Abstract: A device includes first to third power/ground (PG) elements; a first set of at least three tracks between the first and second PG elements and a second set of at least three tracks between the second and third PG elements, the tracks being arranged in equal numbers between the first and second PG and second and third PG elements; a first row of cells overlapping the first set; and a second row of cells overlapping the second set. In the first row of cells, a first cell has a first height and a second cell has a greater height than the first height; in the second row of cells, a third cell has the first height and a fourth cell has a lesser height less than the first height; and a track configured as an in-cell PG track is aligned with a boundary of the second and fourth cells.

Abstract: An X-ray measurement system with high signal resolution is provided. The X-ray measurement system includes an X-ray generator, an X-ray optical element group, a multi-dimensional X-ray detector and a processing device. The X-ray generator is configured to generate an incident X-ray beam. X-ray optics are used to guide the incident X-ray beam to a to-be-tested sample. The multi-dimensional X-ray detector is used to receive the measurement X-ray generated by irradiating the incident X-ray beam on the to-be-tested sample. The multi-dimensional X-ray detector includes an insulation layer, a plurality of first electrode layers, a photodiode layer, an X-ray conversion material layer made of amorphous selenium, and a second electrode layer. The processing device is configured to collect a to-be-tested X-ray signal and generate a plurality of measurement results that include a plurality of mode signals of different orders.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip structure. The integrated chip structure includes a first substrate having a first horizontally extending surface and a second horizontally extending surface above the first horizontally extending surface as viewed in a cross-sectional view. The first horizontally extending surface continuously wraps around an outermost perimeter of the second horizontally extending surface in a closed loop as viewed in a plan-view. A second substrate is disposed over the first substrate and includes a third horizontally extending surface above the second horizontally extending surface as viewed in the cross-sectional view. The second horizontally extending surface continuously wraps around an outermost perimeter of the third horizontally extending surface in a closed loop as viewed in the plan-view.

Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a plurality of conductive interconnects arranged within a dielectric structure having a plurality of inter-level dielectric (ILD) layers stacked onto one another. A heat pipe vertically extends through the plurality of ILD layers. A high thermal conductivity layer is sandwiched between neighboring ones of the plurality of ILD layers. The high thermal conductivity layer laterally extends from over one or more of the plurality of conductive interconnects to the heat pipe.

Abstract: The invention provides a layout pattern of static random-access memory (SRAM), which comprises a substrate, wherein a plurality of diffusion regions and a plurality of gate structures are located on the substrate to form a plurality of transistors, wherein the plurality of gate structures comprise a first gate structure, which has a stepped shape when viewed from a top view, and the first gate structure spans a first diffusion region and a second diffusion region to form a first access transistor (PG1), wherein the first diffusion region is adjacent to and in direct contact with the second diffusion region.

Abstract: A multi-chip integrated package design system includes a model analysis, a 3D model analysis and an electrical simulation. The model analysis obtains a pin connection mode of the designed circuit according to a designed circuit, obtains at least one conductive layer of the designed circuit according to a layer stackup, selects a transmission line model that meets the pin connection mode and at least one conductive layer, substitutes the layer stackup and a design rule into the selected transmission line model to generate an equivalent circuit, generates a corresponding relationship according to the equivalent circuit, and obtains the transmission line length corresponding to a parameter design target according to the corresponding relationship. The 3D model analysis constructs a 3D model of the designed circuit according to the obtained the transmission line length. The electrical simulation determines whether the characteristic parameter of the 3D model meets the parameter design target.

Abstract: A multi-chamber semiconductor manufacturing system is provided, including: a base, a plurality of processing units and a transfer unit. The base includes a main body and a plurality of supporting frames protrudingly disposed on a mounting surface of the main body. The plurality of processing units are connected to the plurality of supporting frames. The transfer unit is connected to the plurality of supporting frames and located between the plurality of processing units. The transfer unit is configured to transfer a substrate between the plurality of processing units. An aspect ratio value of the base is between 1 and 3.

Abstract: An electronic device for assisting driver in recording images is introduced. In the electronic device, a panoramic camera unit is installed on a transportation vehicle to capture an initial video. A positioning unit detects a real-time location of the transportation vehicle. A database stores scenic spot information including multiple scenic spot locations. An intelligence processing unit receives the initial video and uses artificial intelligence to identify a user's image and an image of the scenic spot to be locked at the scenic spot location. The intelligence processing unit receives the real-time location and determines the direction of travel. The intelligence processing unit reads the scenic spot information and determines a viewing range of the transportation vehicle entering the scenic spot location based on the real-time location and the direction of travel to capture a time period within the viewing range from the initial video and crop a recorded video.

Abstract: A smart display device displaying an appearance of a transportation vehicle comprises a display element, a user interface, and a smart display device. The display element is located in multiple regions along a contour of a vehicle body. The user interface includes a status display region and a function display region, a user defines electronic display contents in the function display region according to preferences, and previews the electronic display contents in the status display region. The electronic display contents include a background and text and/or patterns displayed on the background. The smart display device determines the electronic display contents according to the operation of the user interface to display the electronic display contents on the display element in real-time. The invention also provides a setting method, a method of use, and a non-transitory computer-readable recording medium thereof.

Abstract: The present application relates to the technical field of servers. Provided are a server cabinet and a server. The server cabinet includes: a base; a hard disk frame arranged in the base, wherein the hard disk frame is provided with a first surface, which is provided with a first through hole; a first adjustment assembly, wherein the first adjustment assembly is provided with a first supporting leg, and the first supporting leg is located above the first through hole; a first moving plate, wherein the first moving plate is stacked above the first adjustment assembly and slide along the first adjustment assembly; In a condition that the first moving plate slides along the first adjustment assembly, the first moving plate can press the first adjustment assembly, such that the first supporting legs of the first adjustment assembly penetrate the first through hole to extend into the hard disk frame.

Abstract: An electronic device includes a logic body, a heat dissipation fin, and a rotating bracket. The logic body has multiple first end openings and multiple first bottom openings. The first end openings are disposed on a first end of the logic body. The first bottom openings are disposed on a bottom of the logic body and are adjacent to the first end. The heat dissipation fins are disposed inside an interior of the logic body and correspond to the first bottom openings. The rotating bracket is rotatably disposed at the bottom. In a closed mode, the rotating bracket is close to the bottom and covers the first bottom openings. In an open mode, the rotating bracket is unfolded from the bottom and exposes the first bottom openings.

Abstract: A memory device and method of making the same, the memory device including bit lines disposed on a substrate; memory cells disposed on the bit lines; a first dielectric layer disposed on the substrate, surrounding the bit lines and the memory cells; a second dielectric layer disposed on the first dielectric layer; thin film transistors (TFTs) embedded in the second dielectric layer and configured to selectively provide electric power to corresponding memory cells, the TFTs comprising drain lines disposed on the memory cells, source lines disposed on the first dielectric layer, and selector layers electrically connected to the source lines and the drain lines; and word lines disposed on the second dielectric layer and electrically connected to the TFTs.

Abstract: The present disclosure provides a memory device, a semiconductor device, and a method of operating a memory device. A memory device includes a memory cell, a bit line, a word line, a select transistor, a fuse element, and a heater. The bit line is connected to the memory cell. The word line is connected to the memory cell. The select transistor is disposed in the memory cell. A gate of the select transistor is connected to the word line. The fuse element is disposed in the memory cell. The fuse element is connected to the bit line and the select transistor. The heater is configured to heat the fuse element.

Abstract: A method of semiconductor fabrication includes forming a plurality of mandrel recesses in a mandrel layer over a hard mask layer, performing a first patterning process on a spacer layer that is deposited over the mandrel layer to form a first opening pattern, performing a second patterning process to etch portions of the mandrel layer to form a second opening pattern, performing a third patterning process to form a third opening pattern in the hard mask layer based on the first opening pattern and the second opening pattern, and forming, through the hard mask layer, metal lines that are in a semiconductor layer under the hard mask layer and that are arranged in a pattern which corresponds to the third opening pattern.

Abstract: An electric power-assist bicycle and an electric energy management method for the electric power-assist bicycle are provided. The electric power-assist bicycle includes a crank, a motor, a battery module, and a computing circuit. The crank is applied with a pedaling force to provide a plurality of pedaling powers to the electric power-assist bicycle. The battery module provides a plurality of battery powers to the motor. The computing circuit obtains a plurality of total demand powers and a plurality of total demand current values of the electric power-assist bicycle and obtains a plurality of distribution ratios between the battery powers and the pedaling powers. The computing circuit establishes a target function according to the total demand powers, the total demand current values, and the distribution ratios. The computing circuit obtains a target total input power according to a current pedaling power and the target function.

Abstract: In some embodiments, an image sensor is provided. The image sensor includes a photodetector disposed in a semiconductor substrate. A wave guide filter having a substantially planar upper surface is disposed over the photodetector. The wave guide filter includes a light filter disposed in a light filter grid structure. The light filter includes a first material that is translucent and has a first refractive index. The light filter grid structure includes a second material that is translucent and has a second refractive index less than the first refractive index.

Abstract: In some embodiments, the present disclosure relates to an integrated chip structure. The integrated chip structure includes forming a first image sensor element within a first substrate and a second image sensor element within a second substrate. The first image sensor element is configured to generate electrical signals from electromagnetic radiation within a first range of wavelengths and the second image sensor element is configured to generate electrical signals from electromagnetic radiation within a second range of wavelengths. A plurality of deposition processes are performed to form a band-pass filter over the second substrate. The band-pass filter has a plurality of alternating layers of a first material having a first refractive index and a second material having a second refractive index that is less than the first refractive index. The first substrate is bonded to the band-pass filter.

Abstract: A light source module is provided, including: a light board, including a substrate, and a plurality of light-emitting elements arranged at intervals on the substrate; and a separator, located above the substrate, and including a plurality of first ribs, where the plurality of first ribs is cross-connected to form a plurality of interval spaces, to accommodate the light-emitting elements, the first rib forming the interval space has an inner wall, a part of the inner wall in a direction closer to the substrate tapers in a direction far away from the interval space, the inner wall has a first distance farther away from the substrate in a Z-axis direction and has a second distance closer to the substrate, and a projection relationship between the second distance and the first distance onto an XY plane is that the second distance is greater than the first distance.