Patents by Inventor Hsien-Tsung Yeh

Hsien-Tsung Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Injection encapsulating process for a 3D animation cup
    Publication number: 20020145230
    Abstract: An injection encapsulating process for a 3D-animation cup transfers a 3D-animation layer to an inner cup, followed by transfer of a thermal-withstanding protection layer to exterior of said 3D-animation layer, then both layers transferred to the surface of the inner cup before being placed in dies to be encapsulated and become an integrated with an injection molded transparent outer cup.
    Type: Application
    Filed: April 10, 2001
    Publication date: October 10, 2002
    Inventor: Hsien-Tsung Yeh
  • Cup
    Patent number: D520302
    Type: Grant
    Filed: July 27, 2004
    Date of Patent: May 9, 2006
    Inventor: Hsien-Tsung Yeh