Abstract: A multimode radar device includes a central processing module, and an antenna module disposed in a middle area of the rear end of a vehicle and electrically connected with the central processing module. The central processing module has a motion determination switch unit, which has a low distance resolution mode and a high distance resolution mode. The motion determination switch unit detects the moving direction of the vehicle. When the vehicle moves forward, the antenna module operates in the low distance resolution mode. When the vehicle reverses, the antenna module operates in the high distance resolution mode. The present invention applies different distance-based resolution modes for blind spot detection and reverse radar detection, so as to fulfill the purpose and demand in different moving motion.

Abstract: A vehicle sensing system is for being disposed on a vehicle. The vehicle sensing system includes a calculating unit, which includes a turning calculating module and a vehicle dimension dataset. The vehicle dimension dataset includes at least one of a wheelbase, a vehicle width, a front overhang and a rear overhang of the vehicle. The calculating unit is configured to receive a turning dataset of the vehicle. Based on the turning calculating module, the calculating unit is configured to determine an inner front wheel and an inner rear wheel. The calculating unit is configured to further determine a turning alarm zone in accordance with the vehicle dimension dataset and the turning dataset. The turning alarm zone is dependent on at least one of time and the turning dataset.

Abstract: A metal shielding can includes a top wall and a surrounding wall. The surrounding wall extends downwardly from a periphery of the top wall, and includes a bottom surface and a groove formed in the bottom surface for receiving a tin solder element. The strength of the tin solder element to bond the metal shielding can to a circuit board can thus be enhanced so that the metal shielding can can be secured firmly on the circuit board. Moreover, the tin solder element can be positioned accurately relative to a solder pad of the circuit board, so that the post-soldering precision is easy to control and there is no solder overflow or adverse effect on an electronic component mounted on the circuit board. Thus, rework yield can be enhanced considerably to reduce manufacturing costs.

Abstract: A metal shielding can includes a top wall and a surrounding wall. The surrounding wall extends downwardly from a periphery of the top wall, and includes a bottom surface and a groove formed in the bottom surface for receiving a tin solder element. The strength of the tin solder element to bond the metal shielding can to a circuit board can thus be enhanced so that the metal shielding can can be secured firmly on the circuit board. Moreover, the tin solder element can be positioned accurately relative to a solder pad of the circuit board, so that the post-soldering precision is easy to control and there is no solder overflow or adverse effect on an electronic component mounted on the circuit board. Thus, rework yield can be enhanced considerably to reduce manufacturing costs.