Patents by Inventor Hsien-Tang Liu
Hsien-Tang Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9541957Abstract: Adjustable electronic device stand includes a base member defining therein a circular accommodation recess, an adjustment mechanism including an axial rotary table, a rotating component set consisting of a stub rod member, a driving plate, a rotating plate and a position-limit plate for rotatably securing the axial rotary table to the base member and a longitudinal adjustment unit pivotally coupled with a first pivot at one side thereof to the axial rotary table, and an electronic device holder including a mating connection member pivotally coupled to a second pivot at an opposite side of the longitudinal adjustment unit, a supporting platform for holding an electronic device, an electrical connector for the connection of an electrical connector of the loaded electronic device and a retractable clamp for clamping on the loaded electronic device.Type: GrantFiled: November 20, 2015Date of Patent: January 10, 2017Assignee: DATAVAN INTERNATIONAL CORP.Inventors: Hsien-Tang Liu, Kang Ku, Chun-Yi Lee
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Patent number: 8599552Abstract: The present invention relates to a heat radiating structure in all-in-one computers, comprising a pedestal, mainframe module and back cover. The mainframe module is contained in a containing stand behind the pedestal, and a motherboard is included in the containing space in front of a mainframe module base. The motherboard's CPU sticks through a radiator to a heat radiating aluminum plate in the rear of the containing space, while the hard disk drive is close to the heat radiating aluminum plate, and the pedestal is covered by the back cover on the back. With the heat radiating aluminum plate to quickly conduct heat and its multiple heat radiating holes, heat dispersing holes behind the containing stand and hollowed grooves on the back cover to convect hot air.Type: GrantFiled: November 29, 2011Date of Patent: December 3, 2013Assignee: Datavan International Corp.Inventors: Chun-Yi Lee, Hsien-Tang Liu, Kang Ku
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Publication number: 20130135814Abstract: The present invention relates to a heat radiating structure in all-in-one computers, comprising a pedestal, mainframe module and back cover. The mainframe module is contained in a containing stand behind the pedestal, and a motherboard is included in the containing space in front of a mainframe module base. The motherboard's CPU sticks through a radiator to a heat radiating aluminum plate in the rear of the containing space, while the hard disk drive is close to the heat radiating aluminum plate, and the pedestal is covered by the back cover on the back. With the heat radiating aluminum plate to quickly conduct heat and its multiple heat radiating holes, heat dispersing holes behind the containing stand and hollowed grooves on the back cover to convect hot air.Type: ApplicationFiled: November 29, 2011Publication date: May 30, 2013Inventors: Chun-Yi Lee, Hsien-Tang Liu, Kang Ku
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Patent number: 8351194Abstract: A mainframe structure includes a housing having a detachable front cover, and a circuit module accommodated in the housing. The circuit module includes a main circuit board affixed to the back side of the detachable front cover in vertical and carrying first and second electrical connectors, a chip (or chips) and memory devices, a functional circuit board horizontally mounted in the housing at the bottom side and having a first connection port connected to the first electrical connector of the main circuit board, and a display circuit board vertically mounted in the housing at the top side and having a second connection port connected to the second electrical connector of the main circuit board. The detachable design of the circuit module minimizes the sizes of the main circuit board and facilitates maintenance of the main circuit board.Type: GrantFiled: December 29, 2010Date of Patent: January 8, 2013Assignee: Datavan International Corp.Inventors: Kang Ku, Hsien-Tang Liu, Wen-Cheng Liu
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Patent number: 8351212Abstract: A mainframe structure includes a housing having a front opening, flanges on one same plane around the front opening and stop members suspending on the inside corresponding to the flanges, a circuit module accommodated in the housing, and a cover detachably mounted in the front opening of the housing and stopped against the flanges and the stop member. The cover has two slots symmetrically disposed at two opposite lateral sides, two lugs respectively disposed adjacent to the slots and two handles respectively mounted in the slots and pivoted to the lugs in reversed directions. By means of biasing the two handles to stop against respective stop members, the user can detach the cover from the housing conveniently with the hands without any hand tools.Type: GrantFiled: December 29, 2010Date of Patent: January 8, 2013Assignee: Datavan International Corp.Inventors: Kang Ku, Hsien-Tang Liu, Wen-Cheng Liu
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Publication number: 20120170199Abstract: A mainframe structure includes a housing having a detachable front cover, and a circuit module accommodated in the housing. The circuit module includes a main circuit board affixed to the back side of the detachable front cover in vertical and carrying first and second electrical connectors, a chip (or chips) and memory devices, a functional circuit board horizontally mounted in the housing at the bottom side and having a first connection port connected to the first electrical connector of the main circuit board, and a display circuit board vertically mounted in the housing at the top side and having a second connection port connected to the second electrical connector of the main circuit board. The detachable design of the circuit module minimizes the sizes of the main circuit board and facilitates maintenance of the main circuit board.Type: ApplicationFiled: December 29, 2010Publication date: July 5, 2012Inventors: Kang Ku, Hsien-Tang Liu, Wen-Cheng Liu
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Publication number: 20120170233Abstract: A mainframe structure includes a housing having a front opening, flanges on one same plane around the front opening and stop members suspending on the inside corresponding to the flanges, a circuit module accommodated in the housing, and a cover detachably mounted in the front opening of the housing and stopped against the flanges and the stop member. The cover has two slots symmetrically disposed at two opposite lateral sides, two lugs respectively disposed adjacent to the slots and two handles respectively mounted in the slots and pivoted to the lugs in reversed directions. By means of biasing the two handles to stop against respective stop members, the user can detach the cover from the housing conveniently with the hands without any hand tools.Type: ApplicationFiled: December 29, 2010Publication date: July 5, 2012Inventors: Kang KU, Hsien-Tang Liu, Wen-Cheng Liu
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Patent number: 7304835Abstract: A mainframe and power supply arrangement is disclosed to include a mainframe, which has a base frame holding a DC power jack and connector modules, a circuit module, which includes a sliding carrier detachably slidably inserted into the base frame and a circuit board carried on the sliding carrier and having connectors connectable to respective connecting portions of the connector module and a electric power distribution module for distribution of DC power supply received to the DC power jack, and an external power supply unit set outside the mainframe and connectable to the DC power jack for converting AC power supply into DC power supply and providing converted DC power supply to the electric power distribution module.Type: GrantFiled: April 28, 2005Date of Patent: December 4, 2007Assignee: Datavan International Corp.Inventors: Kang Ku, Hsien-Tang Liu, Chia-Yen Hsu
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Publication number: 20060245149Abstract: A mainframe and power supply arrangement is disclosed to include a mainframe, which has a base frame holding a DC power jack and connector modules, a circuit module, which includes a sliding carrier detachably slidably inserted into the base frame and a circuit board carried on the sliding carrier and having connectors connectable to respective connecting portions of the connector module and a electric power distribution module for distribution of DC power supply received to the DC power jack, and an external power supply unit set outside the mainframe and connectable to the DC power jack for converting AC power supply into DC power supply and providing converted DC power supply to the electric power distribution module.Type: ApplicationFiled: April 28, 2005Publication date: November 2, 2006Applicant: DATAVAN INTERNATIONAL CORP.Inventors: Kang Ku, Hsien-Tang Liu, Chia-Yen Hsu
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Publication number: 20060243472Abstract: A mainframe mounting structure is disclosed to include a mainframe body, which has a base frame defining an accommodating chamber, two side panels at two opposite lateral sides of the base frame, a sliding groove at each side panel, and connector modules mounted in the base frame, and a circuit module, which includes a sliding carrier detachably slidably inserted into the sliding grooves at the side panels of the mainframe body and a circuit board carried on the sliding carrier and having connectors connectable to respective connecting portions of the connector modules inside the mainframe body.Type: ApplicationFiled: April 28, 2005Publication date: November 2, 2006Applicant: DATAVAN INTERNATIONAL CORP.Inventors: Kang Ku, Hsien-Tang Liu, Chia-Yen Hsu