Patents by Inventor Hsien Ker

Hsien Ker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140124713
    Abstract: Provided are high-aspect ratio printable thick film metal paste compositions that can be deposited onto a substrate using, for example, screening printing techniques; and methods of preparing and using thick film printable metal pastes; and methods of screen printing of the thick film metal paste compositions onto a substrate to produce printed circuits, conductive lines or features on the substrate and/or a conductive surface on a solar cell device. Also provided are printed substrates containing an electronic feature produced by the high-aspect ratio printable thick film metal paste compositions.
    Type: Application
    Filed: March 29, 2012
    Publication date: May 8, 2014
    Inventors: Diptarka Majumdar, Hsien Ker, Philippe Schottland, Michael McAllister