Patents by Inventor Hsien Tse CHEN

Hsien Tse CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DETECTING DAMAGED SEMICONDUCTOR WAFERS UTILIZING A SEMICONDUCTOR WAFER SORTER TOOL OF AN AUTOMATED MATERIALS HANDLING SYSTEM
    Publication number: 20230207357
    Abstract: A device may detect a semiconductor wafer to be transferred from a source wafer carrier to a target wafer carrier, and may cause a light source to illuminate the semiconductor wafer. The device may cause a camera to capture images of the semiconductor wafer after the light source illuminates the semiconductor wafer, and may perform image recognition of the images of the semiconductor wafer to determine whether an edge of the semiconductor wafer is damaged. The device may cause the semiconductor wafer to be provided to the source wafer carrier when the edge of the semiconductor wafer is determined to be damaged, and may cause the semiconductor wafer to be provided to the target wafer carrier when the edge of the semiconductor wafer is determined to be undamaged.
    Type: Application
    Filed: March 6, 2023
    Publication date: June 29, 2023
    Inventors: Chen Min LIN, Hsien Tse CHEN
  • Detecting damaged semiconductor wafers utilizing a semiconductor wafer sorter tool of an automated materials handling system
    Patent number: 11600504
    Abstract: A device may detect a semiconductor wafer to be transferred from a source wafer carrier to a target wafer carrier, and may cause a light source to illuminate the semiconductor wafer. The device may cause a camera to capture images of the semiconductor wafer after the light source illuminates the semiconductor wafer, and may perform image recognition of the images of the semiconductor wafer to determine whether an edge of the semiconductor wafer is damaged. The device may cause the semiconductor wafer to be provided to the source wafer carrier when the edge of the semiconductor wafer is determined to be damaged, and may cause the semiconductor wafer to be provided to the target wafer carrier when the edge of the semiconductor wafer is determined to be undamaged.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: March 7, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen Min Lin, Hsien Tse Chen
  • DETECTING DAMAGED SEMICONDUCTOR WAFERS UTILIZING A SEMICONDUCTOR WAFER SORTER TOOL OF AN AUTOMATED MATERIALS HANDLING SYSTEM
    Publication number: 20210407832
    Abstract: A device may detect a semiconductor wafer to be transferred from a source wafer carrier to a target wafer carrier, and may cause a light source to illuminate the semiconductor wafer. The device may cause a camera to capture images of the semiconductor wafer after the light source illuminates the semiconductor wafer, and may perform image recognition of the images of the semiconductor wafer to determine whether an edge of the semiconductor wafer is damaged. The device may cause the semiconductor wafer to be provided to the source wafer carrier when the edge of the semiconductor wafer is determined to be damaged, and may cause the semiconductor wafer to be provided to the target wafer carrier when the edge of the semiconductor wafer is determined to be undamaged.
    Type: Application
    Filed: June 29, 2020
    Publication date: December 30, 2021
    Inventors: Chen Min LIN, Hsien Tse CHEN