Patents by Inventor Hsien-Ming Dai

Hsien-Ming Dai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for selectively processing surface tension of solder mask layer in circuit board
    Patent number: 7805835
    Abstract: A method for selectively processing a surface tension of a solder mask layer in a circuit board is provided. The method conducts surface tension processing to the flip-chip area and the non-flip-chip area of the solder mask layer in the circuit board. Therefore, the underfill used in packaging configures relative contact angles at the flip-chip area and the non-flip-chip area of the solder mask layer, respectively. In such a way, the present invention is adapted to solve the difficulties of the underfill void bulb and the overflowing contamination at the same time.
    Type: Grant
    Filed: May 29, 2008
    Date of Patent: October 5, 2010
    Assignee: Kinsus Interconnect Technology Corp.
    Inventors: Hsien-Ming Dai, Jen-Fang Chang, Jun-Chung Hsu
  • Method For Selectively Processing Surface Tension Of Solder Mask Layer In Circuit Board
    Publication number: 20090293269
    Abstract: A method for selectively processing a surface tension of a solder mask layer in a circuit board is provided. The method conducts surface tension processing to the flip-chip area and the non-flip-chip area of the solder mask layer in the circuit board. Therefore, the underfill used in packaging configures relative contact angles at the flip-chip area and the non-flip-chip area of the solder mask layer, respectively. In such a way, the present invention is adapted to solve the difficulties of the underfill void bulb and the overflowing contamination at the same time.
    Type: Application
    Filed: May 29, 2008
    Publication date: December 3, 2009
    Inventors: Hsien-Ming Dai, Jen-Fang Chang, Jun-Chung Hsu