Abstract: A package includes a redistribution structure, a die package on a first side of the redistribution structure including a first die connected to a second die by metal-to-metal bonding and dielectric-to-dielectric bonding, a dielectric material over the first die and the second die and surrounding the first die, and a first through via extending through the dielectric material and connected to the first die and a first via of the redistribution structure, a semiconductor device on the first side of the redistribution structure includes a conductive connector, wherein a second via of the redistribution structure contacts the conductive connector of the semiconductor device, a first molding material on the redistribution structure and surrounding the die package and the semiconductor device, and a package through via extending through the first molding material to contact a third via of the redistribution structure.

Abstract: A package includes a corner, a device die, a plurality of redistribution lines underlying the device die, and a plurality of metal pads electrically coupled to the plurality of redistribution lines. The plurality of metal pads includes a corner metal pad closest to the corner, wherein the corner metal pad is a center-facing pad having a bird-beak direction substantially pointing to a center of the package. The plurality of metal pads further includes a metal pad farther away from the corner than the corner metal pad, wherein the metal pad is a non-center-facing pad having a bird-beak direction pointing away from the center of the package.

Abstract: A method of forming an integrated circuit (IC) package with improved performance and reliability is disclosed. The method includes forming a singulated IC die, coupling the singulated IC die to a carrier substrate, and forming a routing structure. The singulated IC die has a conductive via and the conductive via has a peripheral edge. The routing structure has a conductive structure coupled to the conductive via. The routing structure further includes a cap region overlapping an area of the conductive via, a routing region having a first width from a top-down view, and an intermediate region having a second width from the top-down view along the peripheral edge of the conductive via. The intermediate region is arranged to couple the cap region to the routing region and the second width is greater than the first width.

Abstract: A semiconductor package including one or more dam structures and the method of forming are provided. A semiconductor package may include an interposer, a semiconductor die bonded to a first side of the interposer, an encapsulant on the first side of the interposer encircling the semiconductor die, a substrate bonded to the a second side of the interposer, an underfill between the interposer and the substrate, and one or more of dam structures on the substrate. The one or more dam structures may be disposed adjacent respective corners of the interposer and may be in direct contact with the underfill. The coefficient of thermal expansion of the one or more of dam structures may be smaller than the coefficient of thermal expansion of the underfill.

Abstract: Polypeptide are disclosed that comprise an amino acid sequence at least 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98%, 99%, or 100% identical to the amino acid sequence selected from the group consisting of SEQ ID NO:1-1615, not including any functional domains added fused to the protein (whether N-terminal, C-terminal, or internal), and wherein the 1, 2, 3, 4, or 5 N-terminal and/or C-terminal amino acid residues may be present or absent when considering the percent identity.

Abstract: The disclosure provides cage proteins comprising a helical bundle, wherein the cage protein comprises a structural region and a latch region, wherein the latch region comprises one or more target binding polypeptide, wherein the cage protein further comprises a first reporter protein domain, wherein the first reporter protein domain undergoes a detectable change in reporting activity when bound to a second split reporter protein domain, and wherein the structural region interacts with the latch region to prevent solution access to the one or more target binding polypeptide.

Abstract: Provided herein are chemically modified luciferase substrates for spectrally shifted emission and enhanced water solubility. Provided herein are engineered luciferases. Moreover, provided herein are new ATP-independent bioluminescent reporters which have improved biochemical and photophysical properties and are expected to have broad applications.

Abstract: A bioluminescent protein is provided that includes a substituted luciferase polypeptide having amino acid substitutions at positions 21 and 166, and with one or more additional amino acid substitutions at positions 3, 16, 20, 29, 30, 71, 87, 114, and 144, compared to the parent polypeptide. Also provided is a luciferin that has a selenium-containing group at position C8 of an imidazopyrazine backbone, and methods of making the luciferin. In addition, nucleic acids encoding the bioluminescent protein, cells expressing the bioluminescent protein, and reactions between the bioluminescent protein and luciferin substrates are also provided. Fusions between the substituted luciferase polypeptide and a fluorescent protein are also provided for bioluminescence resonance energy transfer based reporters.

Abstract: A bioluminescent protein is provided that includes a substituted luciferase polypeptide having amino acid substitutions at positions 21 and 166, and with one or more additional amino acid substitutions at positions 3, 16, 20, 29, 30, 71, 87, 114, and 144, compared to the parent polypeptide. Also provided is a luciferin that has a selenium-containing group at position C8 of an imidazopyrazine backbone, and methods of making the luciferin. In addition, nucleic acids encoding the bioluminescent protein, cells expressing the bioluminescent protein, and reactions between the bioluminescent protein and luciferin substrates are also provided. Fusions between the substituted luciferase polypeptide and a fluorescent protein are also provided for bioluminescence resonance energy transfer based reporters.