Patents by Inventor Hsien Sen CHIU
Hsien Sen CHIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10864667Abstract: A molding system comprises a mold, a molding machine, a computing apparatus, and a controller. The computing apparatus is programmed to perform a first simulation to generate a velocity distribution and a temperature distribution of the molding material in a first portion of a simulating domain and a second simulation to generate a melting distribution of the solid decorating film in a second portion of the simulating domain, wherein the simulating domain corresponds to the mold cavity. The first molding simulation is to performed using a molding condition of the molding machine to set a boundary condition of the first portion, and the second molding simulation is performed using the velocity distribution and the temperature distribution of the molding material to set a boundary condition of the second portion.Type: GrantFiled: March 6, 2018Date of Patent: December 15, 2020Assignee: CORETECH SYSTEMS CO., LTD.Inventors: Chih-Chung Hsu, Tung-Huan Su, Hsien-Sen Chiu, Chia-Hsiang Hsu, Rong-Yeu Chang
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Publication number: 20190030775Abstract: A molding system comprises a mold, a molding machine, a computing apparatus, and a controller. The computing apparatus is programmed to perform a first simulation to generate a velocity distribution and a temperature distribution of the molding material in a first portion of a simulating domain and a second simulation to generate a melting distribution of the solid decorating film in a second portion of the simulating domain, wherein the simulating domain corresponds to the mold cavity. The first molding simulation is to performed using a molding condition of the molding machine to set a boundary condition of the first portion, and the second molding simulation is performed using the velocity distribution and the temperature distribution of the molding material to set a boundary condition of the second portion.Type: ApplicationFiled: March 6, 2018Publication date: January 31, 2019Inventors: Chih-Chung HSU, Tung-Huan SU, Hsien-Sen CHIU, Chia-Hsiang HSU, Rong-Yeu CHANG
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Patent number: 9684295Abstract: A method for operating a molding machine includes specifying a simulating domain corresponding to a genuine domain in a mold disposed on the molding machine. The method proceeds to perform a virtual molding by using a setting packing pressure profile to generate a simulated state waveform, generating a designed state waveform including an isobaric phase and an isochoric phase while taking into consideration the simulated state waveform, and obtaining an updated packing pressure profile for applying a molding pressure to a portion of the genuine domain while taking into consideration a difference between the simulated state waveform and the designed state waveform. Subsequently, the method proceeds to set the molding machine while taking into consideration the updated packing pressure profile to perform an actual molding by applying an actual molding pressure to the at least a portion of the genuine domain to prepare the molding product.Type: GrantFiled: July 12, 2016Date of Patent: June 20, 2017Assignee: CORETECH SYSTEM CO., LTD.Inventors: Yuing Chang, Chuan Wei Chang, Rong Yeu Chang, Chia Hsiang Hsu, Ching Chang Chien, Hsien Sen Chiu
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Patent number: 9555571Abstract: A method for operating a molding machine includes steps of specifying a simulating domain corresponding to a genuine domain in a mold disposed on the molding machine; performing a virtual molding by using an initial packing pressure profile to generate an initial state waveform expressing a relationship between an in-mold pressure and an in-mold temperature of the molding resin; obtaining an updated packing pressure profile for applying a molding pressure to at least a portion of the genuine domain while taking into consideration the initial state waveform; repeating the virtual molding while taking into consideration the updated packing pressure profile to generate an updated state waveform of the molding resin; and setting the molding machine taking into consideration the updated packing pressure profile to perform an actual molding by applying an actual molding pressure to the at least a portion of the genuine domain to prepare the molding product.Type: GrantFiled: November 5, 2015Date of Patent: January 31, 2017Assignee: CORETECH SYSTEM CO., LTD.Inventors: Yuing Chang, Rong Yeu Chang, Chia Hsiang Hsu, Chuan Wei Chang, Ching Chang Chien, Hsien Sen Chiu
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Publication number: 20170015040Abstract: A method for operating a molding machine includes specifying a simulating domain corresponding to a genuine domain in a mold disposed on the molding machine. The method proceeds to perform a virtual molding by using a setting packing pressure profile to generate a simulated state waveform, generating a designed state waveform including an isobaric phase and an isochoric phase while taking into consideration the simulated state waveform, and obtaining an updated packing pressure profile for applying a molding pressure to a portion of the genuine domain while taking into consideration a difference between the simulated state waveform and the designed state waveform. Subsequently, the method proceeds to set the molding machine while taking into consideration the updated packing pressure profile to perform an actual molding by applying an actual molding pressure to the at least a portion of the genuine domain to prepare the molding product.Type: ApplicationFiled: July 12, 2016Publication date: January 19, 2017Inventors: YUING CHANG, CHUAN WEI CHANG, RONG YEU CHANG, CHIA HSIANG HSU, CHING CHANG CHIEN, HSIEN SEN CHIU
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Computer-implemented simulation method and non-transitory computer medium for use in molding process
Patent number: 9409335Abstract: A molding method includes the steps of specifying a simulating domain having a resin part and a mold part, wherein the simulating domain corresponds to a genuine domain on a molding machine; setting an initial resin temperature of the resin part and an initial mold temperature of the mold part; performing a transient state analysis to calculate a plurality of temperature distributions at different times between the resin part and the mold part; calculating at least one heat transfer coefficient between the resin part and the mold part taking into consideration the plurality of temperature distributions at different times; simulating the molding process of a molding resin that is injected into the simulating domain by using the at least one heat transfer coefficient to generate a plurality of molding conditions; and performing the molding process by using the plurality of molding conditions to the genuine domain on the molding machine.Type: GrantFiled: September 30, 2015Date of Patent: August 9, 2016Assignee: CORETECH SYSTEM CO., LTD.Inventors: Tung Huan Su, Hsien Sen Chiu, Rong Yeu Chang, Chia Hsiang Hsu, Ching Chang Chien, Chih Chung Hsu -
Patent number: 8868389Abstract: A computer-implemented simulation method for use in molding process by a computer processor includes specifying a simulating domain having a mold cavity configured to connect a tube of a molding machine, creating a mesh by dividing at least part of the simulating domain, generating at least one flow parameter of a molding material in the tube, specifying boundary conditions of the mesh by taking into consideration the at least one flow parameter of the molding material, and simulating a molding process of the molding material that is injected into the mold cavity by using the boundary conditions to generate a plurality of molding conditions.Type: GrantFiled: January 16, 2014Date of Patent: October 21, 2014Assignee: Coretech System Co., Ltd.Inventors: Rong Yeu Chang, Chia Hsiang Hsu, Chuan Wei Chang, Hsien Sen Chiu, Chao Tsai Huang
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Publication number: 20140200710Abstract: A computer-implemented simulation method for use in molding process by a computer processor includes specifying a simulating domain having a mold cavity configured to connect a tube of a molding machine, creating a mesh by dividing at least part of the simulating domain, generating at least one flow parameter of a molding material in the tube, specifying boundary conditions of the mesh by taking into consideration the at least one flow parameter of the molding material, and simulating a molding process of the molding material that is injected into the mold cavity by using the boundary conditions to generate a plurality of molding conditions.Type: ApplicationFiled: January 16, 2014Publication date: July 17, 2014Applicant: CORETECH SYSTEM CO., LTD.Inventors: Rong Yeu CHANG, Chia Hsiang HSU, Chuan Wei CHANG, Hsien Sen CHIU, Chao Tsai HUANG
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Patent number: 8768662Abstract: A computer-implemented method and non-transitory computer medium for calculating a shrinkage of a molding product comprises a step of using a computer processor to calculate a molding pressure of a molding fluid in a molding cavity by taking into consideration an increase of a shear viscosity of the molding fluid by a decrease of a shear rate, and a step of calculating the shrinkage of the molding products by taking into consideration a variation of a specific volume of the molding fluid as the molding pressure and a molding temperature decrease.Type: GrantFiled: November 27, 2013Date of Patent: July 1, 2014Assignee: Coretech System Co., Ltd.Inventors: Rong Yeu Chang, Chia Hsiang Hsu, Hsien Sen Chiu, Shih Po Sun, Chen Chieh Wang, Huan Chang Tseng
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Publication number: 20140156237Abstract: A computer-implemented method and non-transitory computer medium for calculating a shrinkage of a molding product comprises a step of using a computer processor to calculate a molding pressure of a molding fluid in a molding cavity by taking into consideration an increase of a shear viscosity of the molding fluid by a decrease of a shear rate, and a step of calculating the shrinkage of the molding products by taking into consideration a variation of a specific volume of the molding fluid as the molding pressure and a molding temperature decrease.Type: ApplicationFiled: November 27, 2013Publication date: June 5, 2014Applicant: CORETECH SYSTEM CO., LTD.Inventors: Rong Yeu CHANG, Chia Hsiang HSU, Hsien Sen CHIU, Shih Po SUN, Chen Chieh WANG, Huan Chang TSENG