Patents by Inventor Hsien-Lin Hu

Hsien-Lin Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11340779
    Abstract: An operation method of touch system with handwriting function which comprises a stylus device and a touchpad, wherein a surface of the touchpad is divided into a function area and a writing area, and the operation method comprises: sending a beacon signal by the stylus device, receiving the beacon signal by touchpad, emitting a first light toward a pattern locating in the functional area of the surface of the touchpad by a light emitting element of a light emitting layer of the touchpad when signal strength of the beacon signal is bigger than a threshold, identifying, by the touchpad, a touched position on the surface when the touchpad is touched, changing the first light emitted to the pattern to a second light by the light emitting element and generating and outputting a control signal by the touchpad when the touched position falls in the pattern.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: May 24, 2022
    Assignees: MICRO-STAR INT'L CO., LTD., MSI ELECTRONIC (KUN SHAN) CO., LTD.
    Inventors: Min-Hung Lin, Hsien-Lin Hu
  • Publication number: 20210349628
    Abstract: An operation method of touch system with handwriting function which comprises a stylus device and a touchpad, wherein a surface of the touchpad is divided into a function area and a writing area, and the operation method comprises: sending a beacon signal by the stylus device, receiving the beacon signal by touchpad, emitting a first light toward a pattern locating in the functional area of the surface of the touchpad by a light emitting element of a light emitting layer of the touchpad when signal strength of the beacon signal is bigger than a threshold, identifying, by the touchpad, a touched position on the surface when the touchpad is touched, changing the first light emitted to the pattern to a second light by the light emitting element and generating and outputting a control signal by the touchpad when the touched position falls in the pattern.
    Type: Application
    Filed: April 13, 2021
    Publication date: November 11, 2021
    Applicants: MICRO-STAR INT'L CO.,LTD., MSI ELECTRONIC (KUN SHAN) CO.,LTD.
    Inventors: Min-Hung LIN, Hsien-Lin HU
  • Patent number: 10753591
    Abstract: A lightning protection structure is provided, which includes an insulation bottom layer, a graphite layer on the insulation bottom layer, an insulation shell on the graphite layer, and an electrically conductive component. A part of the electrically conductive component is disposed on the insulation shell, and another part of the electrically conductive component is in contact with the graphite layer.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: August 25, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsiang-Cheng Kung, Hsien-Lin Hu, Hsin-Hwa Chen
  • Publication number: 20190170338
    Abstract: A lightning protection structure is provided, which includes an insulation bottom layer, a graphite layer on the insulation bottom layer, an insulation shell on the graphite layer, and an electrically conductive component. A part of the electrically conductive component is disposed on the insulation shell, and another part of the electrically conductive component is in contact with the graphite layer.
    Type: Application
    Filed: December 28, 2017
    Publication date: June 6, 2019
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsiang-Cheng Kung, Hsien-Lin Hu, Hsin-Hwa Chen
  • Publication number: 20170176117
    Abstract: A heat dissipation module adapted to perform heat dissipation on a heat generating component is provided. The heat dissipation module includes a graphite sheet and an insulating and heat conducting layer. The graphite sheet includes a plurality of through holes, an attaching surface and a heat dissipating surface opposite to the attaching surface, wherein the attaching surface is configured to be attached to the heat generating component. Each of the through holes penetrates the graphite sheet, so the attaching surface and the heat dissipating surface are connected via the through holes. The insulating and heat conducting layer covers the graphite sheet. The insulating and heat conducting layer least covers the attaching surface, the heat dissipating surface and inner walls of the through holes.
    Type: Application
    Filed: December 29, 2015
    Publication date: June 22, 2017
    Inventors: Jin-Bao Wu, Wei-Chien Tsai, Hao-Wen Cheng, Ming-Sheng Leu, Jia-Jen Chang, Hsien-Lin Hu
  • Patent number: 9371233
    Abstract: A polyamide-imide represented by the following formula is provided. A graphite film prepared by performing a thermal treatment process on the polyamide-imide represented by the above-mentioned formula is also provided. In the thermal treatment process, the temperature range of the thermal treatment process ranges from 25° C. to 2,900° C.
    Type: Grant
    Filed: September 12, 2014
    Date of Patent: June 21, 2016
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chen-Lung Lin, Yen-Chun Liu, Hui-Wen Chang, Kuo-Chan Chiou, Hsien-Lin Hu
  • Publication number: 20150166347
    Abstract: A polyamide-imide represented by the following formula is provided. A graphite film prepared by performing a thermal treatment process on the polyamide-imide represented by the above-mentioned formula is also provided. In the thermal treatment process, the temperature range of the thermal treatment process ranges from 25° C. to 2,900° C.
    Type: Application
    Filed: September 12, 2014
    Publication date: June 18, 2015
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chen-Lung LIN, Yen-Chun LIU, Hui-Wen CHANG, Kuo-Chan CHIOU, Hsien-Lin HU
  • Patent number: 8785026
    Abstract: A protection structure for preventing thermal dissipation and thermal runaway diffusion in battery system is provided. The protection structure includes a battery module casing and at least one composite heat conduction plate. There is a plurality of unit cells disposed in the battery module casing. The composite heat conduction plate is located within the battery module casing, contacted with the battery module casing, and sandwiched between at least two of the unit cells as a heat transmission medium between the cells and the casing to control heat transmission among the cells. The composite heat conduction plate is a multilayer anisotropic heat conduction structure constituted by at least one heat conduction layer and at least one heat insulation layer.
    Type: Grant
    Filed: December 13, 2010
    Date of Patent: July 22, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Hsien-Lin Hu, Jenn-Dong Hwang, Cheng-Chou Wong, Chin-Chuan Chang, Sheng-Fa Yeh, Bing-Ming Lin, Yu-Min Peng
  • Publication number: 20110159340
    Abstract: A protection structure for preventing thermal dissipation and thermal runaway diffusion in battery system is provided. The protection structure includes a battery module casing and at least one composite heat conduction plate. There is a plurality of unit cells disposed in the battery module casing. The composite heat conduction plate is located within the battery module casing, contacted with the battery module casing, and sandwiched between at least two of the unit cells as a heat transmission medium between the cells and the casing to control heat transmission among the cells. The composite heat conduction plate is a multilayer anisotropic heat conduction structure constituted by at least one heat conduction layer and at least one heat insulation layer.
    Type: Application
    Filed: December 13, 2010
    Publication date: June 30, 2011
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsien-Lin Hu, Jenn-Dong Hwang, Cheng-Chou Wong, Chin-Chuan Chang, Sheng-Fa Yeh, Bing-Ming Lin, Yu-Min Peng
  • Publication number: 20100163782
    Abstract: A carbon-containing metal-based composite material and a manufacturing method thereof are provided. The carbon-containing metal-based composite material includes a plurality of graphites, a plurality of heat-conducting reinforcements and a metal matrix. The graphites occupy 35%˜90% in volume. The heat-conducting reinforcements are distributed between the graphites. The heat-conducting reinforcements and the graphites are self-bonded. The heat-conducting reinforcements occupy 5%˜30% in volume and have a thermal conductivity larger than 200 W/mK. The metal matrix is filled between the heat-conducting reinforcements and the graphites, and the metal matrix occupies 5%˜35% in volume.
    Type: Application
    Filed: September 3, 2009
    Publication date: July 1, 2010
    Applicant: Industrial Technology Research Institute
    Inventors: Chih-Chung Chang, Jenn-Dong Hwang, Hsien-Lin Hu, Chih-Chung Tu