Patents by Inventor Hsien-Kun Chu

Hsien-Kun Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8119746
    Abstract: This application relates to polysiloxane compositions grafted with improved heat curable, moisture curable, or heat/moisture curable groups. In particular, the polysiloxane compositions have reactive groups on the terminal or pendent areas of the siloxane backbone, which once reacted provide improved heat and/or moisture curable polysiloxanes.
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: February 21, 2012
    Assignee: Henkel Corporation
    Inventors: Bahram Issari, Michael P. Levandoski, Richard Corrao, Hsien-Kun Chu, Robert P. Cross
  • Patent number: 8013314
    Abstract: The present invention relates to curable silicone compositions which include a fluorescent agent for detection purposes and which have a cure system which enables the silicone compositions to possess improved depth of cure. The silicone compositions are photocurable, and may also be moisture or heat curable.
    Type: Grant
    Filed: November 18, 2005
    Date of Patent: September 6, 2011
    Assignee: Henkel Corporation
    Inventors: Michael P. Levandoski, Hsien-Kun Chu, Richard Corrao
  • Patent number: 7837824
    Abstract: The present invention relates to photoradiation and/or moisture curing silicone compositions and methods for producing and using the same. In particular, the methods of the present invention permit controlled growth of a polymer, and allow for incorporation of pendant functional groups along the length of the polymer.
    Type: Grant
    Filed: January 18, 2006
    Date of Patent: November 23, 2010
    Assignee: Henkel Corporation
    Inventors: Bahram Issari, Lester D. Bennington, Robert Cross, John Kerr, Thomas Fay-Oy Lim, Hsien-Kun Chu, Mathias E. Liistro, Jr., Douglas N. Horner
  • Patent number: 7790094
    Abstract: The present invention relates to a process for forming a cured-in-place gasket by liquid injection molding. More particularly, the present invention relates to a low pressure and room temperature process for forming a cured-in-place gasket by liquid injection molding.
    Type: Grant
    Filed: February 7, 2006
    Date of Patent: September 7, 2010
    Assignee: Henkel Corporation
    Inventors: Thomas Fay-Oy Lim, Hsien-Kun Chu, Mathias E. Liistro, Jr., Anthony R. Horelik, Robert P. Cross, Debora E. Duch, Alfred A. DeCato, James E. Lionberger
  • Patent number: 7691959
    Abstract: The present invention generally relates to a moisture curable composition in the form of a hot melt. The inventive compositions contain hydrolyzable silyl groups connected to a polymer which is capable of crosslinking when exposed to moisture.
    Type: Grant
    Filed: October 29, 2007
    Date of Patent: April 6, 2010
    Assignee: Henkel Corporation
    Inventors: Thomas Fay-Oy Lim, David Dworak, Jessica Fedorchick, Hsien-Kun Chu
  • Patent number: 7625978
    Abstract: The present invention provides curable hot melt compositions including reactive polymers, which are reinforced by organic polymers to impart higher tensile strength and elongation to the compositions upon cure. In particular, the present invention provides curable hot melt compositions including a silicone urea based polymer and a reinforcement polymer. In some embodiments, the compositions cure upon exposure to moisture and/or radiation. The compositions may be used, for example, as sealants or adhesives.
    Type: Grant
    Filed: October 27, 2006
    Date of Patent: December 1, 2009
    Assignee: Henkel Corporation
    Inventors: Thomas Fay-Oy Lim, David P. Dworak, Mathias E. Liistro, Jr., Hsien-Kun Chu
  • Publication number: 20090166559
    Abstract: The present invention relates to curable silicone compositions which include a fluorescent agent for detection purposes and which have a cure system which enables the silicone compositions to possess improved depth of cure. The silicone compositions are photocurable, and may also be moisture or heat curable.
    Type: Application
    Filed: November 18, 2005
    Publication date: July 2, 2009
    Applicant: Henkel Corporation
    Inventors: Michael P. Levandoski, Hsien-Kun Chu, Richard Corrao
  • Publication number: 20090143554
    Abstract: This application relates to polysiloxane compositions grafted with improved heat curable, moisture curable, or heat/moisture curable groups. In particular, the polysiloxane compositions have reactive groups on the terminal or pendent areas of the siloxane backbone, which once reacted provide improved heat and/or moisture curable polysiloxanes.
    Type: Application
    Filed: November 26, 2008
    Publication date: June 4, 2009
    Applicant: Henkel Corporation
    Inventors: Bahram Issari, Michael P. Levandoski, Richard Corrao, Hsien-Kun Chu, Robert P. Cross
  • Publication number: 20080306208
    Abstract: The present invention relates to a method of preparing fast curing silicone RTV compositions by reacting an amino endcapped silicone with an isocyanato functionalized silane, and to compositions formed thereby. In particular, the present invention provides compositions which include silicones endcapped with silanes which contain ?-ureas.
    Type: Application
    Filed: November 16, 2006
    Publication date: December 11, 2008
    Applicants: Henkel Corporation, Henkel KGaA
    Inventors: Thomas Fay-Oy Lim, Hsien-Kun Chu, Robert P. Cross, Mathias E. Liistro, JR., David P. Dworak, Paul Borucki, Scott Senuta, Daniela Bathelt, Thomas Bachon
  • Patent number: 7452937
    Abstract: A room temperature vulcanizing silicone polymer composition including: a) as part of the silicone polymer, a segment including a silicone polymer of Formula (I): b) a finely-divided inorganic filler present in an amount of at least about 25% by weight of the total composition. Enhanced elongation ability is possessed by these compositions.
    Type: Grant
    Filed: November 28, 2005
    Date of Patent: November 18, 2008
    Assignee: Henkel Corporation
    Inventors: Robert P. Cross, Thomas Fay-Oy Lim, Hsien-Kun Chu, Mathias E. Liistro, Jr., Alfred A. DeCato, Debora E. Duch, Bahram Issari
  • Publication number: 20080268161
    Abstract: The present invention relates to compositions which include compounds that are end-capped with silanes containing radiation cure groups. In addition, the invention relates to a method for preparing such compounds. In particular, the radiation cure groups are attached to the silane via a methylene linkage.
    Type: Application
    Filed: November 20, 2006
    Publication date: October 30, 2008
    Applicant: Henkel Corporation
    Inventors: Hsien-Kun Chu, Thomas Fay-Oy Lim, Michael P. Levandoski
  • Publication number: 20080241407
    Abstract: Moisture curable compositions having hard and soft segments are disclosed. Also disclosed are dual cure compositions capable of both moisture and radiation cure. The present invention provides compositions which have increased tolerances for high temperatures, and compositions which have increased rheological control.
    Type: Application
    Filed: September 1, 2005
    Publication date: October 2, 2008
    Inventors: Hsien-Kun Chu, Thomas Fay-Oy Lim, Mathias E. Liistro
  • Publication number: 20080128955
    Abstract: The present invention relates to a process for forming a cured-in-place gasket by liquid injection molding. More particularly, the present invention relates to a low pressure and room temperature process for forming a cured-in-place gasket by liquid injection molding.
    Type: Application
    Filed: February 8, 2006
    Publication date: June 5, 2008
    Applicant: HENKEL CORPORATION
    Inventors: Thomas Fay-Oy Lim, Robert P. Cross, Hsien-Kun Chu, Deboral E. Duch, Mathias E. Liistro, Alfred A. DeCato, Anthony R. Horelik, James E. Lioberber
  • Publication number: 20080105374
    Abstract: The present invention relates to photoradiation and/or moisture curing silicone compositions and methods for producing and using the same. In particular, the methods of the present invention permit controlled growth of a polymer, and allow for incorporation of pendant functional groups along the length of the polymer.
    Type: Application
    Filed: January 18, 2006
    Publication date: May 8, 2008
    Applicant: HENKEL CORPORATION
    Inventors: Bahram Issari, Lester D. Bennington, Robert Cross, John Kerr, Thomas Fay-Oy Lim, Hsien-Kun Chu, Matthias E. Liistro, Douglas N. Horner
  • Patent number: 7368519
    Abstract: The invention provides fast moisture and photo/moisture curing silicone compositions and methods for the preparation thereof. More particularly, the compositions provided are prepared from silanol and silane cappers; the cappers have an ?-carbon bonded to the silicon atom allowing for a favorable hypervalent silicon transition state when reacting the silane and silanol. This favorable transition state enables both a fast endcapping reaction and contributes to the fast moisture curing properties of the inventive compositions.
    Type: Grant
    Filed: October 15, 2003
    Date of Patent: May 6, 2008
    Assignee: Henkel Corporation
    Inventor: Hsien-Kun Chu
  • Publication number: 20070123640
    Abstract: A room temperature vulcanizing silicone polymer composition including: a) as part of the silicone polymer, a segment including a silicone polymer of Formula (I): b) a finely-divided inorganic filler present in an amount of at least about 25% by weight of the total composition. Enhanced elongation ability is possessed by these compositions.
    Type: Application
    Filed: November 28, 2005
    Publication date: May 31, 2007
    Inventors: Robert Cross, Thomas Lim, Hsien-Kun Chu, Mathias Liistro, Alfred DeCato, Debora Duch, Bahram Issari
  • Publication number: 20050267276
    Abstract: The invention provides fast moisture and photo/moisture curing silicone ions and methods for the preparation thereof. More particularly, the compositions are prepared from silanol and silane cappers; the cappers have an ?-carbon bonded to the silicon atom allowing for a favorable hypervalent silicon transition state when reacting the silane and silanol. This favorable transition state enables both a fast endcapping reaction and contributes to the fast moisture curing properties of the inventive compositions.
    Type: Application
    Filed: October 15, 2003
    Publication date: December 1, 2005
    Inventor: Hsien-Kun Chu
  • Patent number: 6844376
    Abstract: The invention provides a reaction product derived from an epoxy-functional acrylic monomer and an alkylaminoalkylene polyalkoxysilane or from a reaction product derived from acrylic acid and an epoxidized polyalkoxysilane.
    Type: Grant
    Filed: July 31, 2003
    Date of Patent: January 18, 2005
    Assignee: Henkel Corporation
    Inventors: Anthony Francis Jacobine, Steven Thomas Nakos, Peter Albert Salamon, Hsien-Kun Chu
  • Patent number: 6828355
    Abstract: This invention relates to resin-reinforced silicone compositions curable upon exposure to radiation in the electromagnetic spectrum, which compositions when cured demonstrate improved elastomeric properties, such as tensile strength, modulus and elongation. The inventive resin-reinforced silicone compositions may alternatively be rendered curable by exposure to moisture. In addition, the inventive composition may be rendered curable by exposure to radiation in the electromagnetic spectrum, and exposure to moisture. The inventive silicone compositions are particularly well suited for use in electronic conformal coating and potting applications, as well as in automotive gasketing applications, pressure sensitive adhesive applications and the like.
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: December 7, 2004
    Assignee: Henkel Corporation
    Inventor: Hsien-Kun Chu
  • Patent number: 6750309
    Abstract: The present invention relates to the preparation of a new class of materials, namely, an acrylate terminated or end-capped urethane/urea copolymer containing silicone soft segments capable of dual cure via unsaturated groups and dialkoxyl silanol groups. This new class of material is a reaction product of a partially methacrylated end-capped urethane polymer containing hard segment blocks and an amino alkylene dialkoxy end-capped siloxane block polymer, containing soft-segments. The aminoalkylene dialkoxysilane end-capped siloxane segment of this copolymer can include siloxane diol segments of various molecular weights (e.g., 1,000 to 20,000) end-capped with various alkylaminoalkylene trimethoxy silanes. This copolymer is therefore capable of dual cure via these functional groups.
    Type: Grant
    Filed: May 17, 2002
    Date of Patent: June 15, 2004
    Assignee: Henkel Corporation
    Inventors: Hsien-Kun Chu, Steven T. Nakos