Abstract: In some embodiments, the present disclosure relates to an integrated chip structure. The integrated chip structure includes forming a first image sensor element within a first substrate and a second image sensor element within a second substrate. The first image sensor element is configured to generate electrical signals from electromagnetic radiation within a first range of wavelengths and the second image sensor element is configured to generate electrical signals from electromagnetic radiation within a second range of wavelengths. A plurality of deposition processes are performed to form a band-pass filter over the second substrate. The band-pass filter has a plurality of alternating layers of a first material having a first refractive index and a second material having a second refractive index that is less than the first refractive index. The first substrate is bonded to the band-pass filter.

Abstract: In some embodiments, an image sensor is provided. The image sensor includes a photodetector disposed in a semiconductor substrate. A wave guide filter having a substantially planar upper surface is disposed over the photodetector. The wave guide filter includes a light filter disposed in a light filter grid structure. The light filter includes a first material that is translucent and has a first refractive index. The light filter grid structure includes a second material that is translucent and has a second refractive index less than the first refractive index.

Abstract: Various embodiments of the present application are directed to a narrow band filter with high transmission and an image sensor comprising the narrow band filter. In some embodiments, the filter comprises a first distributed Bragg reflector (DBR), a second DBR, a defect layer between the first and second DBRs, and a plurality of columnar structures. The columnar structures extend through the defect layer and have a refractive index different than a refractive index of the defect layer. The first and second DBRs define a low transmission band, and the defect layer defines a high transmission band dividing the low transmission band. The columnar structures shift the high transmission band towards lower or higher wavelengths depending upon a refractive index of the columnar structures and a fill factor of the columnar structures.

Abstract: A light emitting component array substrate includes a temporary storage substrate, a plurality of light emitting components, a plurality of first adhering patterns and a plurality of second adhering patterns. The light emitting components are disposed on the temporary storage substrate. The first adhering patterns and the second adhering patterns are respectively disposed on the light emitting components. A transmittance of each of the first adhering patterns at an operating wavelength is different from a transmittance of at least one portion of each of the second adhering patterns at the operating wavelength, or an adhesion of each of the first adhering patterns at an operating temperature is different from an adhesion of at least one portion of each of the second adhering patterns at the operating temperature.

Abstract: The present disclosure provides a voice coil structure, a method for manufacturing the voice coil structure, and a loudspeaker. The voice coil structure includes a first insulation layer, a first wiring layer, a second insulation layer, at least one second wiring layer, and a third insulation layer. The second insulation layer extends to wiring gaps of the first wiring layer. The third insulation layer extends to wiring gaps of the at least one second wiring layer. Each of the first wiring layer and the at least one second wiring layer has a winding structure. The first wiring layer is electrically connected in series or in parallel with the at least one second wiring layer and forming two output terminals.

Abstract: Various embodiments of the present application are directed to a narrow band filter with high transmission and an image sensor comprising the narrow band filter. In some embodiments, the filter comprises a first distributed Bragg reflector (DBR), a second DBR, a defect layer between the first and second DBRs, and a plurality of columnar structures. The columnar structures extend through the defect layer and have a refractive index different than a refractive index of the defect layer. The first and second DBRs define a low transmission band, and the defect layer defines a high transmission band dividing the low transmission band. The columnar structures shift the high transmission band towards lower or higher wavelengths depending upon a refractive index of the columnar structures and a fill factor of the columnar structures.

Abstract: In some embodiments, the present disclosure relates to an integrated chip structure. The integrated chip structure includes at least one device on a front side of a semiconductor substrate. A plurality of grating layers are under the at least one device. The plurality of grating layers include at least a first material having a first refractive index alternating with a second material having a second refractive index. Contacts extend through an interlevel dielectric material, and further extend through the semiconductor substrate, to directly contact at least one of the first material and the second material below the at least one device and below the semiconductor substrate underlying the interlevel dielectric material.

Abstract: A light emitting element substrate includes a substrate and a light emitting element disposed on the substrate and including first and second semiconductor layers, an active layer, first and second electrodes, and first and second solders. The second semiconductor layer is disposed opposite to the first semiconductor layer. The active layer is disposed between the first and second semiconductor layers. The first and second electrodes are electrically connected to the first and second semiconductor layers respectively. The first and second solders are respectively disposed on and electrically connected to the first and second electrodes respectively. The first electrode includes a first under barrier pattern. The first solder covers the first under barrier pattern. A projection area of the first solder on the substrate is greater than a projection area of the first under barrier pattern on the substrate. A display apparatus is provided.

Abstract: A display apparatus includes a driving backplane and a light emitting component. The driving backplane has a first pad and a second pad. The light emitting component is disposed on the driving backplane. The light emitting component includes a first semiconductor layer, a second semiconductor layer, an active layer, a first electrode, a second electrode, a first solder and a second solder. The first solder and the second solder of the light-emitting component are respectively disposed on the first pad and the second pad of the driving backplane and electrically connected to the first pad and the second pad respectively. A volume of the first solder is larger than a volume of the second solder, and an area of the first pad is smaller than an area of the second pad.

Abstract: Processes and systems for thermoforming articles of wear are disclosed. The process can include utilizing a negative pressure generation system to seal an article in a forming material thereby compressing the forming material onto the outer surface of the article. The process can also include exposing the sealed article to an increased temperature followed by exposure to a decrease temperature, while maintaining the compressive force of the forming material on the outer surface of the article. A positive pressure can also be applied to the sealed article while undergoing the heating and/or cooling steps, which can facilitate the removal of bubbles from the article during thermoforming as well as apply additional compressive force to the outer surface of the article.

Abstract: A sewing machine includes a main body and a quick release needle plate module. The main body includes a base seat having an inner frame, and an outer case that is mounted to the inner frame and that defines an accommodating compartment. The quick release needle plate module includes a catch member, and a needle plate that covers the accommodating compartment, that is detachably pivoted to a rear section of the inner frame, and that engages the catch member. The quick release needle plate module further includes a press member inserted through the outer case and the inner frame, and operable to push the catch member to disengage the catch member. The needle plate has a plate body that covers the accommodating compartment, and a resilient member mounted between the inner frame and the plate body for driving pivot action of the plate body away from the inner frame.

Abstract: A device of mass transferring chips includes a first substrate, which includes a chip-connecting area configured to connect a chip. The device further includes a second substrate, which includes a support layer and a first adhesive layer. The chip is between the first substrate and the second substrate. The first adhesive layer includes a first surface, a second surface, and a patterned recess. The first surface has a chip-receiving area configured to attach the chip from the first substrate. The second surface is opposite to the first surface and is in contact with a first side of the support layer. The patterned recess is disposed on the first surface and spaced apart from the chip-receiving area.

Abstract: An electronic device including an antenna structure and a switching circuit is provided. The antenna structure includes a first radiating element, a second radiating element, a feeding element and a grounding element. The first radiating element incudes a first radiating part and a feeding part. The second radiating element is coupled with the first radiating element, and includes a main body and an arm that is electrically connected to the switching circuit. The feeding element includes a feeding end electrically connected to the feeding part, and a grounding end electrically connected to the grounding element. The antenna structure generates a first operation bandwidth and second operation bandwidth when the switching circuit is switched to a first and second mode, respectively. A central frequency of the first operation bandwidth is different from that of the second operation bandwidth.

Abstract: A display device includes a light emitting element, an adhesive barrier wall and an array substrate. The light emitting element includes a first contact and a second contact disposed on a first surface of the light emitting element. The adhesive barrier wall is disposed on the first surface of the light emitting element and includes a first portion between the first contact and the second contact. The array substrate includes a first pad and a second pad disposed on a second surface of the array substrate. The first contact and the second contact of the light emitting element are respectively connected to the first pad and the second pad.

Abstract: A light emitting diode includes a first semiconductor layer, a second semiconductor layer, a first pad, a second pad, and a protection bump. The first semiconductor layer and the second semiconductor layer are overlapping with each other. An area of a first surface of the first semiconductor layer is larger than an area of a second surface of the second semiconductor layer. The first surface faces the second surface. The first pad is electrically connected to the first semiconductor layer. The second pad is electrically connected to the second semiconductor layer. The protection bump is located between the first pad and the second pad.

Abstract: A device of mass transferring chips includes a first substrate, which includes a first surface with a chip-connecting area configured to attach a chip, a second surface opposite to the first surface, and a patterned recess. The patterned recess is disposed on the first surface or the second surface. A projection of at least a portion of the patterned recess on the first surface is spaced apart from the chip-connecting area. The device further includes a second substrate with a third surface. The third surface has a chip-receiving area configured to attach the chip from the first substrate.

Abstract: A connecting structure includes a flexible flat cable. The flexible flat cable includes a first end portion, a second end portion, a connecting portion, a first pad region, a second pad region and a slot. The connecting portion is connected between the first end portion and the second end portion. The first pad region is disposed on the first end portion. The second pad region is disposed on the second end portion. The slot is formed in the connecting portion. The slot is extended along a length direction of the flexible flat cable. The flexible flat cable is a laminated structure including at least one set of signal trace pattern and at least one shielding structure. The at least one shielding structure correspondingly surrounds the at least one set of signal trace pattern in the connecting portion.

Abstract: The present invention relates to a pixel unit, pixel array and an electronic apparatus having sensing function element and a manufacturing method thereof, wherein the sensing function element be separated manufacturing from a pixel medium module and then coupled to one or more electrodes of the pixel medium module configured to sense, measure and/or compensate the characteristics of one or more mediums of the pixel medium module. The display medium module includes a first electrode, a second electrode and a display medium. The display medium is disposed between the first electrode and the second electrode. The sensing function element is constructed from the active switching element, the transistors of the active switching element could be constructed into a circuit diagram coupled to, the first electrode and the second electrode, and configured to sense, measure and/or compensate the characteristics of the display medium module.

Abstract: An electronic device including an antenna structure and a switching circuit is provided. The antenna structure includes a first radiating element, a second radiating element, a feeding element and a grounding element. The first radiating element incudes a first radiating part and a feeding part. The second radiating element is coupled with the first radiating element, and includes a main body and an arm that is electrically connected to the switching circuit. The feeding element includes a feeding end electrically connected to the feeding part, and a grounding end electrically connected to the grounding element. The antenna structure generates a first operation bandwidth and second operation bandwidth when the switching circuit is switched to a first and second mode, respectively. A central frequency of the first operation bandwidth is different from that of the second operation bandwidth.

Abstract: A display device includes a circuit substrate, a plurality of first pads, a plurality of light-emitting elements, an encapsulation layer and a conductive layer. The plurality of first pads is disposed on the circuit substrate. The plurality of light-emitting elements is disposed above the circuit substrate, and each light-emitting element includes a first electrode, a second electrode, and a light-emitting stack located between the first electrode and the second electrode, wherein the first electrodes of the plurality of light-emitting elements are disposed respectively between the light-emitting stacks of the plurality of light-emitting elements and the circuit substrate and electrically connected to the plurality of first pads respectively. The encapsulation layer is disposed on the circuit substrate and between the light-emitting elements. The conductive layer is disposed at an upper surface of the encapsulation layer and electrically connected to the second electrode.