder pad and electrically connected to the conducting line, an acoustic wave sensor mounted on the top surface of the base layer to face toward the sound hole, a processor chip mounted on the top surface of the base layer and electrically connected to the acoustic wave sensor and the conduction part, and one or multiple electronic components electrically bonded to the cover plate.

Abstract: A MEMS microphone package includes a substrate including a base layer, a sound hole cut through opposing top and bottom surfaces of the base layer, a conduction part arranged on the base layer and a notch located on the top surface of the base layer, a sidewall connected with one end thereof to the top surface of the base layer and having a conducting line electrically connected to the conduction part, a cover plate connected to an opposite end of the sidewall and having a solder pad and a third contact disposed in conduction with the solder pad and electrically connected to the conducting line, a processor chip mounted in the notch and electrically connected to the conduction part, and an acoustic wave sensor mounted on the base layer to face toward the sound hole and electrically connected to the processor chip.

Abstract: A microelectromechanical microphone package structure includes a substrate, sidewall, lid, sound wave transducer and processing module. The substrate has a plate, sound aperture penetrating the plate, and conduction portion disposed on the plate. The sidewall has one end disposed on the plate and has a conduction circuit electrically connected to the conduction portion. A chamber is defined between the lid, sidewall and plate. The lid has at least one solder pad and a third contact in electrical conduction with each other. The third contact is electrically connected to the conduction circuit. The sound wave transducer is disposed on the plate and in the chamber and aligned with the sound aperture. The processing module, which is disposed on the plate and in the chamber and electrically connected to the sound wave transducer and conduction portion, includes a processing chip and electronic component which are stacked and disposed on the plate.

Abstract: A MEMS microphone package includes a substrate including a sound hole, a first conduction part and a second conduction part, a sidewall connected with one end thereof to the substrate and having a conducting line electrically connected to the second conduction part, a cover plate connected to an opposite end of the sidewall and defining a chamber therein and having a solder pad and a fifth contact in conduction with the solder pad and electrically connected to the conducting line, a processor chip mounted on the substrate inside the chamber and electrically connected to the first conduction part and the second conduction part, and a acoustic wave sensor mounted on the substrate inside the chamber to face toward the sound hole and electrically connected to the first conduction part using flip-chip technology.

Abstract: A flip-chip MEMS microphone includes a substrate having a conduction line, a metal shell capped on the substrate to define therein a first cavity and having a sound receiving hole aimed at a sensor chip that is accommodated in the metal shell and electrically connected to a processor chip in the metal shell, and a plastic part mounted at one lateral side inside the metal shell and having built therein exposed ports that are electrically connected with the conduction line and the processor chip. Thus, the flip-chip MEMS microphone provides a flip-chip package structure to increase the cavity volume, improving the signal-to-noise ratio (SNR).

Abstract: A MEMS microphone packaging method includes the steps of: providing a substrate having a conducting part and a through hole; mounting a processor chip on the substrate and electrically connecting the processor chip to the conducting part; mounting a sensor chip on the substrate over the through hole and adjacent to the processor chip and electrically connecting the sensor chip to the processor chip; and mounting a cover on the substrate over the processor chip and the sensor chip. The cover has a conducting circuit, and the conducting circuit electrically coupled with the conducting part. Thus, the method of the invention can make a flip architecture MEMS microphone, reducing the steps of the packaging process and lowering the degree of difficulty of the manufacturing process and the manufacturing costs.

Abstract: A stacked MEMS microphone packaging method includes the steps of: providing a substrate having a conducting part and a through hole; affixing a retaining wall to the substrate and forming a conducting circuit in electrical connection with the conducting part; mounting a processor chip and a sensor chip on the substrate to have the sensor chip be disposed at a top side of the through hole; providing a carrier board having a first solder pad and a second solder pad and fixedly mounting the carrier board at the retaining wall and electrically coupled to the first solder pad and the second solder pad. Thus, the method can make a flip architecture MEMS microphone, reducing the steps of the packaging process and lowering the degree of difficulty of the manufacturing process and the manufacturing costs.

Abstract: A MEMS microphone packaging method includes the steps of: providing a substrate having a conducting part and a through hole; mounting a processor chip on the substrate and electrically connecting the processor chip to the conducting part; mounting a sensor chip on the substrate over the through hole and adjacent to the processor chip and electrically connecting the sensor chip to the processor chip; and mounting a cover on the substrate over the processor chip and the sensor chip. The cover has a conducting circuit, and the conducting circuit electrically coupled with the conducting part. Thus, the method of the invention can make a flip architecture MEMS microphone, reducing the steps of the packaging process and lowering the degree of difficulty of the manufacturing process and the manufacturing costs.

Abstract: A stacked MEMS microphone packaging method includes the steps of: providing a substrate having a conducting part and a through hole; affixing a retaining wall to the substrate and forming a conducting circuit in electrical connection with the conducting part; mounting a processor chip and a sensor chip on the substrate to have the sensor chip be disposed at a top side of the through hole; providing a carrier board having a first solder pad and a second solder pad and fixedly mounting the carrier board at the retaining wall and electrically coupled to the first solder pad and the second solder pad. Thus, the method can make a flip architecture MEMS microphone, reducing the steps of the packaging process and lowering the degree of difficulty of the manufacturing process and the manufacturing costs.