Abstract: A semiconductor package device includes a flexible carrier, a first chip, a second chip, a first molding layer, a first adhesive layer and a second molding layer. The flexible carrier has a flexible layer and a rigid layer. The flexible layer has a patterned build-up circuit. The rigid layer is connected to a portion surface of the flexible layer. The position that the flexible layer connected to the rigid layer is formed a first carrying part and a second carrying part. The region of the flexible layer between the first carrying part and the second carrying part without the rigid layer is formed as a first flexible part. The first chip is connected to the first carrying part by flip-chip manner and the second chip is connected to the second carrying part by flip-chip manner. The first molding layer covers the first chip and the second molding layer covers the second chip. The first adhesive layer is connected between the first molding layer and the second carrying part.

Abstract: This disclosure provides a package substrate including: a first dielectric layer formed of a first molding compound; a first conductive wire and a first conductive channel disposed in the first dielectric layer; a second dielectric layer formed of a second molding compound; a second conductive wire and a second conductive channel disposed in the second dielectric layer; a third dielectric layer formed of a third molding compound; a third conductive wire and a third conductive channel disposed in the third dielectric layer; a fourth dielectric layer formed of a fourth molding compound; a fourth conductive wire, a fourth conductive channel and a circuit device disposed in the fourth dielectric layer; wherein, a first empty region, a second empty region, a third empty region and a fourth empty region are formed in the first, second, third and fourth dielectric layers, respectively, and the empty regions are vertically overlapped.

Abstract: A semiconductor package device includes a flexible carrier, a first chip, a second chip, a first molding layer, a first adhesive layer and a second molding layer. The flexible carrier has a flexible layer and a rigid layer. The flexible layer has a patterned build-up circuit. The rigid layer is connected to a portion surface of the flexible layer. The position that the flexible layer connected to the rigid layer is formed a first carrying part and a second carrying part. The region of the flexible layer between the first carrying part and the second carrying part without the rigid layer is formed as a first flexible part. The first chip is connected to the first carrying part by flip-chip manner and the second chip is connected to the second carrying part by flip-chip manner. The first molding layer covers the first chip and the second molding layer covers the second chip. The first adhesive layer is connected between the first molding layer and the second carrying part.

Abstract: This disclosure provides a package substrate including: a first dielectric layer formed of a first molding compound; a first conductive wire and a first conductive channel disposed in the first dielectric layer; a second dielectric layer formed of a second molding compound; a second conductive wire and a second conductive channel disposed in the second dielectric layer; a third dielectric layer formed of a third molding compound; a third conductive wire and a third conductive channel disposed in the third dielectric layer; a fourth dielectric layer formed of a fourth molding compound; a fourth conductive wire, a fourth conductive channel and a circuit device disposed in the fourth dielectric layer; wherein, a first empty region, a second empty region, a third empty region and a fourth empty region are formed in the first, second, third and fourth dielectric layers, respectively, and the empty regions are vertically overlapped.

Abstract: A flexible substrate is provided, including a coreless substrate body having a flexible section, and an additional element formed on the substrate body and having a through hole exposing the flexible section, thereby reducing the overall thickness of the flexible substrate and meeting the thinning requirement

Abstract: A semiconductor package structure includes a chip and a substrate having a recess. The substrate includes a base dielectric layer as the bottom of the recess, and numbers of supporting dielectric layers as the side surfaces of the recess. The substrate further includes a base connecting layer in the base dielectric layer, and numbers of supporting connecting layers in the supporting dielectric layers. Portions of the base connecting layer exposed on the bottom of the recess are first connection pads, and portions of the base connecting layer exposed on the bottom of the base dielectric layer are bottom connection pads. The active surface of the chip is turned toward the base dielectric layer, and the chip is located on the bottom of the recess. The active surface of the chip is electrically connected to the first connection pads.

Abstract: The present disclosure provides an electronic package, including a package substrate and an electronic component formed on the package substrate. The substrate includes an insulating portion, a wiring portion embedded in the insulating portion, and a metal board disposed on the insulating portion and in contact with the wiring portion. The metal board is provided with a plurality of electrical contacts and a heat dissipating portion. The metal board can maintain a predefined heat dissipation area via the heat dissipating portion, and be connected to a circuit board via the electrical contacts.

Abstract: A substrate structure and a manufacturing method thereof are provided. The substrate structure comprises a metal carrier, a dielectric material layer, a first conductive wiring layer, a second conductive wiring layer and a conductive pillar layer. The first conductive wiring layer is disposed on a surface of the metal carrier. The dielectric material layer is disposed on a surface of the first conductive wiring layer. The conductive pillar layer is disposed inside the dielectric material layer, and located between the first conductive wiring layer and the second conductive wiring layer. The conductive pillar layer has at least one conductive pillar. The conductive pillar is electrically connected to the first conductive wiring layer and the second conductive wiring layer.

Abstract: The present disclosure provides an electronic package, including a package substrate and an electronic component formed on the package substrate. The substrate includes an insulating portion, a wiring portion embedded in the insulating portion, and a metal board disposed on the insulating portion and in contact with the wiring portion. The metal board is provided with a plurality of electrical contacts and a heat dissipating portion. The metal board can maintain a predefined heat dissipation area via the heat dissipating portion, and be connected to a circuit board via the electrical contacts.

Abstract: A rigid-flexible printed circuit board (PCB) a method for manufacturing the rigid-flexible PCB, and a PCB module having the rigid-flexible PCB are provided. The rigid-flexible printed circuit board (PCB) defines a first area, a second area, and a third area connected in the described order. The rigid-flexible PCB includes a first flexible PCB, a second flexible PCB adhered with the first flexible PCB through a bonding sheet in the third area, and, a first conductive layer and a second conductive layer formed on opposite side of the rigid-flexible PCB in the first area and the third area. The first flexible PCB is apart from the second flexible PCB in the first area and the second area.

Abstract: A substrate structure and a manufacturing method thereof are provided. The substrate structure comprises a metal carrier, a dielectric material layer, a first conductive wiring layer, a second conductive wiring layer and a conductive pillar layer. The first conductive wiring layer is disposed on a surface of the metal carrier. The dielectric material layer is disposed on a surface of the first conductive wiring layer. The conductive pillar layer is disposed inside the dielectric material layer, and located between the first conductive wiring layer and the second conductive wiring layer. The conductive pillar layer has at least one conductive pillar. The conductive pillar is electrically connected to the first conductive wiring layer and the second conductive wiring layer.

Abstract: A computing system performs a policy-based machine code compression method. The computing system hosts a virtual machine that generates machine code from bytecode. The computing system determines whether to compress the machine code file according to a set of conditions specified by a policy. If the set of conditions is satisfied, the machine code file is compressed. For system booting and package installation, the machine code file can be deleted to save storage. When launching an application, the compressed machine code file is decompressed for execution. When the application process terminates, the decompressed machine code file can be deleted. The machine code file compression can be performed on a mobile device to save storage, or on a host when building a system image to reduce download time. Parallel compression and decompression algorithms can be used for the machine code file compression and decompression in a multi-core computing system.

Abstract: A rigid-flexible printed circuit board (PCB) a method for manufacturing the rigid-flexible PCB, and a PCB module having the rigid-flexible PCB are provided. The rigid-flexible printed circuit board (PCB) defines a first area, a second area, and a third area connected in the described order. The rigid-flexible PCB includes a first flexible PCB, a second flexible PCB adhered with the first flexible PCB through a bonding sheet in the third area, and, a first conductive layer and a second conductive layer formed on opposite side of the rigid-flexible PCB in the first area and the third area. The first flexible PCB is apart from the second flexible PCB in the first area and the second area.

Abstract: An embedded electronic device and a booting method thereof are provided. The embedded electronic device, for downloading an initiation image from one of a plurality of initiation image source devices according to at least one option pin, comprises a boot memory, for storing a boot code and a plurality of initiation image source sequence tables; a microprocessor, for executing the boot code and downloading the initiation image according to one of the initiation image source sequence tables; a register, for storing a status of the at least one option pin; and a bus, coupled to the boot memory, the microprocessor and the register, for transmitting data between the boot memory, the microprocessor and the register; wherein the initiation image source sequence table is selected according to the status stored in the register, and the sequence of the initiation image source devices accessed by the microprocessor is determined according to the initiation image source sequence table.

Abstract: A portable navigation device with a TV function includes a TV module, a navigation module, a display module, a sound module, a first processing unit, a second processing unit and a TV command storage module. The TV module generates baseband TV signals, the navigation module generates position information, the display module displays image information, the sound module plays sounds, the first processing unit performs navigation programs, the second processing unit performs TV programs, and the TV command storage module stores TV commands from the first processing unit and the second processing unit. TV command transmission between the first processing unit and the second processing unit is achieved by sending interrupt signals or reset signals.

Abstract: This invention provides a method and an apparatus for determining a rendering duration. An audio/video recording system is used for recording an audio bit stream and a video bit stream. The audio bit stream includes a plurality of audio frames. The video bit stream includes N video frames. According to this invention, the rendering durations of the first and the last video frames are determined based on the moments when the system starts to record the audio frames and the video frames. According to this invention, when the (i+1)th video frame through the (i+NL)th video frame are lost, the rendering duration of the ith video frame is determined based on NL. According to this invention, when the system receives a command of synchronization correction for the ith video frame, the rendering duration of the ith video frame is determined based on a correction value.

Abstract: A method for estimating an audio length of an audio file in an audio player is provided. First, the method generates a predicted audio length based on the average bit rate of some selected audio frames in the audio file, and initializes an adjustable audio length by the predicted audio length. Then, in the process of playing each audio frame of the audio file, the method continuously calculates a latest reference audio length. If the variation between the latest reference audio length and the previous reference audio length is smaller than a predetermined threshold, the method will adjust the adjustable audio length according to the latest reference audio length. Finally, based on the ratio of the played data amount to the total data amount of the audio file, an estimated audio length can be acquired between the adjustable audio length and the reference audio length.

Abstract: A portable navigation device with a TV function includes a TV module, a navigation module, a display module, a sound module, a first processing unit, a second processing unit and a TV command storage module. The TV module generates baseband TV signals, the navigation module generates position information, the display module displays image information, the sound module plays sounds, the first processing unit performs navigation programs, the second processing unit performs TV programs, and the TV command storage module stores TV commands from the first processing unit and the second processing unit. TV command transmission between the first processing unit and the second processing unit is achieved by sending interrupt signals or reset signals.

Abstract: An embedded electronic device and a booting method thereof are provided. The embedded electronic device, for downloading an initiation image from one of a plurality of initiation image source devices according to at least one option pin, comprises a boot memory, for storing a boot code and a plurality of initiation image source sequence tables; a microprocessor, for executing the boot code and downloading the initiation image according to one of the initiation image source sequence tables; a register, for storing a status of the at least one option pin; and a bus, coupled to the boot memory, the microprocessor and the register, for transmitting data between the boot memory, the microprocessor and the register; wherein the initiation image source sequence table is selected according to the status stored in the register, and the sequence of the initiation image source devices accessed by the microprocessor is determined according to the initiation image source sequence table.

Abstract: A subband synthesis filtering apparatus for M sets of signals is provided. Each set of signals includes N subband sample signals. The apparatus includes a processor for processing the ith set of signals among the M sets of signals, wherein i is an integer index ranging from 0 to (M?1). The processor includes a DCT converting module and a generating module. The DCT converting module converts the N subband sample signals of the ith set of signals into N converted vectors. If i is an odd number, the (2j?1)th subband sample signal among the N subband sample signals is multiplied by negative one in the converting module, wherein j is an integer index ranging from 1 to (N/2). The generating module generates N pulse code modulation signals based on the N converted vectors.