Patents by Inventor Hsien-Wei Chiu

Hsien-Wei Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240130657
    Abstract: A physiological sensing device for sensing physiological signal of an organism is provided. The physiological sensing device includes a sensing chip, a coupling sensing electrode and a coupling dielectric stacked layer. The coupling sensing electrode is electrically connected to the sensing chip. The coupling dielectric stacked layer covers the coupling sensing electrode. The coupling dielectric stacked layer is located between the coupling sensing electrode and the organism. The coupling dielectric stacked layer includes a first dielectric layer and a second dielectric layer. The dielectric constant of the second dielectric layer is greater than that of the first dielectric layer. The second dielectric layer is located between the first dielectric layer and the organism.
    Type: Application
    Filed: August 23, 2023
    Publication date: April 25, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Hsien-Wei Chiu, Tai-Jui Wang, Chieh-Wei Feng, Jui-Wen Yang
  • Publication number: 20240088004
    Abstract: A stacked wiring structure includes a first wiring substrate and a second wiring substrate. The first wiring substrate includes a first glass substrate, multiple first conductive through vias penetrating through the first glass substrate, and a first multi-layered redistribution wiring structure disposed on the first glass substrate. The second wiring substrate includes a second glass substrate, multiple second conductive through vias penetrating through the second glass substrate, and a second multi-layered redistribution wiring structure disposed on the second glass substrate. The first conductive through vias are electrically connected to the second conductive through vias. The first glass substrate is spaced apart from the second glass substrate. The first multi-layered redistribution wiring structure is spaced apart from the second multi-layered redistribution wiring structure by the first glass substrate and the second glass substrate.
    Type: Application
    Filed: August 21, 2023
    Publication date: March 14, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Tai-Jui Wang, Jui-Wen Yang, Chieh-Wei Feng, Chih Wei Lu, Hsien-Wei Chiu